{"id":5253,"date":"2026-08-23T12:00:53","date_gmt":"2026-08-23T04:00:53","guid":{"rendered":"https:\/\/www.chuxin-smt.com\/ultimate-guide-to-smt-pick-and-place-machines-process-programming-and-precision\/"},"modified":"2026-08-23T12:00:54","modified_gmt":"2026-08-23T04:00:54","slug":"ultimate-guide-to-smt-pick-and-place-machines-process-programming-and-precision","status":"publish","type":"post","link":"https:\/\/www.chuxin-smt.com\/es\/ultimate-guide-to-smt-pick-and-place-machines-process-programming-and-precision\/","title":{"rendered":"Ultimate Guide to SMT Pick and Place Machines: Process, Programming, and Precision"},"content":{"rendered":"
\n

Publicado:<\/strong> 10 August 2026
\n Tiempo de lectura:<\/strong> 11 minutes
\n Reviewer:<\/strong> [Insert verified reviewer name], [Insert verified reviewer credentials]<\/p>\n<\/blockquote>\n

\n

Why PCB Pick and Place Precision Matters in 2026<\/h2>\n

That moment when your AOI flags 40 boards with the same offset error? Not fun. One misplaced BGA can snowball into hours of rework, scrapped assemblies, and a delivery deadline that slips further by the minute.<\/p>\n

In 2026, the stakes are higher than ever. Consumer gadgets keep shrinking. Lead-free solder demands tighter process windows. And the 0201 and 01005 components everyone uses now? They leave almost zero room for placement error.<\/p>\n

Here’s what the numbers tell us. Strong SMT lines hit around 99.5% first-pass yield<\/a>. But many facilities still sit at 98.2 to 98.8%, which sounds acceptable until you multiply it across thousands of boards per shift. That gap between good and great? It shows up directly in your cost per board and your rework labor bills.<\/p>\n

Placement accuracy sits at the heart of all of this. A pcb pick and place process that drifts even 20 to 30 microns on fine-pitch parts can create opens, bridges, or tombstoning that ends up in test and fails there too. Downstream inspection catches what went wrong, but it cannot fix it without touching the board again.<\/p>\n

For production managers and procurement leads, this connects to three things that matter every single day: keeping throughput on track, cutting defect escape rates, and making sure new equipment actually plays nice with what you already have running.<\/p>\n

This guide walks through how smt pick and place machines work, what accuracy really means in practice, how to program them properly, and how to choose the right platform for your line. Whether you are running consumer boards or aerospace assemblies, the principles are the same: get placement right the first time, or pay for it later.<\/p>\n

Let’s get into it.<\/p>\n

\"Smt<\/figure>\n<\/p>\n

About the Author<\/h2>\n

Jace Liu brings hands-on experience in SMT line optimization, equipment programming, and production integration. With a background in electronics manufacturing and process engineering, he has worked directly with pick-and-place setup, feeder configuration, and yield improvement across high-volume assembly environments.<\/p>\n

His focus on precision placement and production reliability gives this guide a practical edge. Rather than just quoting machine specs, the advice here comes from watching lines run, troubleshooting placement drift, and working through the real trade-offs between speed, accuracy, and changeover time.<\/p>\n

When not writing about SMT processes, Jace works with manufacturers to bridge the gap between engineering intent and shop-floor execution.<\/p>\n

\n

How SMT Pick and Place Machines Work<\/h2>\n

Think of a pcb pick and place robot as a very fast, very precise arm that does one thing over and over: picks up a component, checks it, and puts it exactly where it needs to go on your board.<\/p>\n

The cycle breaks down into four steps. First, the feeder delivers a component from its reel or tray to the pick position. Second, a camera snaps a shot of the part while it’s still on the nozzle. Third, the machine compares what it sees to where the part should be, then calculates any needed shift or rotation. Fourth, the head moves to the target coordinates and places the component onto the solder paste.<\/p>\n

