أفران إعادة التدفق
We provide reflow oven for all types of PCBA assembly, from prototyping to high-volume. Accurate, high quality full convection reflow oven for PCBA electronics assembly
S&M Reflow Soldering Solutions (VS Series)
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High-density, complex devices like smartphones and wearables using fine-pitch components (BGA, 0201/01005). Requires precise thermal control.
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12 Zones, Nitrogen (N2). Vacuum
Home Appliances
Cost-sensitive products like washing machines or air conditioners. Simple components, low-density boards, and high-volume production.
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6-8 Zones, Air.
LED Smart Display
Focus on Mini/Micro LEDs and long boards (e.g., >1.2m). Challenges include board warpage and soldering consistency.
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10 Zones, Nitrogen
صناعة أشباه الموصلات
Primarily focused on advanced packaging (e.g., SiP, PoP) and flux cleaning. Involves extremely high precision and reliability
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12+ Zones, Nitrogen (N2) or Vacuum
صناعة إلكترونيات السيارات
Extreme reliability and zero-defect tolerance. Must withstand harsh temperatures and vibration. Very low voiding (<5-10%) is critical.
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12 Zones, Vacuum
Medical Device
High reliability and long life-cycle are paramount (e.g., pacemakers, monitoring equipment). Process control must be strict and repeatable
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Nitrogen (N2). Vacuum
الصناعات العسكرية والفضائية
The highest reliability standard. Must perform in extreme environments. Failure is not an option. Void control is extremely critical.
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12+ Zones，Vacuum
Server / Base Station / Power Supply
Thick PCBs, large thermal mass components (large BGAs, power modules). Requires high thermal capacity and low voids for heat dissipation. |
10-Zones，Nitrogen
General consumer electronics
General products like toys, remote controls, or standard audio. Cost-driven, simple components, and high throughput.
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8 Zones, Air.
Understanding the Heart of SMT
A reflow oven is a key machine in the Surface Mount Technology (SMT) line. Its primary job is to use a precise heating and cooling sequence, known as a “thermal profile,” to melt solder paste. This process creates strong, reliable electrical bonds between electronic components and the Printed Circuit Board (PCB).
The Four Critical Stages of the Reflow Soldering Profile
This thermal profile is divided into four distinct zones, each with a specific function.
1. Preheat Zone
- Purpose: Gradually raises the assembly’s temperature.
- Key Actions:
- Prevents thermal shock (cracking) to sensitive components.
- Safely evaporates volatile solvents from the solder paste.
2. Soak (Thermal Stabilization) Zone
- Purpose: Equalizes the temperature across the entire board.
- Key Actions:
- Ensures large and small components reach a uniform temperature.
- Activates the flux, which cleans the surfaces for soldering.
Learn More: دليل متعمق لملف إعادة التدفق الجانبي
3. Reflow (Time Above Liquidus) Zone
- Purpose: The peak temperature stage where soldering happens.
- Key Actions:
- The oven temperature rises above the solder’s melting point.
- Molten solder “wets” the component leads and PCB pads, forming the permanent joint.
Learn More: How to Set a Reflow Oven Temperature Profile for Better Soldering
4. Cooling Zone
- Purpose: Rapidly and in a controlled manner, cools the assembly to solidify the solder.
- Key Actions:
- A fast cooling rate (e.g., 3-6°C per second) is critical for a strong, fine-grain joint structure.
- S&M ovens use high-efficiency top and bottom convection for optimal cooling.
Learn More: دليل شامل لمنطقة التبريد بفرن إعادة التدفق السريع
The reflow oven is a critical piece of equipment in the modern electronics manufacturing (SMT) process.
