{"id":2934,"date":"2025-09-04T09:53:31","date_gmt":"2025-09-04T01:53:31","guid":{"rendered":"https:\/\/www.chuxin-smt.com\/set-reflow-oven-temperature-profile-for-better-soldering\/"},"modified":"2026-07-28T19:01:29","modified_gmt":"2026-07-28T11:01:29","slug":"set-reflow-oven-temperature-profile-for-better-soldering","status":"publish","type":"post","link":"https:\/\/www.chuxin-smt.com\/cs\/set-reflow-oven-temperature-profile-for-better-soldering\/","title":{"rendered":"Jak nastavit teplotn\u00ed profil p\u0159etavovac\u00ed pece pro lep\u0161\u00ed p\u00e1jen\u00ed"},"content":{"rendered":"<p><figure class=\"wp-block-image alignnone\"><img decoding=\"async\" src=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/09\/1756950802-a5cbf11da2af4d5fbc5fc8fdbd4a7bd5-scaled.jpg\" alt=\"How to Set a Reflow Oven Temperature Profile for Better Soldering\" ><\/figure>\n<\/p>\n<p>Teplotn\u00ed profil p\u0159etavovac\u00ed pece mus\u00edte nastavit tak, \u017ee pochop\u00edte svou desku plo\u0161n\u00fdch spoj\u016f, zvol\u00edte spr\u00e1vn\u00fd typ p\u00e1jky a nastav\u00edte pec v n\u011bkolika \u0159\u00edzen\u00fdch stupn\u00edch. P\u0159esn\u00e9 \u0159\u00edzen\u00ed teploty vede k pevn\u00fdm p\u00e1jec\u00edm spoj\u016fm a men\u0161\u00edmu po\u010dtu vad. P\u0159esn\u00e9 profilov\u00e1n\u00ed udr\u017euje p\u00e1jku nad <a href=\"https:\/\/blog.ltpcba.com\/reflow-oven-temperature-measurement-smt-soldering-quality\/\">183\u00b0C<\/a> dostate\u010dn\u011b dlouho, aby se vytvo\u0159ila pevn\u00e1 vrstva slitiny. Chlazen\u00ed spr\u00e1vnou rychlost\u00ed - mezi 1 \u00b0C a 6 \u00b0C za sekundu - zabra\u0148uje vzniku trhlin nebo koroze, co\u017e zvy\u0161uje spolehlivost i v\u00fdt\u011b\u017enost v\u00fdrobk\u016f.<\/p>\n<ul>\n<li>V okol\u00ed <a href=\"https:\/\/www.smtfactory.com\/why-your-reflow-oven-may-be-causing-soldering-defects\">30% vad p\u00e1jen\u00ed<\/a> ve v\u00fdrob\u011b elektroniky poch\u00e1zej\u00ed z nespr\u00e1vn\u00e9ho p\u00e1jen\u00ed p\u0159etaven\u00edm nebo z nekvalitn\u00edch surovin, co\u017e zahrnuje i chyby v teplotn\u00edch profilech p\u0159etavovac\u00edch pec\u00ed.<\/li>\n<\/ul>\n<h2 id=\"keytakeaways\">Kl\u00ed\u010dov\u00e9 poznatky<\/h2>\n<ul>\n<li>Pe\u010dliv\u011b nastavte teplotn\u00ed profil p\u0159etavovac\u00ed pece na <a href=\"https:\/\/www.chuxin-smt.com\/cs\/improve-wave-soldering-quality-5-effective-methods\/\">dosa\u017een\u00ed pevn\u00fdch p\u00e1jec\u00edch spoj\u016f<\/a> a sn\u00ed\u017eit po\u010det z\u00e1vad. P\u0159esn\u00e9 profilov\u00e1n\u00ed vede k vy\u0161\u0161\u00ed spolehlivosti v\u00fdrobk\u016f.<\/li>\n<li>Sledujte a upravujte rychlost n\u00e1b\u011bhu a dobu nam\u00e1\u010den\u00ed pro optimalizaci kvality p\u00e1jec\u00edho spoje. To pom\u00e1h\u00e1 minimalizovat probl\u00e9my a zlep\u0161uje celkovou v\u00fdt\u011b\u017enost.<\/li>\n<li>P\u0159ed nastaven\u00edm profilu ur\u010dete materi\u00e1l desky plo\u0161n\u00fdch spoj\u016f a typ p\u00e1jky. Shoda t\u011bchto komponent\u016f zajist\u00ed spolehliv\u00e9 p\u00e1jen\u00ed a zabr\u00e1n\u00ed vzniku vad.<\/li>\n<li>Prove\u010fte testovac\u00ed profil s termo\u010dl\u00e1nky pro ov\u011b\u0159en\u00ed p\u0159esnosti teploty. Tento krok v\u00e1m pom\u016f\u017ee odhalit hork\u00e1 nebo studen\u00e1 m\u00edsta a upravit nastaven\u00ed pro rovnom\u011brn\u00fd oh\u0159ev.<\/li>\n<li><a href=\"https:\/\/www.chuxin-smt.com\/cs\/reflow-soldering-cooling-system-importance-optimization\/\">Pravideln\u00e1 \u00fadr\u017eba p\u0159etavovac\u00ed pece<\/a> aby byl zaji\u0161t\u011bn konzistentn\u00ed v\u00fdkon. \u010ci\u0161t\u011bn\u00ed a kalibrace pece zabra\u0148uje vzniku z\u00e1vad a zlep\u0161uje kvalitu p\u00e1jen\u00ed.<\/li>\n<\/ul>\n<h2 id=\"profilingimportance\">V\u00fdznam profilov\u00e1n\u00ed<\/h2>\n<h3 id=\"solderjointquality\">Kvalita p\u00e1jec\u00edch spoj\u016f<\/h3>\n<p>Mus\u00edte v\u011bnovat velkou pozornost sv\u00fdm <a href=\"https:\/\/www.chuxin-smt.com\/cs\/reflow-soldering-cooling-system-importance-optimization\/\">teplotn\u00ed profil p\u0159etavovac\u00ed pece<\/a> k dosa\u017een\u00ed pevn\u00fdch a spolehliv\u00fdch p\u00e1jec\u00edch spoj\u016f. P\u0159i pou\u017eit\u00ed metod zalo\u017een\u00fdch na datech, jako je <a href=\"https:\/\/www.sciencedirect.com\/science\/article\/abs\/pii\/S0957417411016435\">Statistick\u00e9 \u0159\u00edzen\u00ed proces\u016f<\/a> (SPC), m\u016f\u017eete optimalizovat sv\u016fj proces a sn\u00ed\u017eit po\u010det vad. \u00daprava rychlosti n\u00e1b\u011bhu a doby nam\u00e1\u010den\u00ed v\u00e1m pom\u016f\u017ee zlep\u0161it v\u00fdt\u011b\u017enost a minimalizovat probl\u00e9my. N\u00e1sleduj\u00edc\u00ed tabulka ukazuje, jak tyto strategie ovliv\u0148uj\u00ed kvalitu p\u00e1jec\u00edch spoj\u016f:<\/p>\n<p>| Evidence Type                  | Description                                                                                                                                                                            |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212; | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8211; |<br \/>\n| Statistical Process Control    | Utilizes data-driven approaches to optimize reflow profiles, impacting <a href=\"https:\/\/www.chuxin-smt.com\/cs\/development-history-reflow-ovens-innovations-future-trends\/\">kvalita p\u00e1jec\u00edch spoj\u016f<\/a>. |<br \/>\n| Thermal Profile Adjustments    | Specific changes in ramp rates and soak times reduce defects and enhance yield.                                                                                                        |<br \/>\n| Soldering Failure Distribution | Identifies that improper reflow soldering accounts for 30% of defects, highlighting the importance of profiling.                                                                       |<\/p>\n<p>Spr\u00e1vn\u011b nastaven\u00fd teplotn\u00ed profil p\u0159etavovac\u00ed pece <a href=\"https:\/\/electronics.stackexchange.com\/questions\/17683\/smt-solder-reflow-temperature-profile\">sni\u017euje m\u00edru defekt\u016f<\/a> ve srovn\u00e1n\u00ed s ru\u010dn\u00edm p\u00e1jen\u00edm. Automatizovan\u00e9 p\u00e1jen\u00ed p\u0159etaven\u00edm tak\u00e9 zvy\u0161uje propustnost, co\u017e je v\u00fdhodn\u00e9 pro v\u00fdrobce. M\u016f\u017eete u\u0161et\u0159it \u010das a pen\u00edze t\u00edm, \u017ee sn\u00ed\u017e\u00edte po\u010det p\u0159epracov\u00e1n\u00ed a zmetk\u016f. Hobbyist\u00e9 mo\u017en\u00e1 nepot\u0159ebuj\u00ed stejnou \u00farove\u0148 p\u0159esnosti, ale i tak z\u00edsk\u00e1te lep\u0161\u00ed v\u00fdsledky s \u0159\u00edzen\u00fdm profilem.<\/p>\n<blockquote>\n<p>P\u0159esko\u010den\u00ed procesu profilov\u00e1n\u00ed m\u016f\u017ee zp\u016fsobit <a href=\"https:\/\/kicthermal.com\/article-paper\/the-effect-of-reflow-profiling-on-the-electrical-reliability-of-no-clean-solder-paste-flux-residues\/\">nedostate\u010dn\u00fd oh\u0159ev p\u00e1jec\u00ed pasty<\/a>. To vede ke \u0161patn\u00e9mu izola\u010dn\u00edmu odporu povrchu a nespolehliv\u00fdm p\u00e1jec\u00edm spoj\u016fm. Nevy\u010di\u0161t\u011bn\u00e9 zbytky tavidla p\u00e1jec\u00ed pasty se nemus\u00ed spr\u00e1vn\u011b rozlo\u017eit, co\u017e m\u016f\u017ee v\u00e9st k probl\u00e9m\u016fm s elektrickou spolehlivost\u00ed.<\/p>\n<\/blockquote>\n<h3 id=\"commonissues\">B\u011b\u017en\u00e9 probl\u00e9my<\/h3>\n<p>Pokud nenastav\u00edte spr\u00e1vn\u011b teplotn\u00ed profil p\u0159etavovac\u00ed pece, m\u016f\u017eete se setkat s n\u011bkolika z\u00e1vadami. N\u00ed\u017ee uveden\u00e1 tabulka uv\u00e1d\u00ed <a href=\"https:\/\/www.protoexpress.com\/blog\/common-errors-surface-mount-technology-smt\/\">b\u011b\u017en\u00e9 probl\u00e9my s p\u00e1jen\u00edm<\/a> a jejich p\u0159\u00ed\u010diny:<\/p>\n<p>| Soldering Defect           | Description                                                     | Potential Causes                                                                                         |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8211; | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212; | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8211; |<br \/>\n| Tombstoning                | A component stands upright due to uneven heating during reflow. | Uneven heating, unequal heat sinks, insufficient solder paste force, excess movement, unequal placement. |<br \/>\n| Non-wetting or de-wetting  | Solder does not adhere properly to the component.               | Poor PCB finish, excessive soaking time, insufficient heat.                                              |<br \/>\n| Solder beading             | Formation of solder balls near discrete components.             | Excess solder paste, flux outgassing, and excessive placement pressure.                                  |<br \/>\n| Insufficient solder joints | Electrical opens due to inadequate solder.                      | Issues during solder paste printing, insufficient solder volume, and PCB fabrication issues.             |<br \/>\n| Solder balling             | Tiny solder particles are forming separately from the joint.    | Fine powder size, inadequate reflow process, and moisture interaction.                                   |<\/p>\n<p>T\u011bmto probl\u00e9m\u016fm m\u016f\u017eete p\u0159edej\u00edt <a href=\"https:\/\/kicthermal.com\/article-paper\/best-practices-reflow-profiling-for-lead-free-smt-assembly\/\">nastaven\u00ed rychlosti n\u00e1b\u011bhu na 1-1,5 \u00b0C za sekundu.