This all happens in under a second per part. On a fast line, you’re looking at 50,000 to over 100,000 placements per hour depending on the machine class.<\/p>\n

\"Close<\/figure>\n<\/p>\n

The hardware does the heavy lifting<\/strong><\/p>\n

Each piece of the machine plays a specific role in keeping placement accurate:<\/p>\n

| Component | What it does |
\n|———-|————-|
\n| Feeders | Hold reels or trays of components and index them to the pick position |
\n| Nozzles | Vacuum pickup tools that grip components; different sizes for different parts |
\n| Cameras | Capture component images for vision correction before placement |
\n| Motion system | X, Y, Z and rotation axes move the head to exact coordinates |
\n| Conveyor | Moves the PCB into position and holds it steady during placement |<\/p>\n

\n

Expert Tip:<\/strong> Modern vision systems<\/a> do more than just check if a part is present. They measure shift and rotation on-the-fly, then apply correction before the nozzle releases the component. For 0201 and 01005 parts, this on-the-fly correction is what keeps pcb pick and place accuracy tight, even when the feeder or component has slight variation.<\/p>\n<\/blockquote>\n

Two machine classes, different trade-offs<\/strong><\/p>\n

Not every smt pick and place machine process works the same way. High-speed chip shooters prioritize speed for standard components like resistors and capacitors. They run through thousands of small parts per hour but typically handle a narrower component range.<\/p>\n

Flexible placement systems, on the other hand, trade some raw speed for the ability to handle larger parts, odd-form components, and mixed technology boards. A single flexible machine can place everything from tiny 01005 passives up to large connectors or modules.<\/p>\n

Most high-volume lines run a combination: a chip shooter for the high-mix, high-volume small parts, and a flexible machine for the larger or more complex components.<\/p>\n

For manufacturers using Shenzhen Chuxin Electronic Equipment Co., Ltd. solutions, the reflow oven and placement system are designed to work together as a complete line, which helps keep coordinate accuracy consistent from placement through the solder reflow stage.<\/p>\n

Choosing between these two approaches comes down to your board mix and production volume. If your line runs mostly the same small components at high speed, a chip shooter makes sense. If you’re dealing with frequent changeovers or a wide variety of part sizes, flexibility wins.<\/p>\n

The End-to-End PCB Pick and Place Process<\/h2>\n

The pcb pick and place process does not start when the machine starts running. It starts weeks earlier with the data files that tell your machine where every single part goes.<\/p>\n

Let me walk through the full sequence so you can see where things actually go wrong, and where the best checkpoints are to catch problems before they become expensive.<\/p>\n

Phase 1: Before you load a single board<\/strong><\/p>\n

Every solid SMT run begins with three files that must agree with each other. The Bill of Materials lists every component. The centroid file contains X\/Y coordinates, rotation, and which side of the board each part goes on. The Gerber files define the board design and pad locations. When these mismatch, your smt pick and place machine process will place parts in the wrong spots, or reject programs that cannot find matching footprint data.<\/p>\n

Once your data checks out, operators set up feeders by matching component reels to the feeder map in the program. Wrong feeder assignment is one of the most common setup errors, and it usually comes from rushing this step. Nozzle selection matters too. Using the wrong nozzle for a package type can cause pickup failures or inconsistent placement pressure.<\/p>\n

Before the first board runs, operators also verify fiducial marks and set the board origin. If the machine does not know exactly where the board sits in its coordinate system, every placement will be off by the same amount. That systematic error is brutal because it passes visual inspection until someone measures it.<\/p>\n

Phase 2: The placement run<\/strong><\/p>\n

The pcb pick and place robot picks components from feeders, checks them with its vision system, and places each part onto the board. This sounds simple, but the accuracy of this step depends heavily on what happened upstream. Stencil printing quality<\/a> affects whether placed components stay where you put them. If the paste volume is wrong, parts can shift or tombstone during reflow even when placement was perfect.<\/p>\n

Board support matters. If boards flex or shift during placement, components end up off pads even with a calibrated machine. Conveyor setup and clamp positioning need attention before every product changeover.<\/p>\n

