{"id":4150,"date":"2026-02-27T17:51:57","date_gmt":"2026-02-27T09:51:57","guid":{"rendered":"https:\/\/www.chuxin-smt.com\/vacuum-reflow-void-reduction-bga-best-practices\/"},"modified":"2026-04-08T19:00:28","modified_gmt":"2026-04-08T11:00:28","slug":"vacuum-reflow-void-reduction-bga-best-practices","status":"publish","type":"post","link":"https:\/\/www.chuxin-smt.com\/cs\/vacuum-reflow-void-reduction-bga-best-practices\/","title":{"rendered":"Redukce pr\u00e1zdn\u00fdch m\u00edst p\u0159i p\u0159etaven\u00ed ve vakuu pro p\u00e1jec\u00ed kuli\u010dky BGA"},"content":{"rendered":"<p><figure class=\"wp-block-image alignnone\"><img decoding=\"async\" src=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/02\/1772185916-93ef321b-7949-45fd-8c49-89532e6aae50.jpeg\" alt=\"Vacuum-assisted SMT reflow oven with nitrogen control and oxygen sensor showing ppm\" ><\/figure>\n<\/p>\n<p>Pokud se va\u0161e c\u00edle pro p\u0159ijatelnost BGA zp\u0159\u00eds\u0148uj\u00ed na 15% na kuli\u010dku \u2013 a v n\u011bkter\u00fdch programech dokonce na 10% \u2013 pot\u0159ebujete opakovateln\u00fd zp\u016fsob, jak z roztaven\u00e9 p\u00e1jky odstranit zachycen\u00e9 t\u011bkav\u00e9 l\u00e1tky, ani\u017e by t\u00edm byla ohro\u017eena spolehlivost. \u0158e\u0161en\u00edm je reflow s vakuovou podporou v kombinaci s p\u0159esnou regulac\u00ed dus\u00edku. Tato p\u0159\u00edru\u010dka uv\u00e1d\u00ed specifikace p\u0159ipraven\u00e9 pro s\u00e9riovou v\u00fdrobu, kroky validace a pl\u00e1n srovn\u00e1n\u00ed p\u00e1jec\u00edch past A\/B, abyste mohli dos\u00e1hnout n\u00e1ro\u010dn\u00fdch c\u00edl\u016f v oblasti dutin v BGA, i kdy\u017e to bude st\u00e1t n\u011bkolik sekund cyklu.<\/p>\n<h2 id=\"keytakeaways\">Hlavn\u00ed body<\/h2>\n<ul>\n<li>C\u00edlov\u00e9 hodnoty pro dutiny v kuli\u010dk\u00e1ch BGA: pl\u00e1nujte v pr\u016fm\u011bru \u226415%; pro sestavy s vysokou spolehlivost\u00ed pou\u017eijte ambici\u00f3zn\u00ed c\u00edl 10\u201315%. Krit\u00e9ria pro p\u0159ijet\u00ed\/zam\u00edtnut\u00ed se i nad\u00e1le \u0159\u00edd\u00ed normami IPC-A-610 a J-STD-001; intern\u00ed c\u00edle mohou b\u00fdt p\u0159\u00edsn\u011bj\u0161\u00ed. Viz shrnut\u00ed kontextu norem v p\u0159edn\u00e1\u0161ce SMTA od Tonyho Lentze (2021) v <strong><a href=\"https:\/\/smta.org\/resource\/collection\/E979F6B4-288F-46CD-A049-369146AF88F2\/SMTA-CTEA-Expo-2021-10_Tony_Lentz_Voiding_Summary.pdf\">p\u0159ehled krit\u00e9ri\u00ed pro zru\u0161en\u00ed<\/a><\/strong>.<\/li>\n<li>Nastaven\u00ed po\u010d\u00e1te\u010dn\u00edho vakua: spustit vakuum \u00b15 s od bodu likvidu, udr\u017eovat 10\u201330 s, c\u00edlov\u00e1 hodnota 5\u201350 mbar. Upravit podle velikosti BGA a tepeln\u00e9 hmotnosti. Regulovat odv\u011btr\u00e1v\u00e1n\u00ed, aby nedo\u0161lo k naru\u0161en\u00ed p\u00e1jky.<\/li>\n<li>Regulace obsahu kysl\u00edku: udr\u017eujte hladinu O\u2082 v rozmez\u00ed 10\u201350 ppm b\u011bhem \u0161pi\u010dkov\u00e9 f\u00e1ze a vakuov\u00e9 f\u00e1ze; pou\u017eijte regulaci O\u2082 v uzav\u0159en\u00e9 smy\u010dce s alarmem nastaven\u00fdm na ~50 ppm. Kontext strategie viz <strong><a href=\"https:\/\/hellerindustries.com\/wp-content\/uploads\/2022\/04\/nitrogencontrol-1.pdf\">Hellerovy pozn\u00e1mky k regulaci dus\u00edku (2022)<\/a><\/strong>.