{"id":3255,"date":"2025-10-02T13:57:45","date_gmt":"2025-10-02T05:57:45","guid":{"rendered":"https:\/\/www.chuxin-smt.com\/?p=3255"},"modified":"2026-07-14T19:02:03","modified_gmt":"2026-07-14T11:02:03","slug":"slug-the-anatomy-of-a-wave-soldering-machine","status":"publish","type":"post","link":"https:\/\/www.chuxin-smt.com\/fi\/slug-the-anatomy-of-a-wave-soldering-machine\/","title":{"rendered":"Aaltojuotoskoneen anatomia"},"content":{"rendered":"<h2 id=\"thecorestructureofthesmtproductionline\">SMT-tuotantolinjan ydinrakenne<\/h2>\n<p>SMT-tuotantolinja (pinta-asennustekniikka) on automatisoitu kokoonpanoj\u00e4rjestelm\u00e4, joka on suunniteltu painettujen piirilevyjen (PCB) tarkkaan ja suureen tuotantom\u00e4\u00e4r\u00e4\u00e4n. Sen ydinrakenteen ymm\u00e4rt\u00e4minen on ratkaisevan t\u00e4rke\u00e4\u00e4 elektronisten komponenttien tehokkaan kiinnityksen ja juottamisen hallitsemiseksi. Koko prosessi koostuu useista huolellisesti koordinoiduista vaiheista, joista jokainen suoritetaan erikoislaitteilla. T\u00e4m\u00e4n automatisoidun tuotantolinjan perustan muodostavat yleens\u00e4 useat keskeiset koneet, jotka on yhdistetty varmistamaan saumaton siirtyminen paljaasta levyst\u00e4 valmiiseen tuotteeseen.<\/p>\n<p>SMT-tuotantolinjan rakenteen ytimess\u00e4 ovat seuraavat ydinkomponentit:<\/p>\n<ul>\n<li><strong>PCB Loader:<\/strong> Prosessi alkaa <a href=\"https:\/\/www.chuxin-smt.com\/fi\/difference-between-loader-and-unloader-in-smt-lines\/\">piirilevylataajalla<\/a> , which automatically feeds bare boards from cassettes into the production line. This initial step eliminates manual handling and reduces the risk of contamination and damage. At the other end, a PCB unloader collects the completed PCBs and stacks them for the next stage of production or testing. The production line\u2019s automated handling is crucial to maintaining continuous, high-speed production . <a href=\"https:\/\/www.electronicdesign.com\/technologies\/components\/article\/21211105\/electronic-design-the-basics-of-surface-mount-technology-smt\">[L\u00e4hde: Electronic Design]<\/a><\/li>\n<li><strong>Juotospastatulostin:<\/strong> Once the bare board is loaded, it is sent to a solder paste printer. This machine uses a stencil and scraper to apply a precise layer of solder paste to the specific pads where the components are placed. Accuracy at this stage is crucial, as insufficient or excessive solder paste can result in soldering defects such as opens or solder bridges . <a href=\"https:\/\/www.epectec.com\/pcb\/assembly\/smt-process.html\">[L\u00e4hde: Epec Engineered Technologies]<\/a><\/li>\n<li><strong>Sirujen sijoituskoneet:<\/strong> N\u00e4m\u00e4 ovat SMT-tuotantolinjan syd\u00e4n. Ne poimivat yksitt\u00e4isi\u00e4 pintaliitoskomponentteja rullilta tai lokeroilta ja asentavat ne tarkasti tyynyille. Nykyaikaiset koneet toimivat eritt\u00e4in suurilla nopeuksilla ja pystyv\u00e4t asettamaan tuhansia komponentteja tunnissa eritt\u00e4in tarkasti, mik\u00e4 on ratkaisevan t\u00e4rke\u00e4\u00e4 SMT-kokoonpanon tehokkuuden kannalta.