Phase 3: First article inspection<\/strong><\/p>\n

Here is where most lines either catch problems or let them escape. Right after placement but before reflow, an AOI system checks the board for missing parts, polarity errors, rotation mistakes, and placement offset. Operators should verify polarity on connectors and polarized components manually since AOI sometimes misses orientation issues on unfamiliar package types.<\/p>\n

For BGA and QFN packages, X-ray inspection is the only way to confirm solder deposition underneath the part. Optical inspection cannot see what is hidden under those packages.<\/p>\n

\"Ems<\/figure>\n<\/p>\n

| Checkpoint | What to verify |
\n|————|—————-|
\n| Data files | BOM, centroid, and Gerber all match |
\n| Feeder setup | Reel positions match program assignments |
\n| Nozzle selection | Correct type for each component package |
\n| Fiducials | Clear, readable, and properly taught |
\n| Board support | Clamps positioned, no flex during placement |
\n| First article | AOI results, plus manual polarity spot-check |
\n| Hidden joints | X-ray for BGA, QFN, and other opaque packages |<\/p>\n

Phase 4: After reflow<\/strong><\/p>\n

Placement is done, but the job is not finished until solder cools. A second AOI pass after reflow catches any components that shifted during the thermal cycle. It also checks solder joint quality, which can reveal whether the placement was the problem or the reflow profile was the problem.<\/p>\n

The whole process loops back when you run the next product. Each changeover is a chance to introduce new errors if setup discipline slips. Keeping a standard checklist for every product introduction is one of the easiest ways to prevent the common mistakes that eat into first-pass yield.<\/p>\n

Programming the Machine and Preparing the PCB Pick and Place File<\/h2>\n

The pcb pick and place process does not start when you press the green button on the machine. It starts with a file, and getting that file wrong is where a lot of expensive problems begin.<\/p>\n

Your machine needs five things from the data you feed it: component coordinates (X and Y positions), rotation angle, reference designators (R1, C5, U3 and so on), feeder positions, and package type information. Every one of these has to line up perfectly, or the machine will happily place parts in the wrong spots and do it very quickly.<\/p>\n

Common file formats and what goes wrong with them<\/strong><\/p>\n

Most shops use CSV or TXT files for pcb pick and place file format work. The columns are usually something like Designator, X, Y, Rotation, Side. Simple, readable, and editable in any spreadsheet tool. ODB++ and IPC-2581 show up in more advanced digital manufacturing setups, where the idea is to keep BOM, Gerber, and placement data in one package so nothing drifts out of sync.<\/p>\n

Here is where things get messy. When you export from your CAD tool, several fields tend to break in predictable ways:<\/p>\n

| Field | Common problem |
\n|——-|—————-|
\n| Origin\/coordinates | Board origin vs grid origin confusion shifts every placement by the same amount |
\n| Rotation | Wrong direction convention flips parts 180 degrees |
\n| Side\/layer | Missing or wrong side data causes bottom-side parts to go on top |
\n| Units | Mixing millimeters and inches is more common than you would think |
\n| Designators | Must match the BOM exactly or parts get assigned to the wrong slots |<\/p>\n

CSV files are nice because you can open them in Excel or Google Sheets and spot-check before loading. We always recommend a visual scan of at least five components against the board layout before you trust the file on a live run.<\/p>\n

How your programming choices hit the bottom line<\/strong><\/p>\n

The way you organize the pcb pick and place file affects three things: cycle time, feeder changeovers, and error rates on mixed boards.<\/p>\n

Organizing feeders by component height and package type reduces head travel. Placing similar parts next to each other means the nozzle does not have to reach across the board repeatedly. Splitting top and bottom side files (like KiCad supports) simplifies programming for two-sided assemblies and cuts down on manual edits.<\/p>\n