<\/li>\n<li>Tepeln\u00fd profil: rychlost n\u00e1b\u011bhu 1,0\u20131,5 \u00b0C\/s; TAL 60\u201390 s; vrchol 245\u2013260 \u00b0C v r\u00e1mci limit\u016f slo\u017eky. To odpov\u00edd\u00e1 <strong><a href=\"https:\/\/kicthermal.com\/wp-content\/uploads\/2019\/03\/Optimized-Reflow-Profiling-to-Minimize-Voiding-v3-Final.pdf\">Pokyny KIC k profilov\u00e1n\u00ed pro minimalizaci vzniku dutin (2019)<\/a><\/strong>.<\/li>\n<li>Nejprve d\u016fkazy: prove\u010fte A\/B pl\u00e1n popsan\u00fd v tomto pr\u016fvodci s \u226550 BGA v ka\u017ed\u00e9 skupin\u011b a histogramy rentgenov\u00fdch sn\u00edmk\u016f; sledujte SPC s intern\u00ed horn\u00ed mez\u00ed (USL) (nap\u0159. 15%).<\/li>\n<\/ul>\n<hr \/>\n<h2 id=\"whyvacuumandnitrogenreducebgavoids\">Pro\u010d vakuum a dus\u00edk sni\u017euj\u00ed v\u00fdskyt dutin v BGA<\/h2>\n<p>Dutiny v kuli\u010dk\u00e1ch BGA vznikaj\u00ed p\u0159edev\u0161\u00edm v d\u016fsledku zachycen\u00fdch t\u011bkav\u00fdch slo\u017eek tavidla a odply\u0148ov\u00e1n\u00ed z p\u00e1jec\u00ed pasty a substr\u00e1t\u016f b\u011bhem kapaln\u00e9 f\u00e1ze. Aplikace vakua v dob\u011b, kdy je p\u00e1jka roztaven\u00e1, sni\u017euje okoln\u00ed tlak, \u010d\u00edm\u017e doch\u00e1z\u00ed k rozta\u017een\u00ed bublin a usnad\u0148uje se jejich \u00fanik je\u0161t\u011b p\u0159ed ztuhnut\u00edm. Dus\u00edk s n\u00edzk\u00fdm obsahem kysl\u00edku d\u00e1le zlep\u0161uje sm\u00e1\u010divost a omezuje tvorbu oxidov\u00fdch vrstev, ve kter\u00fdch se mohou zachycovat plyny.<\/p>\n<ul>\n<li>Z\u00e1sadn\u00ed parametry procesu: na\u010dasov\u00e1n\u00ed vakuov\u00e9 f\u00e1ze v okol\u00ed bodu likvidu, dostate\u010dn\u00e1 doba v\u00fddr\u017ee pro odstran\u011bn\u00ed bublin, \u0159\u00edzen\u00e9 odv\u011btr\u00e1v\u00e1n\u00ed, kter\u00e9 zabr\u00e1n\u00ed vyt\u00e1hnut\u00ed p\u00e1jky, a stabiln\u00ed koncentrace O\u2082 v ppm po celou dobu reflow.<\/li>\n<li>Kontext norem: Krit\u00e9ria p\u0159ijatelnosti pro sou\u010d\u00e1stky typu BGA se \u0159\u00edd\u00ed normami IPC-A-610 a J-STD-001, zat\u00edmco norma IPC-7095 obsahuje pokyny pro n\u00e1vrh a mont\u00e1\u017e specifick\u00e9 pro sou\u010d\u00e1stky typu BGA. Viz ofici\u00e1ln\u00ed obsahy IPC pro <strong><a href=\"https:\/\/www.ipc.org\/TOC\/IPC-7095E_toc.pdf\">IPC\u20117095E<\/a><\/strong> a <strong><a href=\"https:\/\/www.ipc.org\/TOC\/IPC-J-STD-001J_TOC.pdf\">J\u2011STD\u2011001J<\/a><\/strong>; p\u0159esn\u00e9 mezn\u00ed hodnoty najdete v platn\u00fdch norm\u00e1ch.<\/li>\n<li>Nastaven\u00ed profilu: pr\u016fb\u011bh \u201eramp-to-peak\u201c s omezen\u00fdm udr\u017eov\u00e1n\u00edm teploty, doba nad teplotou t\u00e1n\u00ed (60\u201390 s) a odpov\u00eddaj\u00edc\u00ed \u0161pi\u010dkov\u00e9 teploty odpov\u00eddaj\u00ed ni\u017e\u0161\u00edmu vzniku dutin, jak podrobn\u011b popisuje <strong><a href=\"https:\/\/kicthermal.com\/wp-content\/uploads\/2019\/03\/Optimized-Reflow-Profiling-to-Minimize-Voiding-v3-Final.pdf\">\u010cl\u00e1nek spole\u010dnosti KIC o profilov\u00e1n\u00ed reflow procesu<\/a><\/strong>.