<\/a> a optimalizace \u0161pi\u010dkov\u00fdch teplot. T\u00edm se sni\u017euje oxidace a zlep\u0161uje v\u00fdkon tavidla. V\u00fdb\u011br spr\u00e1vn\u00e9ho chemick\u00e9ho slo\u017een\u00ed p\u00e1jec\u00ed pasty tak\u00e9 pom\u00e1h\u00e1 minimalizovat vady. B\u011b\u017en\u00e9 probl\u00e9my, jako je tombstoning, p\u00e1jec\u00ed kuli\u010dky a vady typu \"hlava v pol\u0161t\u00e1\u0159i\", se vyskytuj\u00ed m\u00e9n\u011b \u010dasto, pokud dodr\u017eujete dob\u0159e navr\u017een\u00fd teplotn\u00ed profil p\u0159etavovac\u00ed pece.<\/p>\n<h2 id=\"preparation\">P\u0159\u00edprava<\/h2>\n<p><figure class=\"wp-block-image alignnone\"><img decoding=\"async\" src=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/09\/1756950806-2d6b485e7753433984ed6ec31f722852.webp\" alt=\"Preparation\" ><\/figure>\n<\/p>\n<h3 id=\"pcbandsoldertype\">Typ PCB a p\u00e1jky<\/h3>\n<p>Mus\u00edte <a href=\"https:\/\/www.chuxin-smt.com\/cs\/beginners-guide-to-smt-peripheral-equipment-for-pcb-assembly\/\">identifikace materi\u00e1lu desek plo\u0161n\u00fdch spoj\u016f<\/a> a p\u00e1jec\u00ed pasty p\u0159ed nastaven\u00edm teplotn\u00edho profilu p\u0159etavovac\u00ed pece. R\u016fzn\u00e9 p\u00e1jec\u00ed slitiny, typy tavidel a povrchov\u00e9 \u00fapravy desek plo\u0161n\u00fdch spoj\u016f ovliv\u0148uj\u00ed bod t\u00e1n\u00ed a sm\u00e1\u010dec\u00ed vlastnosti. <a href=\"https:\/\/www.wevolver.com\/article\/reflow-soldering\">N\u00ed\u017ee uveden\u00e1 tabulka uv\u00e1d\u00ed kl\u00ed\u010dov\u00e9 faktory<\/a> kter\u00e9 ovliv\u0148uj\u00ed v\u00e1\u0161 v\u00fdb\u011br:<\/p>\n<p>| Component                  | Description                                                                                                        |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8211; | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212; |<br \/>\n| Solder Alloy               | Determines melting point, wetting properties, and mechanical strength. Common types include SnPb and SAC.          |<br \/>\n| Flux                       | Removes oxide layers, promotes wetting, and prevents oxidation. Activity level varies based on surface conditions. |<br \/>\n| Particle Size Distribution | Affects printability and reflow performance. Smaller sizes improve printability but may have oxidation issues.     |<br \/>\n| Viscosity and Rheology     | Must be compatible with printing processes for consistent deposition.                                              |<br \/>\n| Thermal Stability          | Should withstand the reflow temperature profile without premature activation or defects.                           |<br \/>\n| Compatibility              | Must match PCB materials and component finishes to avoid soldering issues.                                         |<\/p>\n<p>P\u00e1jec\u00ed pasta by m\u011bla odpov\u00eddat povrchov\u00e9 \u00faprav\u011b desky plo\u0161n\u00fdch spoj\u016f a v\u00fdvod\u016fm sou\u010d\u00e1stek. Tento krok pom\u00e1h\u00e1 p\u0159edch\u00e1zet vad\u00e1m p\u00e1jen\u00ed a zaji\u0161\u0165uje spolehliv\u00e9 spoje.<\/p>\n<h3 id=\"baselineprofile\">Z\u00e1kladn\u00ed profil<\/h3>\n<p>Z\u00e1kladn\u00ed profil je nutn\u00e9 nastavit na z\u00e1klad\u011b. <a href=\"https:\/\/www.chuxin-smt.com\/cs\/differences-between-smt-reflow-soldering-and-wave-soldering\/\">typ p\u00e1jky<\/a>. Olovnat\u00e9 a bezolovnat\u00e9 p\u00e1jky vy\u017eaduj\u00ed r\u016fzn\u00e9 teplotn\u00ed rozsahy a doby zdr\u017een\u00ed. <a href=\"https:\/\/www.johansondielectrics.com\/tech-notes\/johanson-dielectrics-solder-reflow-recommendations-for-lead-free-assembly\/\">V n\u00e1sleduj\u00edc\u00ed tabulce jsou uvedena doporu\u010den\u00e1 nastaven\u00ed<\/a> pro ka\u017ed\u00fd typ sestavy:<\/p>\n<p>| Profile Feature                                                                   | Sn-Pb Eutectic Assembly      | Pb_Free Assembly            |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212; | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;- | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;- |<br \/>\n| Average Ramp-Up Rate (Tsmax to Tp)                                                | 3\u00b0 C \/ second max.           | 3\u00b0 C \/ second max.           |<br \/>\n| Preheat:- Temperature Min (Tsmin)- Temperature Max (Tsmax)- Time (tsmin to tsmax) | 100\u00b0 C150\u00b0 C60 \u2013 120 seconds | 150\u00b0 C200\u00b0 C60 \u2013 180 seconds |<br \/>\n| Time maintained above:- Temperature (TL)- Time (tL)                               | 183\u00b0 C60 \u2013 150 seconds       | 217\u00b0 C60 \u2013 150 seconds       |<br \/>\n| Peak \/ Classification Temperature (Tp)                                            | See Table 4.1                | See Table 4.2                |<br \/>\n| Time within 5\u00b0 C of actual Peak Temperature (tp)                                  | 10 \u2013 30 seconds              | 20 \u2013 40 seconds              |<br \/>\n| Ramp-Down Rate                                                                    | 3\u00b0 C \/ second max.           | 3\u00b0 C \/ second max.           |<br \/>\n| Time 25\u00b0 C to Peak Temperature                                                    | 6 minutes max.               | 8 minutes max.               |<\/p>\n<p>V\u017edy byste m\u011bli zkontrolovat datov\u00fd list p\u00e1jec\u00ed pasty, kde jsou uvedena konkr\u00e9tn\u00ed doporu\u010den\u00ed. Upravte profil tak, aby odpov\u00eddal velikosti desky plo\u0161n\u00fdch spoj\u016f a hustot\u011b sou\u010d\u00e1stek.<\/p>\n<h3 id=\"thermocouplesetup\">Nastaven\u00ed termo\u010dl\u00e1nku<\/h3>\n<p>Pro m\u011b\u0159en\u00ed skute\u010dn\u00e9 teploty na desce plo\u0161n\u00fdch spoj\u016f b\u011bhem profilov\u00e1n\u00ed je t\u0159eba nastavit termo\u010dl\u00e1nky. Postupujte podle t\u011bchto osv\u011bd\u010den\u00fdch postup\u016f:<\/p>\n<ul>\n<li><a href=\"https:\/\/www.indium.com\/blog\/best-practices-for-attaching-thermocouples-to-a-pcb-for-reflow-profiling-part-i\/\">Pro p\u0159esn\u00e9 m\u011b\u0159en\u00ed teploty pou\u017eijte osazenou desku plo\u0161n\u00fdch spoj\u016f<\/a>.<\/li>\n<li>Vyvarujte se zkroucen\u00ed vodi\u010d\u016f termo\u010dl\u00e1nku. T\u00edm zajist\u00edte, \u017ee budete m\u00edt \u00fadaje ze spr\u00e1vn\u00e9ho spoje.<\/li>\n<li>O\u010dek\u00e1vejte teplotn\u00ed rozd\u00edly a\u017e 10 \u00b0C nebo v\u00edce mezi osazen\u00fdmi a hol\u00fdmi deskami plo\u0161n\u00fdch spoj\u016f.<\/li>\n<\/ul>\n<p><a href=\"https:\/\/kicthermal.com\/article-paper\/the-science-behind-conveyor-oven-thermal-profiling\/\">Po\u010det a um\u00edst\u011bn\u00ed termo\u010dl\u00e1nk\u016f p\u0159\u00edmo ovliv\u0148uje p\u0159esnost m\u011b\u0159en\u00ed.<\/a> teplotn\u00edho profilu p\u0159etavovac\u00ed pece. Um\u00edst\u011bn\u00ed v\u011bt\u0161\u00edho po\u010dtu termo\u010dl\u00e1nk\u016f na strategick\u00e1 m\u00edsta v\u00e1m pom\u016f\u017ee zjistit nejvy\u0161\u0161\u00ed a nejni\u017e\u0161\u00ed \u0161pi\u010dkov\u00e9 teploty. Tento p\u0159\u00edstup zajist\u00ed, \u017ee v\u0161echny komponenty dos\u00e1hnou po\u017eadovan\u00e9 teploty pro spr\u00e1vn\u00e9 p\u00e1jen\u00ed.<\/p>\n<blockquote>\n<p>Tip: Um\u00edst\u011bte termo\u010dl\u00e1nky do bl\u00edzkosti velk\u00fdch komponent, konektor\u016f a roh\u016f, abyste zachytili zm\u011bny teploty na cel\u00e9 desce.<\/p>\n<\/blockquote>\n<h2 id=\"reflowoventemperaturezones\">Teplotn\u00ed z\u00f3ny p\u0159etavovac\u00ed pece<\/h2>\n<p>Nastaven\u00ed spr\u00e1vn\u00e9ho teplotn\u00edho profilu p\u0159etavovac\u00ed pece znamen\u00e1 porozum\u011bt ka\u017ed\u00e9 f\u00e1zi procesu. Mus\u00edte v\u00e9st desku plo\u0161n\u00fdch spoj\u016f \u010dty\u0159mi hlavn\u00edmi teplotn\u00edmi z\u00f3nami: Ramp-Up, Soak, Reflow a Cooling. Ka\u017ed\u00e1 z t\u011bchto z\u00f3n hraje rozhoduj\u00edc\u00ed roli p\u0159i vytv\u00e1\u0159en\u00ed p\u00e1jec\u00edch spoj\u016f a celkov\u00e9 kvalit\u011b sestavy.<\/p>\n<h3 id=\"rampup\">Ramp-Up<\/h3>\n<p>Za\u010d\u00edn\u00e1te v n\u00e1jezdov\u00e9 z\u00f3n\u011b. V t\u00e9to f\u00e1zi se postupn\u011b zah\u0159\u00edv\u00e1 deska plo\u0161n\u00fdch spoj\u016f a komponenty, aby se zabr\u00e1nilo tepeln\u00e9mu \u0161oku. M\u011bli byste kontrolovat rychlost n\u00e1b\u011bhu, abyste zabr\u00e1nili po\u0161kozen\u00ed a zajistili rovnom\u011brn\u00fd oh\u0159ev. Doporu\u010den\u00e1 rychlost n\u00e1b\u011bhu se pohybuje mezi <a href=\"https:\/\/www.fastturnpcbs.com\/blog\/reflow-soldering-profile\/\">1,5 \u00b0C a 3 \u00b0C za sekundu<\/a>, p\u0159i\u010dem\u017e nikdy nep\u0159ekro\u010d\u00ed 3 \u00b0C za sekundu. C\u00edlov\u00e9 teploty se li\u0161\u00ed v z\u00e1vislosti na typu p\u00e1jky.<\/p>\n<p>| Parameter          | Value Range                               |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212;&#8212; | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8211; |<br \/>\n| Typical ramp rate  | 1.5\u20133 \u00b0C\/s (not exceeding 3 \u00b0C\/s)         |<br \/>\n| Target temperature | Leaded: 120\u2013150 \u00b0C, Lead-free: 150\u2013180 \u00b0C |<\/p>\n<p>Mus\u00edte se vyvarovat rychl\u00e9ho zv\u00fd\u0161en\u00ed teploty. Rychl\u00fd n\u00e1r\u016fst teploty m\u016f\u017ee zp\u016fsobit prask\u00e1n\u00ed nebo deformaci sou\u010d\u00e1stek. Pomal\u00e9, kontrolovan\u00e9 zah\u0159\u00edv\u00e1n\u00ed pom\u00e1h\u00e1 aktivovat tavidlo a p\u0159ipravuje p\u00e1jec\u00ed pastu pro dal\u0161\u00ed f\u00e1zi.<\/p>\n<blockquote>\n<p>Tip: Um\u00edst\u011bte termo\u010dl\u00e1nky na r\u016fzn\u00e1 m\u00edsta na desce plo\u0161n\u00fdch spoj\u016f, abyste mohli sledovat rovnom\u011brnost teploty b\u011bhem n\u00e1b\u011bhu.<\/p>\n<\/blockquote>\n<h3 id=\"soak\">Namo\u010dte<\/h3>\n<p>Z\u00f3na nam\u00e1\u010den\u00ed stabilizuje teplotu na cel\u00e9 desce plo\u0161n\u00fdch spoj\u016f. Desku dr\u017e\u00edte p\u0159i m\u00edrn\u00e9 teplot\u011b, aby se aktivovalo tavidlo a odstranily se oxidy z v\u00fdvod\u016f a podlo\u017eek sou\u010d\u00e1stek. Tento krok zaji\u0161\u0165uje spr\u00e1vn\u00e9 sm\u00e1\u010den\u00ed povrch\u016f p\u00e1jec\u00ed pastou.