For Shenzhen Chuxin Electronic Equipment Co., Ltd. lines, the placement system integrates with their reflow ovens as a matched pair, so programming data stays consistent<\/a> from placement through the thermal cycle. That alignment matters when you are chasing micron-level accuracy across thousands of boards per shift.<\/p>\n

Before you load any program, verify origin, rotation direction, and units one more time. That 30-second check can save hours of rework.<\/p>\n

Precision, Tolerances, and Accuracy<\/h2>\n

Here’s where things get tricky. When machine vendors list specs, they usually show what the equipment CAN do under perfect lab conditions. But your factory floor? That’s a different world.<\/p>\n

Let me break down three terms that get confused all the time.<\/p>\n

Accuracy<\/strong> means how close your machine gets to the target position on average. Repeatability<\/strong> means how consistently it hits the same spot across hundreds or thousands of placements. And tolerance<\/strong>? That’s the acceptable window, the maximum deviation allowed before a board fails inspection.<\/p>\n

A machine rated at \u00b125 \u00b5m accuracy sounds solid. But real-world performance depends on factors the spec sheet does not show: feeder wear over time, nozzle condition, vacuum integrity, and whether your fiducial marks are clean and readable.<\/p>\n

What different packages actually require<\/strong><\/p>\n

Package size drives how tight your tolerances need to be. Here’s the practical breakdown:<\/p>\n

| Package Type | Typical Tolerance Requirement |
\n|————–|——————————|
\n| 0402\/0603 passives | \u00b150 \u00b5m standard |
\n| 0201\/01005 passives | \u00b115 to 25 \u00b5m on modern lines |
\n| QFN\/Fine-pitch ICs | \u00b130 \u00b5m minimum |
\n| BGA with 0.3 mm pitch | \u00b125 \u00b5m for reliable solder joints |<\/p>\n

\n

Pro Insight:<\/strong> There’s a big gap between nominal placement accuracy and what you actually get on the shop floor. Advertised specs assume new nozzles, calibrated feeders, and perfect fiducials. In production, feeder wear, nozzle erosion, and dirty fiducial marks can push real-world repeatability 10 to 15 \u00b5m worse than the spec sheet. That’s why top facilities run calibration verification every shift change, not just during scheduled maintenance.<\/p>\n<\/blockquote>\n

The calibration discipline that separates good lines from great ones<\/strong><\/p>\n

Want to know the secret behind lines hitting that 99.5% first-pass yield? Most of it comes down to maintenance and verification frequency.<\/p>\n

The facilities pulling ahead in 2026 run three checks religiously. First, daily nozzle vacuum verification keeps pickup stability tight. Second, weekly feeder alignment and indexing checks catch drift before it becomes a defect. Third, monthly certified calibration board runs confirm the machine still performs as rated.<\/p>\n

When machines start drifting out of spec, repeatability usually degrades first. Accuracy can still look fine on average, but the spread gets wider. That’s the warning sign before you start seeing offset defects escape to AOI.<\/p>\n

The real takeaway? Machine accuracy specs tell you capability. Your calibration and maintenance program tells you what you actually get day to day.<\/p>\n

How to Optimize Placement Quality and Troubleshoot Defects<\/h2>\n

The pcb pick and place process does not end when your machine finishes running. Defects that escape to test, or worse, to the customer, usually trace back to a handful of root causes that are predictable if you know where to look.<\/p>\n

Common Defects and Where They Come From<\/strong><\/p>\n

Missing parts, skew, rotation errors, and tombstoning account for most placement escapes. Here’s the practical breakdown that works in most shops:<\/p>\n

| Defect Type | Most Likely Cause |
\n|————|——————-|
\n| Missing part | Pickup failure, empty feeder, nozzle wear |
\n| Skew or rotation | Wrong rotation in program, feeder indexing error |
\n| Offset or misalignment | Fiducial error, board origin shift, vision threshold |
\n| Tombstoning | Uneven paste, thermal imbalance during reflow |
\n| Upside-down part | Polarity definition error, BOM mismatch |<\/p>\n