<\/li>\n<\/ul>\n<p>Pr\u00e1v\u011b tato kombinace \u2013 \u010dasov\u00e1n\u00ed podtlaku a stabiln\u00ed n\u00edzk\u00e1 hladina kysl\u00edku \u2013 je z\u00e1kladem \u00fa\u010dinn\u00e9ho sni\u017eov\u00e1n\u00ed vzniku dutin p\u0159i reflowov\u00e9m p\u00e1jen\u00ed \u010dip\u016f BGA za pou\u017eit\u00ed podtlaku.<\/p>\n<h2 id=\"vacuumreflowvoidreductionprofiletemplate\">\u0160ablona profilu pro sn\u00ed\u017een\u00ed tvorby dutin p\u0159i vakuov\u00e9m reflow<\/h2>\n<p>Pou\u017eijte tento n\u00e1vrh jako v\u00fdchoz\u00ed \u0161ablonu, kterou lze upravit. P\u0159ed uvoln\u011bn\u00edm do v\u00fdroby ov\u011b\u0159te pomoc\u00ed rentgenu.<\/p>\n<p>| Parametr | Doporu\u010den\u00e1 po\u010d\u00e1te\u010dn\u00ed hodnota | Pozn\u00e1mky |<br \/>\n| \u2014\u2014\u2014\u2014\u2014\u2014\u2014 | \u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2013 | \u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014 |<br \/>\n| Hloubka vakua | 5\u201350 mbar | \u010c\u00edm vy\u0161\u0161\u00ed vakuum, t\u00edm v\u011bt\u0161\u00ed je r\u016fst bublin a jejich \u00fanik, ale z\u00e1rove\u0148 se zvy\u0161uje riziko deformace tenk\u00fdch podklad\u016f. |<br \/>\n| Na\u010dasov\u00e1n\u00ed Engage vs. Tliq | Za\u010d\u00edt v rozmez\u00ed Tliq \u22125 a\u017e +5 s   | Ujist\u011bte se, \u017ee je p\u00e1jka roztaven\u00e1; neza\u010d\u00ednejte p\u0159\u00edli\u0161 brzy, aby se z tavidla je\u0161t\u011b intenzivn\u011b neuvol\u0148ovaly t\u011bkav\u00e9 l\u00e1tky. |<br \/>\n| Doba p\u0159idr\u017een\u00ed | 10\u201330 s | U mal\u00fdch BGA sta\u010d\u00ed krat\u0161\u00ed doba p\u0159idr\u017een\u00ed; u BGA s velkou tepelnou hmotnost\u00ed je t\u0159eba del\u0161\u00ed doba. |<br \/>\n| Strategie odvzdu\u0161n\u011bn\u00ed | \u0158\u00edzen\u00e9, 3\u20136 s | Vyhn\u011bte se rychl\u00e9mu odvzdu\u0161n\u011bn\u00ed, kter\u00e9 naru\u0161uje roztavenou p\u00e1jku. |<br \/>\n| Rychlost oh\u0159evu | 1,0\u20131,5 \u00b0C\/s | Vyhn\u011bte se p\u0159\u00edli\u0161 dlouh\u00e9mu udr\u017eov\u00e1n\u00ed teploty, p\u0159i kter\u00e9m doch\u00e1z\u00ed k zachycov\u00e1n\u00ed t\u011bkav\u00fdch l\u00e1tek. |<br \/>\n| TAL | 60\u201390 s | Udr\u017eujte konzistentn\u00ed v\u00fdkon mezi jednotliv\u00fdmi b\u011bhy; zaznamenejte do MES. |<br \/>\n| Maxim\u00e1ln\u00ed teplota | 245\u2013260 \u00b0C | Dodr\u017eujte technick\u00e9 listy jednotliv\u00fdch slo\u017eek a pasty. |<\/p>\n<p>Opat\u0159en\u00ed, kter\u00e1 je t\u0159eba dodr\u017eovat p\u0159i snaze o extr\u00e9mn\u00ed sn\u00ed\u017een\u00ed vzniku dutin p\u0159i reflowov\u00e9 mont\u00e1\u017ei za vysok\u00e9ho vakua:<\/p>\n<ul>\n<li>Sledujte deformaci pouzdra a desky; pokud zaznamen\u00e1te p\u0159\u00edznaky \u201ep\u0159itahov\u00e1n\u00ed p\u00e1jky\u201c nebo \u201ehlava v pol\u0161t\u00e1\u0159i\u201c, sni\u017ete hloubku vakua nebo zkra\u0165te dobu dr\u017een\u00ed o n\u011bkolik sekund a m\u00edrn\u011b zpomalte odvzdu\u0161\u0148ov\u00e1n\u00ed.<\/li>\n<li>Pokud se v bl\u00edzkosti st\u0159ed\u016f podlo\u017eek st\u00e1le vyskytuj\u00ed mezery, posu\u0148te okam\u017eik zapojen\u00ed bl\u00ed\u017ee k Tliq a prodlu\u017ete dobu p\u0159idr\u017een\u00ed o 3\u20135 s; ujist\u011bte se, \u017ee chlazen\u00ed nezp\u016fsobuje k\u0159ehk\u00e9 mezikrystalick\u00e9 trhliny (IMC).