<\/p>\n<p>| Solder Type      | Temperature Range | Duration                                                                                                                                         |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212;- | &#8212;&#8212;&#8212;&#8212;&#8212;&#8211; | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212; |<br \/>\n| Leaded solder    | 150\u00b0C to 200\u00b0C    | <a href=\"https:\/\/www.allpcb.com\/es-ES\/blog\/pcb-assembly\/mastering-the-reflow-soldering-temperature-profile-a-step-by-step-guide.html\">60 a\u017e 120 sekund<\/a> |<br \/>\n| Lead-free solder | 180\u00b0C to 220\u00b0C    | 60 to 120 seconds                                                                                                                                |<\/p>\n<p>Teplotu nam\u00e1\u010den\u00ed byste m\u011bli udr\u017eovat mezi 155 \u00b0C a 200 \u00b0C po dobu 60 a\u017e 120 sekund. Tento postupn\u00fd n\u00e1r\u016fst umo\u017e\u0148uje efektivn\u00ed p\u016fsoben\u00ed tavidla a sni\u017euje riziko vzniku dutin v p\u00e1jec\u00edch spoj\u00edch. Pokud tuto f\u00e1zi usp\u011bch\u00e1te, m\u016f\u017ee doj\u00edt ke \u0161patn\u00e9mu sm\u00e1\u010den\u00ed nebo zv\u00fd\u0161en\u00e9 tvorb\u011b dutin.<\/p>\n<ul>\n<li>Doba trv\u00e1n\u00ed nam\u00e1\u010dec\u00ed z\u00f3ny ovliv\u0148uje aktivaci p\u00e1jec\u00ed pasty a tvorbu dutin.<\/li>\n<li>Spr\u00e1vn\u00e1 doba nam\u00e1\u010den\u00ed pom\u00e1h\u00e1 minimalizovat vady a zvy\u0161uje spolehlivost spoje.<\/li>\n<\/ul>\n<h3 id=\"reflow\">Reflow<\/h3>\n<p>Z\u00f3na p\u0159etaven\u00ed je vrcholem procesu. Zvy\u0161ujete teplotu p\u0159etavovac\u00ed pece, aby se p\u00e1jka roztavila a vytvo\u0159ily se pevn\u00e9 spoje. U olovnat\u00e9 p\u00e1jky se zam\u011b\u0159te na \u0161pi\u010dkovou teplotu mezi 210 \u00b0C a 230 \u00b0C. U bezolovnat\u00e9 p\u00e1jky se zam\u011b\u0159te na teplotu 235 \u00b0C a\u017e 250 \u00b0C. Deska by m\u011bla z\u016fstat nad bodem t\u00e1n\u00ed po dobu <a href=\"https:\/\/en.wikipedia.org\/wiki\/Reflow_soldering\">20 a\u017e 30 sekund<\/a>, ale ne d\u00e9le ne\u017e 60 sekund. P\u0159\u00edli\u0161 dlouh\u00e1 doba p\u0159i \u0161pi\u010dkov\u00e9 teplot\u011b m\u016f\u017ee zp\u016fsobit k\u0159ehk\u00e9 spoje v d\u016fsledku r\u016fstu intermetalick\u00fdch prvk\u016f.<\/p>\n<p>| Evidence Type          | Temperature Range (\u00b0C) | Duration at Peak Temperature | Notes                                                           |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;- | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;- | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;- | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212; |<br \/>\n| Sn\/Pb Solder Paste     | 210\u2013230                | 20\u201330 seconds                | Ensures proper solder joint formation without damaging the PCB. |<br \/>\n| Lead-Free Solder Paste | 235\u2013250                | 20\u201330 seconds                | Ensures proper solder joint formation without damaging the PCB. |<\/p>\n<p>V t\u00e9to f\u00e1zi je nutn\u00e9 udr\u017eovat teplotu desky mezi 195 \u00b0C a 225 \u00b0C. \u0160pi\u010dkov\u00e1 teplota by m\u011bla b\u00fdt alespo\u0148 o 25 \u00b0C vy\u0161\u0161\u00ed ne\u017e teplota koalescence p\u00e1jky. T\u00edm se zajist\u00ed \u00fapln\u00e9 roztaven\u00ed a spr\u00e1vn\u00e9 vytvo\u0159en\u00ed slitiny.<\/p>\n<blockquote>\n<p>Pozn\u00e1mka: Doba nad liquidus (TAL) by m\u011bla b\u00fdt u v\u011bt\u0161iny p\u00e1jec\u00edch past 45 a\u017e 90 sekund. Toto okno umo\u017e\u0148uje ide\u00e1ln\u00ed sm\u00e1\u010den\u00ed a vytvo\u0159en\u00ed spoje.<\/p>\n<\/blockquote>\n<h3 id=\"cooling\">Chlazen\u00ed<\/h3>\n<p>V chladic\u00ed z\u00f3n\u011b p\u00e1jka tuhne a zaji\u0161\u0165uje celistvost spoje. Je t\u0159eba kontrolovat rychlost chlazen\u00ed, abyste zabr\u00e1nili tepeln\u00e9mu \u0161oku a p\u0159ede\u0161li k\u0159ehk\u00fdm spoj\u016fm. Str\u00e1nka <a href=\"https:\/\/www.chuxin-smt.com\/cs\/reflow-soldering-cooling-system-importance-optimization\/\">doporu\u010den\u00e1 rychlost chlazen\u00ed<\/a> je <a href=\"https:\/\/www.ltpcba.com\/reflow-soldering-temperature-zones-and-pcb-quality\/\">mezi 3 \u00b0C a 7 \u00b0C za sekundu<\/a>.<\/p>\n<ul>\n<li>\u0158\u00edzen\u00e9 chlazen\u00ed zabra\u0148uje tepeln\u00fdm \u0161ok\u016fm a zaji\u0161\u0165uje integritu p\u00e1jec\u00edho spoje.<\/li>\n<li>Rychl\u00e9 ochlazen\u00ed m\u016f\u017ee zp\u016fsobit vnit\u0159n\u00ed pnut\u00ed a k\u0159ehk\u00e9 spoje, zejm\u00e9na u bezolovnat\u00fdch p\u00e1jek.<\/li>\n<li>Slow cooling may lead to excessive intermetallic growth, weakening the joints over time.