Most of these look like machine problems at first. But when you dig in, the real cause often sits upstream: a paste volume issue, a feeder that drifted, or a program that was never verified against the actual board.<\/p>\n

Root Causes Cluster in Four Places<\/strong><\/p>\n

When troubleshooting gets messy, it helps to think about where the problem actually starts. Most placement defects trace back to one of four areas:<\/p>\n

    \n
  1. The machine and its setup<\/strong> – Program errors, calibration drift, worn mechanical parts<\/li>\n
  2. The feeder system<\/strong> – Wrong reel position, worn tape pockets, poor indexing<\/li>\n
  3. The nozzle and pickup<\/strong> – Wrong nozzle type, worn tip, weak vacuum<\/li>\n
  4. Upstream processes<\/strong> – Paste volume problems, board flex, fiducial quality<\/li>\n<\/ol>\n

    For Shenzhen Chuxin Electronic Equipment Co., Ltd. lines, the integration between placement and reflow matters here. A placement that looks fine can tombstone if the reflow profile has hot or cold spots that the oven does not compensate for.<\/p>\n

    Checks That Actually Reduce Escapes<\/strong><\/p>\n

    Rather than waiting for AOI to catch problems, shift your approach upstream. SPI catches paste issues before they become solder defects. Placement-machine vision catches pickup failures before the nozzle moves. First-article inspection catches program errors before you run a full shift.<\/p>\n

    For high-volume lines running 0201 or 01005 parts, adding closed-loop feedback between SPI<\/a> and your placement machine cuts repeat defect patterns faster than waiting for AOI to flag the same issue for the hundredth time.<\/p>\n

    One practical step: compare your reject images week over week. If the same defect type shows up more than twice, there is a root cause worth fixing rather than a random variation to accept.<\/p>\n

    The most valuable checks are daily nozzle vacuum verification, weekly feeder alignment inspection, and periodic fiducial calibration using a certified test board. This approach catches drift before it becomes scrap, which is exactly where you want to operate.<\/p>\n

    Choosing the Right Machine for High-Volume SMT Lines<\/h2>\n

    Not all SMT lines need the same machine. Picking the wrong platform wastes budget, creates integration headaches, and leaves your operators fighting the equipment instead of running boards.<\/p>\n

    Here’s how to match the machine class to what you’re actually building.<\/p>\n

    Three machine classes, one job done differently<\/strong><\/p>\n

    | Machine Class | Best For | Speed (CPH) | Accuracy | Component Range |
    \n|————–|———-|————-|———-|—————–|
    \n| High-speed chip shooter | Consumer electronics, high-volume passives | 50,000 to 100,000+ | \u00b125 to 35 \u00b5m | 01005 to 0402, small ICs |
    \n| Flexible placement system | Mixed-technology, changeover-heavy lines | 20,000 to 50,000 | \u00b115 to 25 \u00b5m | 01005 to odd-form, large connectors |
    \n| Hybrid\/modular system | Complex boards, multi-product facilities | 40,000 to 90,000 | \u00b120 to 30 \u00b5m | Full range with reconfigurable heads |<\/p>\n

    \n

    From Our Experience:<\/strong> We see manufacturers overspend on peak CPH specs when their real bottleneck is changeover time. A line running 15 product variants per shift needs fast feeder swaps and broad package support more than it needs the fastest chip shooter on paper. For Shenzhen Chuxin Electronic Equipment Co., Ltd. lines, the matched integration between their placement systems and reflow ovens eliminates one calibration variable, which matters more when you’re running mixed products at tight tolerances.<\/p>\n<\/blockquote>\n

    Procurement checklist before you sign<\/strong><\/p>\n

    Before committing to any platform, verify these five things:<\/p>\n

      \n
    1. Protocol compatibility: Does it speak SMEMA, IPC-CFX, or Hermes<\/a>? Your existing line controllers need to communicate.<\/li>\n
    2. Feeder capacity: How many reels can it run simultaneously? More reels means fewer changeovers.<\/li>\n
    3. Component range: Can it handle your smallest part AND your largest odd-form component?<\/li>\n
    4. Service coverage: Is there a local technician who can respond within 24 hours?<\/li>\n
    5. ROI timeline: Mid-volume lines typically recover equipment costs in 14 to 22 months through labor savings and defect reduction.<\/li>\n<\/ol>\n