Its core function is to create reliable electrical interconnections. Through a precisely controlled heating process, it melts the solder paste previously applied to the PCB pads, securely welding the pins or terminals of the surface-mounted components to the PCB.A standard reflow process is typically divided into four key stages: the Preheat Zone, Soak Zone (or Heating Zone), Reflow Zone (or Welding Zone), and Cooling Zone. S&M Chuxin’s VS Series reflow ovens are engineered to ensure every solder joint is perfect and reliable through superior thermal uniformity, efficient heat compensation, and intelligent temperature control
Core technologies and design details
Reflow Oven Performance
Verified Performance: Data-Backed Reliability
We don’t just claim high performance; we prove it. Our VS Series reflow ovens undergo rigorous testing to ensure they meet and exceed the most demanding international standards. The following data is taken directly from our comprehensive test reports, demonstrating the stability, accuracy, and uniformity you can expect from every S&M machine.
Exceptional Thermal Accuracy & Uniformity
The key to a zero-defect soldering process is ensuring the entire board—from edge to center, front to back—heats at the same rate. Our ovens are engineered for outstanding thermal uniformity, providing a stable and consistent process window.
- Temperature Control Accuracy: Our system maintains a precise temperature accuracy of±1°C.
- Lateral Thermal Difference (Heat Uniformity): While the industry standard for temperature variation across the PCB is ±2°C, our ovens are built to a tighter standard off ±5°C
- Actual Test Results: In real-world tests, our ovens show outstanding uniformity, with a maximum lateral temperature difference of only 75°C 4and achieving results as low as 1.0°C5.
Maximum temperature—Peak Temp | ||||||
Thermocouple | Orbit | Sample Size | Max | Min | Ave | Max-Min |
1 | 1 | 20 | 246.71 | 245.73 | 246.18 | 0.98 |
2 | 20 | 246.77 | 245.81 | 246.35 | 0.96 | |
2 | 1 | 20 | 246.51 | 245.39 | 246.02 | 1.12 |
2 | 25 | 246.73 | 245.66 | 246.73 | 1.07 | |
3 | 1 | 20 | 246.78 | 245.77 | 246.21 | 1.01 |
2 | 20 | 246.90 | 245.99 | 246.49 | 0.91 | |
4 | 1 | 20 | 246.11 | 244.95 | 245.69 | 1.16 |
2 | 20 | 246.40 | 245.11 | 245.88 | 1.29 | |
5 | 1 | 20 | 246.87 | 245.12 | 245.83 | 1.75 |
2 | 20 | 246.99 | 245.51 | 246.39 | 1.48 | |
Superior Thermal Compensation (Empty vs. Full Load)
A common process failure is “load effect,” where the oven’s temperature drops as it absorbs the thermal load of a board. Our ovens feature powerful thermal compensation to maintain a stable profile, whether the oven is empty or running at full capacity.
- Our Standard: The temperature difference between an empty oven and a fully loaded oven must be less than ±2°C
- Actual Test Results: Tests confirm our ovens easily meet this, with a measured maximum temperature difference of only 28°C. Your process profile remains stable from the first board of the day to the last.
Ultra-Stable, Low-Vibration Transport System
To prevent component shift, skew, or “tombstoning,” the conveyor system must be perfectly smooth and vibration-free. Our VS Series demonstrates stability that is significantly better than the international standard, protecting even the smallest and most sensitive components.
- Industry Standard: $< 1g of vibration8.
- High-End International Standard: $< 0.05g of vibration9.
- Actual Test Results: Our transport system measures an exceptionally low 036g of vibration, ensuring your components stay exactly where they were placed
Dwell Time | |||||
Thermocouple | Orbit | Sample Size | Max | Min | Ave |
1 | 1 | 20 | 69.41 | 64.96 | 67.57 |
2 | 20 | 71.34 | 65.45 | 69.03 | |
2 | 1 | 20 | 71.04 | 66.86 | 69.78 |
2 | 20 | 71.80 | 68.25 | 70.58 | |
3 | 1 | 20 | 72.41 | 69.45 | 71.61 |
2 | 20 | 73.41 | 70.79 | 72.33 | |
4 | 1 | 20 | 70.44 | 66.04 | 68.90 |
2 | 20 | 71.52 | 66.59 | 69.70 | |
5 | 1 | 20 | 73.40 | 70.14 | 71.95 |
2 | 20 | 72.17 | 67.87 | 70.98 | |
الجانب التقني
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