<\/li>\n<\/ul>\n<p>Z\u00e1kladn\u00ed informace o faktorech ovliv\u0148uj\u00edc\u00edch profilov\u00e1n\u00ed reflow najdete v na\u0161em intern\u00edm \u00favodn\u00edm pr\u016fvodci <strong><a href=\"https:\/\/www.chuxin-smt.com\/cs\/set-reflow-oven-temperature-profile-for-better-soldering\/\">Jak nastavit teplotn\u00ed profil p\u0159etavovac\u00ed pece pro lep\u0161\u00ed p\u00e1jen\u00ed<\/a><\/strong>.<\/p>\n<h2 id=\"nitrogencontrolandgaseconomy\">\u0158\u00edzen\u00ed spot\u0159eby dus\u00edku a \u00faspora plynu<\/h2>\n<p>Druh\u00fdm pil\u00ed\u0159em je stabiln\u00ed n\u00edzk\u00e1 hladina kysl\u00edku. B\u011bhem obdob\u00ed tekut\u00e9ho stavu a po celou dobu jak\u00e9koli f\u00e1ze vakuov\u00e1n\u00ed se sna\u017ete udr\u017eovat hladinu O\u2082 v rozmez\u00ed 10\u201350 ppm. \u0158\u00edzen\u00ed O\u2082 v uzav\u0159en\u00e9 smy\u010dce dynamicky upravuje pr\u016ftok tak, aby byla udr\u017eov\u00e1na nastaven\u00e1 hodnota, \u010d\u00edm\u017e se omezuje pl\u00fdtv\u00e1n\u00ed plynem.<\/p>\n<p>| Polo\u017eka | C\u00edl nebo p\u0159\u00edklad | Praktick\u00e9 pozn\u00e1mky |<br \/>\n| \u2014\u2014\u2014\u2014\u2014- | \u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014- | \u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014\u2014- |<br \/>\n| Nastaven\u00e1 hodnota O\u2082 | 10\u201350 ppm | Alarm p\u0159i ~50 ppm; p\u0159ekro\u010den\u00ed horn\u00ed mezn\u00ed hodnoty je t\u0159eba pro\u0161et\u0159it. |<br \/>\n| Po\u010d\u00e1te\u010dn\u00ed proplach    | Vysok\u00fd pr\u016ftok po dobu 5\u201310 minut po spu\u0161t\u011bn\u00ed | Pot\u00e9 p\u0159ej\u00edt na udr\u017eovac\u00ed pr\u016ftok, jakmile se hodnota v ppm ust\u00e1l\u00ed. |<br \/>\n| Pr\u016ftok pro \u00fadr\u017ebu | Obvykle 250\u2013750 SCFH | Z\u00e1vis\u00ed na velikosti pece, t\u011bsnosti a \u0161\u00ed\u0159ce desky; regulace v uzav\u0159en\u00e9 smy\u010dce omezuje nadm\u011brn\u00fd pr\u016ftok. Viz p\u0159\u00edru\u010dka spole\u010dnosti Heller k regulaci dus\u00edku (2022). |<br \/>\n| Faktory ovliv\u0148uj\u00edc\u00ed n\u00e1klady | Klapky a t\u011bsn\u011bn\u00ed | Mechatronick\u00e9 klapky a lep\u0161\u00ed t\u011bsn\u011bn\u00ed sni\u017euj\u00ed spot\u0159ebu N\u2082, jak ukazuje zpr\u00e1va Rehm Review 2024. |<\/p>\n<p>Pokud prov\u00e1d\u00edte modelov\u00e1n\u00ed celkov\u00fdch n\u00e1klad\u016f na vlastnictv\u00ed (TCO), za\u010dn\u011bte s hodnotou SCFH va\u0161eho dodavatele p\u0159i c\u00edlov\u00e9 hodnot\u011b v ppm, vyn\u00e1sobte ji jednotkovou cenou dus\u00edku a p\u0159ipo\u010dt\u011bte rozd\u00edl v pr\u016ftoku vypl\u00fdvaj\u00edc\u00ed z prodlou\u017een\u00ed doby udr\u017eov\u00e1n\u00ed vakua o n\u011bkolik sekund. Z\u00e1kladn\u00ed informace najdete v na\u0161em <strong><a href=\"https:\/\/www.chuxin-smt.com\/cs\/slug-a-comprehensive-guide-to-nitrogen-in-reflow-soldering\/\">Komplexn\u00ed pr\u016fvodce po dus\u00edku p\u0159i p\u00e1jen\u00ed metodou reflow<\/a><\/strong>.