<\/li>\n<\/ul>\n<p>You should monitor the cooling profile closely. Consistent cooling helps maintain the reliability of your solder joints and reduces the risk of cracks or long-term failures.<\/p>\n<blockquote>\n<p>Tip: Use your oven\u2019s cooling controls to fine-tune the rate and avoid sudden temperature drops.<\/p>\n<\/blockquote>\n<h2 id=\"profilesetup\">Nastaven\u00ed profilu<\/h2>\n<p><figure class=\"wp-block-image alignnone\"><img decoding=\"async\" src=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/09\/1756950807-450d259785334f819fe4cee1d7cbef76.webp\" alt=\"Profile Setup\" ><\/figure>\n<\/p>\n<h3 id=\"ovenparameters\">Oven Parameters<\/h3>\n<p>You should always begin by <a href=\"https:\/\/www.chuxin-smt.com\/cs\/choose-the-right-reflow-oven-for-your-smt-line-guide\/\">setting your oven parameters<\/a> based on the solder paste and PCB design you use. Manufacturers provide <a href=\"https:\/\/www.bqc-pcba.com\/blog\/how-to-set-the-parameters-of-a-reflow-oven-for-electronic-pcba-assembly-565893.html\">recommended reflow profiles<\/a> for their solder pastes and components. These serve as a reliable starting point. However, you must consider the thermal properties of your components and the layout of your PCB. Large components, such as power transistors, heat and cool more slowly than smaller parts. The mix of components on your board should influence your oven settings.<\/p>\n<p>| Evidence Type                    | Description                                                                                         |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8211; | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212; |<br \/>\n| Manufacturer Recommendations     | Start with the recommended reflow profiles from the solder paste and component manufacturers.       |<br \/>\n| Thermal Properties of Components | Different components have varying thermal properties, affecting how quickly they heat and cool.     |<br \/>\n| General Guidelines               | The recommended profiles serve as guidelines, but adjustments may be necessary based on PCB design. |<\/p>\n<ul>\n<li>Large components require more time to reach the target temperature.<\/li>\n<li>The combination of different components on your PCB can create uneven heating if not considered.<\/li>\n<\/ul>\n<p>You should adjust your Reflow Oven Temperature zones to match the needs of your assembly. Always check the solder paste datasheet and component guidelines before making changes.<\/p>\n<h3 id=\"testrun\">Test Run<\/h3>\n<p>After setting your initial oven parameters, you need to run a test profile. This step helps you verify that your settings produce the desired results. <a href=\"https:\/\/www.smtfactory.com\/reflow-oven-calibration-how-often-and-how-to-do-it-right.html\">Follow these steps for a successful test run<\/a>:<\/p>\n<ol>\n<li>Attach thermocouples to a test PCB at key locations, such as near large components, connectors, and corners.<\/li>\n<li>Connect a profiler to record temperature data throughout the process.<\/li>\n<li>Define your target thermal profile based on the solder paste and component requirements.<\/li>\n<li>Run the oven and monitor the temperature readings in real time.<\/li>\n<li>Adjust airflow fans to correct any hot or cold spots you observe.<\/li>\n<li>Change the conveyor speed to control the time your PCB spends in each temperature zone.<\/li>\n<li>Repeat the test until you achieve uniform heating across the board.<\/li>\n<li>Inspect the solder joints visually and with magnification to confirm proper wetting and joint formation.<\/li>\n<\/ol>\n<blockquote>\n<p>Tip: Always use a fully populated test board for the most accurate results. Empty boards heat differently and may not reveal real-world issues.<\/p>\n<\/blockquote>\n<h3 id=\"dataanalysis\">Anal\u00fdza dat<\/h3>\n<p>Once you complete your test run, you need to analyze the temperature profile data. Accurate data analysis helps you identify uneven heating, process defects, and areas for improvement. <a href=\"https:\/\/accuratesensors.com\/knowledge-hub-aluminum-extrusion-temperature-measurement-complete-guide\/\">Temperature directly affects production efficiency<\/a>, product quality, and equipment longevity. You can use several methods and tools to analyze your results:<\/p>\n<ul>\n<li><a href=\"https:\/\/dac.digital\/thermal-inspection-examples-where-ai-helps\/\">Thermal imaging provides non-contact, precise thermal data<\/a>. It helps you spot defects during different stages of manufacturing.<\/li>\n<li>AI technologies monitor temperature variations and alert you to deviations, making it easier to detect uneven heating.<\/li>\n<li>Infrared pyrometry offers accurate, non-contact temperature measurements, which are crucial for maintaining quality in challenging environments.<\/li>\n<li>Data analysis reveals subtle temperature pattern variations that signal inconsistencies in your process.