      Quick decision tree<\/strong><\/p>\n

      Run mostly the same small components at high volume? Start with a chip shooter.<\/p>\n

      Deal with frequent changeovers or wide component variety? Flexible platform wins.<\/p>\n

      Building complex boards with mixed technology and tight accuracy? Hybrid modular system.<\/p>\n

      The right machine is the one that fits your production profile, not the one with the flashiest spec sheet.<\/p>\n

      Conclusion: Precision Lessons and Next Steps<\/h2>\n

      Here’s what this guide comes down to. You can have the best smt pick and place machine on the market, but if your data files are messy, your feeders drift, and calibration checks slip through the cracks, that shiny equipment will still produce defects.<\/p>\n

      Process quality comes from the combination of three things: machine capability, programming discipline, and ongoing verification. None of them works alone.<\/p>\n

      Where should you start?<\/strong><\/p>\n

      If I had to pick one thing to tackle first, it would be your pcb pick and place file validation. Go back and check your last five programs for origin consistency, rotation direction, and unit verification. Fix the data upstream and you will see improvement everywhere downstream.<\/p>\n

      From there, pick your priority based on what your line actually struggles with. Machine verification if you have repeatability issues. Line audit if changeovers are eating your throughput.<\/p>\n

      \n

      Quick Action Plan<\/strong><\/p>\n

      | Area | What to Check | How Often |
      \n|——|—————|———–|
      \n| Data Files<\/strong> | Origin, units, rotation, designator match | Every program |
      \n| Feeder Setup<\/strong> | Reel positions, indexing, worn pockets | Weekly |
      \n| Nozzle Condition<\/strong> | Vacuum baseline, tip wear, correct type | Daily |
      \n| Fiducial Quality<\/strong> | Clean, readable, properly taught | Every shift |
      \n| Calibraci\u00f3n<\/strong> | Certified test board verification | Monthly |<\/p>\n

      Run through this checklist before your next product changeover. That single habit will cut most of the common defects before they escape to AOI.<\/p>\n

      For manufacturers running Shenzhen Chuxin Electronic Equipment Co., Ltd. lines, their integrated placement and reflow systems make the coordination between these checkpoints easier to manage. When placement and thermal profile stay aligned, you remove one more variable from the equation.<\/p>\n

      Precision is not a one-time setup. It is a daily practice.<\/p>","protected":false},"excerpt":{"rendered":"

      In 2026, PCB pick and place precision has never mattered more. With 0201 and 01005 components leaving almost zero room for error, that gap between 98.5% and 99.5% first-pass yield translates directly into rework labor and scrap costs across thousands of boards per shift. This practical guide covers how the machines actually work, where defects really come from, and the daily calibration discipline that separates high-performing SMT lines from the rest.<\/p>","protected":false},"author":1,"featured_media":5152,"comment_status":"closed","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"categories":[1],"tags":[],"class_list":["post-5253","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-company-news"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.chuxin-smt.com\/es\/wp-json\/wp\/v2\/posts\/5253","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.chuxin-smt.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.chuxin-smt.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/es\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/es\/wp-json\/wp\/v2\/comments?post=5253"}],"version-history":[{"count":0,"href":"https:\/\/www.chuxin-smt.com\/es\/wp-json\/wp\/v2\/posts\/5253\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/es\/wp-json\/wp\/v2\/media\/5152"}],"wp:attachment":[{"href":"https:\/\/www.chuxin-smt.com\/es\/wp-json\/wp\/v2\/media?parent=5253"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/es\/wp-json\/wp\/v2\/categories?post=5253"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/es\/wp-json\/wp\/v2\/tags?post=5253"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}