<\/p>\n<h2 id=\"absolderpastecomparisonplanandexampleresults\">Pl\u00e1n srovn\u00e1n\u00ed p\u00e1jec\u00edch past A\/B a p\u0159\u00edklady v\u00fdsledk\u016f<\/h2>\n<p>Pokud zainteresovan\u00e9 strany po\u017eaduj\u00ed d\u016fkaz, prove\u010fte kontrolovan\u00fd A\/B test. V\u0161echny parametry nechte stejn\u00e9, s v\u00fdjimkou chemick\u00e9ho slo\u017een\u00ed pasty.<\/p>\n<p>Z\u00e1klady designu:<\/p>\n<ul>\n<li>N\u00e1hodn\u011b st\u0159\u00eddejte desky mezi vkl\u00e1d\u00e1n\u00edm A a vkl\u00e1d\u00e1n\u00edm B. Udr\u017eujte \u0161ablonu, um\u00edst\u011bn\u00ed, profil, podtlak a koncentraci O\u2082 v ppm na konstantn\u00ed \u00farovni.<\/li>\n<li>Vzorkov\u00e1n\u00ed: \u226550 BGA na ka\u017ed\u00e9 v\u011btvi nap\u0159\u00ed\u010d \u22655 deskami; kontrola pomoc\u00ed 2D rentgenu s pevn\u011b nastavenou prahovou hodnotou pro stupn\u011b \u0161edi. U sporn\u00fdch v\u00fdsledk\u016f prove\u010fte nam\u00e1tkov\u00e9 kontroly pomoc\u00ed 3D CT.<\/li>\n<li>Metriky: pr\u016fm\u011brn\u00fd po\u010det ne\u00fasp\u011b\u0161n\u00fdch % na m\u00ed\u010d, histogram rozlo\u017een\u00ed a procentu\u00e1ln\u00ed pod\u00edl m\u00ed\u010d\u016f nad va\u0161\u00ed intern\u00ed horn\u00ed hranic\u00ed (nap\u0159. 15%). K porovn\u00e1n\u00ed pr\u016fm\u011br\u016f pou\u017eijte t-test nebo ANOVA; p\u0159\u00edpadn\u011b KS-test pro rozlo\u017een\u00ed.<\/li>\n<\/ul>\n<p>Syntetick\u00fd p\u0159\u00edklad pouze pro ilustraci:<\/p>\n<p>| Stav | Pr\u016fm\u011brn\u00e1 dutina % | SD  | % kuli\u010dek &gt;15% | Vakuum  | Dr\u017een\u00ed | O2     | TAL  | \u0160pi\u010dka   |<br \/>\n| \u2014\u2014\u2014 | \u2014\u2014\u2014\u2013 | \u2014 | \u2014\u2014\u2014\u2014\u2014 | \u2014\u2014- | \u2014- | \u2014\u2014 | \u2014- | \u2014\u2014 |<br \/>\n| Paste A   | 14,8 | 4,2 | 38 | 30 mbar | 15 s | 20 ppm | 75 s | 250 \u00b0C |<br \/>\n| Pasta B   | 9,6 | 3,5 | 12 | 30 mbar | 15 s | 20 ppm | 75 s | 250 \u00b0C |<\/p>\n<p>V\u00fdklad: P\u0159i identick\u00fdch nastaven\u00edch pro sn\u00ed\u017een\u00ed obsahu dutin p\u0159i vakuov\u00e9m reflow vykazuje \u201cpasta B\u201d statisticky v\u00fdznamn\u00e9 sn\u00ed\u017een\u00ed pr\u016fm\u011brn\u00e9 hodnoty ve srovn\u00e1n\u00ed s \u201cpastou A\u201d (p &lt; 0,001, t-test pro dva v\u00fdb\u011bry). V\u017edy ov\u011b\u0159te tak\u00e9 praktick\u00fd v\u00fdznam \u2013 v\u0161imn\u011bte si poklesu po\u010dtu kuli\u010dek p\u0159ekra\u010duj\u00edc\u00edch horn\u00ed mez 15%.<\/p>\n<p>Ozna\u010dte sv\u016fj datov\u00fd soubor jako produk\u010dn\u00ed nebo pilotn\u00ed, uve\u010fte metodu kontroly a archivujte nezpracovan\u00e9 sn\u00edmky. Osv\u011bd\u010den\u00e9 postupy pro profilov\u00e1n\u00ed podporuj\u00edc\u00ed tento DOE najdete na adrese <strong><a href=\"https:\/\/kicthermal.com\/wp-content\/uploads\/2019\/03\/Optimized-Reflow-Profiling-to-Minimize-Voiding-v3-Final.pdf\">Optimalizovan\u00fd profilovac\u00ed pap\u00edr spole\u010dnosti KIC (2019)<\/a><\/strong>.