<\/li>\n<li>Verifying product quality through temperature data helps you catch minute variations that may indicate defects.<\/li>\n<\/ul>\n<p>| Software Tool                       | Description                                                                                            |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8211; | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212; |<br \/>\n| Profile Central Software            | A user-friendly suite designed for temperature profiling, allowing quick setup and optimization.       |<br \/>\n| AutoSeeker                          | A simulation tool for virtual changes to temperature and conveyor speed, providing graphical feedback. |<br \/>\n| KIC\u2019s Thermal Analysis System (TAS) | AI-driven software that automates thermal profile setup and enhances efficiency.                       |<\/p>\n<ul>\n<li><a href=\"https:\/\/www.solderstar.com\/en\/solderstar-solutions\/solutions-reflow\/profile-central-software\/\">Profile Central Software allows you to set up and optimize your temperature profiles quickly<\/a>.<\/li>\n<li>AutoSeeker lets you simulate changes and see the impact on your process before making adjustments.<\/li>\n<li>KIC\u2019s Thermal Analysis System automates profile management and helps maintain consistent results.<\/li>\n<\/ul>\n<blockquote>\n<p>Note: If you notice uneven heating or defects, check your thermal profile. Adjust ramp-up, soak, and cooling rates to achieve uniform heat distribution. Use thermocouples or test boards to identify hot or cold spots before they cause problems. Proper component placement and pad design also help prevent issues like tombstoning.<\/p>\n<\/blockquote>\n<h2 id=\"profileoptimization\">Profile Optimization<\/h2>\n<h3 id=\"finetuning\">Fine-Tuning<\/h3>\n<p>You can achieve the best soldering results by fine-tuning your reflow oven profile. Small adjustments make a big difference in temperature accuracy and repeatability. Here are some common changes you might make during this process:<\/p>\n<ul>\n<li>Adjust PID settings to help your oven reach and maintain critical temperatures, such as <a href=\"https:\/\/www.heavidesign.com\/2020\/05\/31\/reflow-profiles-and-tuning-the-tiny-reflow-controller-v2\/\">150\u00b0C<\/a> for the soak stage. Proper tuning prevents temperature overshoot or lag.<\/li>\n<li>Manage the temperature profile by controlling ramp rates. For example, setting the pre-heat ramp to about 2\u00b0C per second helps you avoid overheating, which can cause dull joints or damage to the flux.<\/li>\n<li>Check for repeatability by running the same profile multiple times. Consistent results show that your oven and controller work reliably, which is key for high-quality soldering.<\/li>\n<\/ul>\n<blockquote>\n<p>Tip: Always monitor your results after each adjustment. Consistency in your process leads to fewer defects and better yields.<\/p>\n<\/blockquote>\n<h3 id=\"maintenance\">\u00dadr\u017eba<\/h3>\n<p><a href=\"https:\/\/www.allpcb.com\/blog\/pcb-assembly\/reflow-soldering-secrets-achieving-perfect-smt-joints-every-time.html\">Regular maintenance<\/a> keeps your reflow oven running smoothly and ensures consistent <a href=\"https:\/\/www.chuxin-smt.com\/cs\/reflow-soldering-cooling-system-importance-optimization\/\">teplotn\u00ed profily<\/a>. You should follow these essential tasks:<\/p>\n<ul>\n<li>Clean the oven weekly or after major production runs to remove flux residues and prevent contamination.<\/li>\n<li>Check heating elements as needed to maintain even temperatures.<\/li>\n<li>Calibrate sensors every month for accurate readings.<\/li>\n<li>Inspect conveyor systems regularly to avoid mishandling of boards.<\/li>\n<li>Monitor exhaust and ventilation to maintain proper airflow.<\/li>\n<\/ul>\n<p>Neglecting these tasks can cause uneven heating, profile deviations, and higher defect rates. <a href=\"https:\/\/www.microcare.com\/en-US\/Resources\/Insights\/2025\/The-Importance-of-Maintaining-a-Clean-Reflow-Oven-for-Quality-PCBA-Production\">A clean oven<\/a> helps you maintain stable temperature settings and prevents issues with PCB contamination.<\/p>\n<blockquote>\n<p>Note: Consistent maintenance protects your investment and improves product quality.<\/p>\n<\/blockquote>\n<h3 id=\"savingprofiles\">Saving Profiles<\/h3>\n<p>You should document and save your <a href=\"https:\/\/www.chuxin-smt.com\/cs\/development-history-reflow-ovens-innovations-future-trends\/\">reflow oven profiles<\/a> for future use and traceability. Best practices include:<\/p>\n<p>| <a href=\"https:\/\/kicthermal.com\/article-paper\/270-automated-process-control-for-the-reflow-process-3\/\">Osv\u011bd\u010den\u00e9 postupy<\/a> | Description                                                                                    |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;- | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;- |<br \/>\n| Automated Data Collection                                                                                     | Automatically record thermal process data for each product to ensure accurate future profiles. |<br \/>\n| Real-time Monitoring                                                                                          | Create virtual profiles and monitor production in real time to maintain traceability.          |<br \/>\n| Profile Explorer                                                                                              | Use a profile explorer to review profiles for every board produced, aiding documentation.      |<br \/>\n| Time and Date Stamping                                                                                        | Stamp all events and profiles with time and date for clear traceability and record-keeping.    |<\/p>\n<p>Saving profiles helps you repeat successful processes and quickly troubleshoot issues. Good documentation supports quality control and meets industry standards.<\/p>\n<p>You can achieve better soldering results by following these essential steps:<\/p>\n<ol>\n<li>Gradually increase the temperature in the ramp zone at <a href=\"https:\/\/www.escatec.com\/blog\/how-to-create-the-perfect-smt-reflow-oven-profile\">1\u20133\u00b0C per second<\/a>.<\/li>\n<li>Hold a steady soak zone for uniform heating, covering up to half the oven.<\/li>\n<li>Reach peak temperature in the reflow zone, keeping the board above reflow for 45\u201390 seconds.<\/li>\n<li>Control the cooling zone at about 4\u00b0C per second.<\/li>\n<\/ol>\n<ul>\n<li>Choose your profile based on assembly complexity.<\/li>\n<li>Maintain your oven regularly.<\/li>\n<li>Analyze data with thermal profiling tools.<\/li>\n<\/ul>\n<blockquote>\n<p>Careful profiling improves solder joint quality and reliability. Apply these steps and keep refining your process for the best outcomes.<\/p>\n<\/blockquote>\n<h2 id=\"faq\">\u010cASTO KLADEN\u00c9 DOTAZY<\/h2>\n<h3 id=\"whathappensifyousettherampupratetoohigh\">What happens if you set the ramp-up rate too high?<\/h3>\n<p>You risk damaging sensitive components. Rapid heating can cause cracking or warping.<\/p>\n<blockquote>\n<p>Tip: Keep the ramp-up rate below 3\u00b0C per second for safer results.<\/p>\n<\/blockquote>\n<h3 id=\"howdoyouchoosetherightsolderpasteforyourpcb\">How do you choose the right solder paste for your PCB?<\/h3>\n<p>You should match the solder alloy and flux type to your PCB finish and component leads.<\/p>\n<p>| Solder Paste | PCB Finish |<br \/>\n| &#8212;&#8212;&#8212;&#8212; | &#8212;&#8212;&#8212;- |<br \/>\n| SnPb         | HASL       |<br \/>\n| SAC305       | ENIG       |<\/p>\n<h3 id=\"canyoureuseasavedtemperatureprofilefordifferentassemblies\">Can you reuse a saved temperature profile for different assemblies?<\/h3>\n<p>You should not reuse profiles without adjustments. Each assembly has unique thermal needs.<\/p>\n<ul>\n<li>Check solder type<\/li>\n<li>Review component density<\/li>\n<li>Test with thermocouples<\/li>\n<\/ul>\n<h3 id=\"whydoyouneedmultiplethermocouplesduringprofiling\">Why do you need multiple thermocouples during profiling?<\/h3>\n<p>You need multiple thermocouples to detect temperature differences across your PCB. This ensures all components reach the correct temperature.<\/p>\n<blockquote>\n<p>Note: Place thermocouples near large components and corners for accurate readings.<\/p>\n<\/blockquote>","protected":false},"excerpt":{"rendered":"<p>Nastavte si teplotn\u00ed profil p\u0159etavovac\u00ed pece pro optimalizaci p\u00e1jec\u00edch spoj\u016f, minimalizaci vad a zaji\u0161t\u011bn\u00ed spolehliv\u00e9ho osazen\u00ed desek plo\u0161n\u00fdch spoj\u016f pomoc\u00ed p\u0159esn\u00e9 tepeln\u00e9 kontroly.<\/p>","protected":false},"author":1,"featured_media":2933,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"categories":[1,52],"tags":[57,79,84,64,83],"class_list":["post-2934","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-company-news","category-product-information","tag-reflow-oven","tag-sm-reflow-oven","tag-solder-equipment","tag-soldering-process","tag-welding-equipment"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/posts\/2934","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/comments?post=2934"}],"version-history":[{"count":0,"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/posts\/2934\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/media\/2933"}],"wp:attachment":[{"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/media?parent=2934"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/categories?post=2934"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/tags?post=2934"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}