Vyladění procesu pájení vlnou a řešení běžných vad
Wave Soldering Process setup tips and solutions for common defects. Tune parameters, reduce bridging, and boost PCB assembly quality with proven methods.
SMT equipment
5 způsobů, jak zlepšit kvalitu pájení vlnou
Improve Wave Soldering quality with five proven methods for fewer defects, stronger joints, and higher first-pass yield in PCB assembly.
Význam a optimalizace chladicích systémů přetavovací pece
Optimizing reflow soldering cooling systems ensures strong solder joints, prevents defects, and boosts PCB reliability with controlled cooling methods.
Kolik dusíku se používá v přetavovací peci
Nitrogen usage in reflow ovens typically ranges from 18–30 m³/hr, maintaining low oxygen levels to reduce oxidation and improve solder joint quality.
Pájení vlnou vs. přetavování: Který z nich je pro vaši výrobu vhodnější?
Wave soldering suits high-volume through-hole boards, while reflow excels with complex, high-density SMT designs. Choose based on your production needs.
Pájení vlnou vs. selektivní pájení vlnou Výběr správné metody pro vaši DPS
Comparing Wave and Selective Wave Soldering Methods Explore key differences to choose the best PCB soldering method. Features Wave Soldering
Jak vybrat správný pájecí stroj pro vaši výrobní linku
Select the ideal wave soldering machine by evaluating PCB size, production volume, component types, and automation needs for your assembly line.
What Size Reflow Oven is Best for Your PCB Volume
Select the ideal reflow oven size for your PCB volume by matching oven zones and capacity to your board size, production needs, and future growth.
Why nitrogen is necessary in reflow ovens
Nitrogen in a reflow oven reduces oxidation, improves solder joint quality, and lowers defects, making it essential for reliable electronics manufacturing.
Buying SMT Equipment: Process, Pitfalls, and Tips
Buying SMT equipment? Learn the process, avoid common pitfalls, and get expert tips to choose the right SMT equipment for your production needs.