<\/p>\n<h2 id=\"xraymeasurementandspcforauditreadiness\">Rentgenov\u00e9 m\u011b\u0159en\u00ed a statistick\u00e1 kontrola kvality (SPC) pro zaji\u0161t\u011bn\u00ed p\u0159ipravenosti na audit<\/h2>\n<p>Metoda a odb\u011br vzork\u016f<\/p>\n<ul>\n<li>Za\u010dn\u011bte s kalibrovanou 2D laminografi\u00ed pro detekci dutin v oblasti jednotliv\u00fdch kuli\u010dek. Typick\u00e9 bezolovnat\u00e9 BGA na desk\u00e1ch o tlou\u0161\u0165ce 1,6 mm se p\u0159i nap\u011bt\u00ed 80\u2013120 kV a m\u00edrn\u00e9m proudu zobrazuj\u00ed jasn\u011b; nastaven\u00ed p\u0159izp\u016fsobte sv\u00e9mu syst\u00e9mu a up\u00ednac\u00edmu za\u0159\u00edzen\u00ed. V hrani\u010dn\u00edch p\u0159\u00edpadech nebo p\u0159i auditech ze strany z\u00e1kazn\u00edk\u016f zva\u017ete 3D CT vy\u0161et\u0159en\u00ed.<\/li>\n<li>Po\u010d\u00e1te\u010dn\u00ed kvalifikace: n \u2265 50 desek s plo\u0161n\u00fdmi spoji (BGA) na ka\u017edou podm\u00ednku. SPC ve v\u00fdrob\u011b: odeb\u00edrejte vzorky po p\u011bti desk\u00e1ch z ka\u017ed\u00e9 \u0161ar\u017ee nebo sm\u011bny, dokud se stav nestabilizuje, pot\u00e9 p\u0159ejd\u011bte k periodick\u00e9mu ov\u011b\u0159ov\u00e1n\u00ed.<\/li>\n<\/ul>\n<p>P\u0159ijet\u00ed a zaznamen\u00e1v\u00e1n\u00ed do grafu<\/p>\n<ul>\n<li>Sledujte pr\u016fm\u011brn\u00fd po\u010det pr\u00e1zdn\u00fdch % na kouli a pod\u00edl koul\u00ed, kter\u00e9 p\u0159ekra\u010duj\u00ed va\u0161i intern\u00ed horn\u00ed hranici (USL) (nap\u0159. 15%).<\/li>\n<li>Vytvo\u0159te grafy typu X-bar a R pro pr\u016fm\u011brnou hodnotu %, v\u010detn\u011b st\u0159edov\u00e9 \u010d\u00e1ry a kontroln\u00edch mez\u00ed odvozen\u00fdch z va\u0161ich zku\u0161ebn\u00edch s\u00e9ri\u00ed. Vedejte si p\u0159ehled atribut\u016f pro %&gt;15% jako rychl\u00fd ukazatel stavu.<\/li>\n<\/ul>\n<p>Dokumentace<\/p>\n<ul>\n<li>V ka\u017ed\u00e9 zpr\u00e1v\u011b uve\u010fte typ rentgenov\u00e9ho za\u0159\u00edzen\u00ed, hodnoty kV\/\u00b5A, zv\u011bt\u0161en\u00ed, prahov\u00e9 hodnoty segmentace, analytick\u00fd software a ID oper\u00e1tora. P\u0159i\u0159a\u010fte v\u00fdsledky \u201ep\u0159ijato\/zam\u00edtnuto\u201c ke t\u0159\u00edd\u00e1m podle normy IPC-A-610 a k va\u0161im intern\u00edm c\u00edl\u016fm pro BGA. Uchov\u00e1vejte nezpracovan\u00e9 sn\u00edmky a v\u00fdstupy anal\u00fdzy pro \u00fa\u010dely audit\u016f.<\/li>\n<\/ul>\n<h2 id=\"troubleshootingchecklist\">Kontroln\u00ed seznam pro \u0159e\u0161en\u00ed probl\u00e9m\u016f<\/h2>\n<ul>\n<li>Pasta a skladov\u00e1n\u00ed: zkontrolujte \u0161ar\u017ei, st\u00e1\u0159\u00ed a zp\u016fsob manipulace; v p\u0159\u00edpad\u011b pot\u0159eby p\u0159ejd\u011bte na chemick\u00e9 slo\u017een\u00ed s n\u00edzkou t\u011bkavost\u00ed a n\u00edzk\u00fdm obsahem vzduchov\u00fdch bublin.<\/li>\n<li>Pr\u016fb\u011bh a \u010dasov\u00e1n\u00ed: zkr\u00e1tit dobu p\u016fsoben\u00ed; zajistit TAL 60\u201390 s; posunout zapnut\u00ed vakua bl\u00ed\u017ee k Tliq; prodlou\u017eit dobu v\u00fddr\u017ee o 3\u20135 s, pokud p\u0159etrv\u00e1vaj\u00ed centr\u00e1ln\u00ed dutiny.<\/li>\n<li>Stabilita O\u2082: ov\u011b\u0159te fungov\u00e1n\u00ed regulace v uzav\u0159en\u00e9 smy\u010dce; zkontrolujte t\u011bsnost, t\u011bsn\u011bn\u00ed dve\u0159\u00ed a clony; v p\u0159\u00edpad\u011b podez\u0159en\u00ed na odchylku prove\u010fte rekalibraci senzor\u016f.<\/li>\n<li>Deformace a vytahov\u00e1n\u00ed p\u00e1jky: zmen\u0161ete hloubku vakua nebo dobu udr\u017eov\u00e1n\u00ed vakua, zpomalte odvzdu\u0161\u0148ov\u00e1n\u00ed, sni\u017ete \u0161pi\u010dkovou teplotu o n\u011bkolik stup\u0148\u016f a p\u0159idejte podlo\u017eku pod desku.<\/li>\n<li>Kontrola: sjednotit prahov\u00e9 hodnoty a pro\u0161kolit obsluhu; zav\u00e9st 3D nam\u00e1tkov\u00e9 kontroly v p\u0159\u00edpadech, kdy jsou v\u00fdsledky 2D nejednozna\u010dn\u00e9.<\/li>\n<\/ul>\n<h2 id=\"practicalmicroexampleusingsmcoltdoven\">Praktick\u00fd kr\u00e1tk\u00fd p\u0159\u00edklad s vyu\u017eit\u00edm pece spole\u010dnosti S&amp;M Co. Ltd.<\/h2>\n<p>Jedn\u00e1 se pouze o p\u0159\u00edklad, nikoli o tvrzen\u00ed o v\u00fdkonu. Na syst\u00e9mu pro reflow s vakuovou podporou, srovnateln\u00e9m s vakuov\u00fdm modelem spole\u010dnosti S&amp;M Co. Ltd., nastavte c\u00edlovou hodnotu vakua na 30 mbar a za\u010dn\u011bte na teplot\u011b likvidu. Vydr\u017ete 15 s, pot\u00e9 vypus\u0165te vzduch b\u011bhem 4\u20135 s. Udr\u017eujte dus\u00edk na \u00farovni 20\u201330 ppm O\u2082 pomoc\u00ed regul\u00e1toru s uzav\u0159enou smy\u010dkou a nastavte alarm O\u2082 na 50 ppm. Pou\u017eijte profil s postupn\u00fdm n\u00e1b\u011bhem na \u0161pi\u010dku s dobou TAL kolem 75 s a \u0161pi\u010dkovou teplotou 250 \u00b0C, p\u0159i\u010dem\u017e dodr\u017eujte limity sou\u010d\u00e1stek. Zaznamenejte tlak v komo\u0159e, ppm O\u2082 a teplotn\u00ed profil do MES spolu s identifik\u00e1tory \u0161ar\u017ee, pasty a \u0161ablony.<\/p>\n<p>Provozn\u00ed pokyny: Pokud rentgenov\u00fd sn\u00edmek uk\u00e1\u017ee shluky dutin v t\u011b\u017ei\u0161ti, posu\u0148te okam\u017eik zapojen\u00ed o 2\u20133 s d\u0159\u00edve a prodlu\u017ete dobu dr\u017een\u00ed na 18\u201320 s. Pokud se objev\u00ed zn\u00e1mky deformace, zkra\u0165te dobu dr\u017een\u00ed na ~12 s nebo sni\u017ete hloubku vakua na ~40 mbar a zpomalte odv\u011btr\u00e1v\u00e1n\u00ed o ~1 s. Z\u00e1klady profilov\u00e1n\u00ed reflow najdete v na\u0161\u00ed intern\u00ed p\u0159\u00edru\u010dce <strong><a href=\"https:\/\/www.chuxin-smt.com\/cs\/slug-mastering-the-pcb-reflow-temperature-profile-2\/\">Zvl\u00e1dnut\u00ed teplotn\u00edho profilu reflowu desek plo\u0161n\u00fdch spoj\u016f<\/a><\/strong>.<\/p>\n<h2 id=\"nextstepsandresources\">Dal\u0161\u00ed kroky a zdroje<\/h2>\n<ul>\n<li>Prove\u010fte A\/B test dvou vybran\u00fdch past a vyberte v\u00edt\u011bznou variantu s dokumentovan\u00fdm statistick\u00fdm kontroln\u00edm pl\u00e1nem (SPC).<\/li>\n<li>Recepturu v peci uzamkn\u011bte pomoc\u00ed \u0161ablon pro vakuum a dus\u00edk a pot\u00e9 ji zpevn\u011bte pomoc\u00ed alarm\u016f pro koncentraci O\u2082 v ppm a tlak v komo\u0159e.<\/li>\n<li>Chcete-li se dozv\u011bd\u011bt v\u00edce o strategii v oblasti dus\u00edku a jej\u00edch p\u0159\u00ednosech, prostudujte si na\u0161e \u00favodn\u00ed materi\u00e1ly na t\u00e9ma <strong><a href=\"https:\/\/www.chuxin-smt.com\/cs\/slug-a-comprehensive-guide-to-nitrogen-in-reflow-soldering\/\">dus\u00edk p\u0159i p\u00e1jen\u00ed metodou reflow<\/a><\/strong> a <strong><a href=\"https:\/\/www.chuxin-smt.com\/cs\/nitrogen-systems-reflow-ovens-benefits-solder-quality\/\">v\u00fdhody dus\u00edkov\u00e9ho syst\u00e9mu pro kvalitu p\u00e1jen\u00ed<\/a><\/strong>.<\/li>\n<\/ul>\n<p>Literatura a dal\u0161\u00ed zdroje<\/p>\n<ul>\n<li>Souvislosti t\u00fdkaj\u00edc\u00ed se norem shrnut\u00e9 v <strong><a href=\"https:\/\/smta.org\/resource\/collection\/E979F6B4-288F-46CD-A049-369146AF88F2\/SMTA-CTEA-Expo-2021-10_Tony_Lentz_Voiding_Summary.pdf\">P\u0159ehled krit\u00e9ri\u00ed pro zru\u0161en\u00ed certifikace SMTA od Tonyho Lentze (2021)<\/a><\/strong>; pod\u00edvejte se na ofici\u00e1ln\u00ed <strong><a href=\"https:\/\/www.ipc.org\/TOC\/IPC-7095E_toc.pdf\">IPC\u20117095E<\/a><\/strong> a <strong><a href=\"https:\/\/www.ipc.org\/TOC\/IPC-J-STD-001J_TOC.pdf\">J\u2011STD\u2011001J<\/a><\/strong> pro kone\u010dn\u00e9 po\u017eadavky.<\/li>\n<li>Profilovac\u00ed p\u00e1ky pro men\u0161\u00ed mezery v <strong><a href=\"https:\/\/kicthermal.com\/wp-content\/uploads\/2019\/03\/Optimized-Reflow-Profiling-to-Minimize-Voiding-v3-Final.pdf\">Optimalizovan\u00fd profilovac\u00ed pap\u00edr spole\u010dnosti KIC (2019)<\/a><\/strong>.<\/li>\n<li>Strategie regulace dus\u00edku v <strong><a href=\"https:\/\/hellerindustries.com\/wp-content\/uploads\/2022\/04\/nitrogencontrol-1.pdf\">Heller\u016fv pr\u016fvodce pod\u00e1n\u00edm \u017e\u00e1dosti (2022)<\/a><\/strong> a v kontextu s n\u00edzk\u00fdm obsahem ppm v <strong><a href=\"https:\/\/www.rehm-group.com\/fileadmin\/user_upload\/PDF_EN\/Review_EN_1Ausgabe_2024_Ansicht.pdf\">Rehmova recenze 2024<\/a><\/strong>.<\/li>\n<\/ul>\n<p>M\u00edrn\u00e1 v\u00fdzva k akci: Pokud se zab\u00fdv\u00e1te anal\u00fdzou vakuov\u00fdch segment\u016f, regulac\u00ed tlaku a monitorov\u00e1n\u00edm kysl\u00edku v r\u00e1mci jednoho pracovn\u00edho postupu, prohl\u00e9dn\u011bte si technick\u00e9 p\u0159\u00edru\u010dky spole\u010dnosti S&amp;M Co. Ltd., na kter\u00e9 odkazujeme v\u00fd\u0161e, kde najdete praktick\u00e9 podrobnosti k nastaven\u00ed profilov\u00e1n\u00ed a regulace dus\u00edku.<\/p>","protected":false},"excerpt":{"rendered":"<p>Praktick\u00fd pr\u016fvodce p\u0159etaven\u00edm ve vakuu a \u0159\u00edzen\u00edm dus\u00edkem pro sn\u00ed\u017een\u00ed pr\u00e1zdn\u00fdch m\u00edst v BGA p\u00e1jk\u00e1ch. Obsahuje recepty pro vakuov\u00e9 p\u00e1jen\u00ed, pl\u00e1n test\u016f A\/B pasty a validaci SPC.<\/p>","protected":false},"author":3,"featured_media":4149,"comment_status":"closed","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"categories":[53,52],"tags":[],"class_list":["post-4150","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-enterprise-information","category-product-information"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/posts\/4150","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/comments?post=4150"}],"version-history":[{"count":0,"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/posts\/4150\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/media\/4149"}],"wp:attachment":[{"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/media?parent=4150"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/categories?post=4150"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/cs\/wp-json\/wp\/v2\/tags?post=4150"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}