<\/li>\n<li><strong>Juotoskone (Reflow- tai aaltojuotos):<\/strong> Komponenttien sijoittamisen j\u00e4lkeen piirilevy on l\u00e4mmitett\u00e4v\u00e4 juotospastan sulattamiseksi, jolloin syntyy pysyv\u00e4 s\u00e4hk\u00f6inen yhteys. Yleisin SMT:ss\u00e4 k\u00e4ytetty menetelm\u00e4 on <a href=\"https:\/\/www.chuxin-smt.com\/fi\/how-does-a-reflow-oven-work\/\">reflow-juottaminen<\/a> . Levy siirret\u00e4\u00e4n kuljetinhihnalla useiden l\u00e4mmitysvy\u00f6hykkeiden l\u00e4pi, noudattaen tietty\u00e4 <a href=\"https:\/\/www.chuxin-smt.com\/fi\/slug-mastering-the-pcb-reflow-temperature-profile-2\/\">l\u00e4mp\u00f6tilaprofiili<\/a> varmistaa, ett\u00e4 kaikki juotosliitokset muodostuvat oikein komponentteja vahingoittamatta. <a href=\"https:\/\/www.pcb-technologies.com\/smt-assembly-a-comprehensive-guide\/\">[l\u00e4hde: PCB Technologies]<\/a> . L\u00e4pireik\u00e4komponentteja sis\u00e4lt\u00e4ville levyille, <a href=\"https:\/\/www.chuxin-smt.com\/fi\/what-is-wave-soldering\/\">aaltojuottaminen<\/a> k\u00e4ytet\u00e4\u00e4n konetta, jossa levy kulkee sulan juotteen aallon l\u00e4pi.<\/li>\n<li><strong>PCB-kuljettimet: Kaikkien n\u00e4iden koneiden yhdist\u00e4minen on<\/strong> <a href=\"https:\/\/www.chuxin-smt.com\/fi\/slug-the-complete-guide-to-pcb-conveyors\/\">PCB-kuljetin<\/a> system . These automated conveyors transport circuit boards from one workstation to the next. Conveyor speed and stability are crucial to <a href=\"https:\/\/www.chuxin-smt.com\/fi\/pcb-conveyors-optimize-line-layout-and-improve-efficiency\/\">ty\u00f6nkulun optimointi<\/a> ja estet\u00e4\u00e4n pullonkaulat tai komponenttien siirtyminen kuljetuksen aikana. Monimutkaisemmissa linjoissa voi olla my\u00f6s puskurikuljettimia tai vaihtoportteja tuotantoprosessin dynaamiseksi hallitsemiseksi.<\/li>\n<\/ul>\n<h2 id=\"preparingtheboardfluxingandpreheatingareas\">Hallituksen valmistelu: Fluksaus- ja esil\u00e4mmitysalueet<\/h2>\n<p>Kun piirilevykokoonpano kulkee aaltojuotoskoneen l\u00e4pi, se menee ensin vuon levitys- ja esil\u00e4mmitysalueille. N\u00e4m\u00e4 alkuvaiheet ovat ratkaisevia levyn valmistelemiseksi juotosliitoksen onnistunutta muodostumista varten. N\u00e4iden vaiheiden ohittaminen tai niiden virheellinen hallinta voi johtaa lukuisiin juotosvirheisiin.<\/p>\n<h3 id=\"theroleoffluxzone\">Virtausvy\u00f6hykkeen rooli<\/h3>\n<p>Ennen kuin piirilevy joutuu kosketuksiin sulan juotteen kanssa, se kulkee flux-alueen l\u00e4pi, jossa se p\u00e4\u00e4llystet\u00e4\u00e4n flux-kerroksella. Vuon p\u00e4\u00e4asiallinen teht\u00e4v\u00e4 on puhdistaa metallipinta ja valmistella se juottamista varten. Se tekee t\u00e4m\u00e4n kolmella tavalla:<\/p>\n<ul>\n<li><strong>Oksidin poisto:<\/strong> Metal surfaces (including component leads and PCB pads) naturally form oxide layers when exposed to air. These oxide layers prevent solder from forming a good metal bond. Flux contains chemical activators that effectively remove these oxides . <a href=\"https:\/\/www.aimsolder.com\/technical-articles\/importance-flux-soldering-applications\">[L\u00e4hde: AIM Solder]<\/a><\/li>\n<li><strong>Parempi kostutus:<\/strong> Flux cleans the surface, allowing the molten solder to \u201cwet,\u201d or evenly distribute, over the metal pads and leads. This wetting is crucial for forming strong, reliable solder joints.<\/li>\n<li><strong>Est\u00e4\u00e4 uudelleen hapettumisen:<\/strong> Flux muodostaa puhdistetuille pinnoille suojaavan esteen, joka est\u00e4\u00e4 niit\u00e4 hapettumasta uudelleen levyn kulkiessa koneen l\u00e4mmitysalueen l\u00e4pi ennen juotosaallon saavuttamista.<\/li>\n<\/ul>\n<p>Flux can be applied by a variety of methods, including spraying, foaming, or dipping, with spray flux being the most common method in modern equipment due to its high precision and control. For more detailed information, see our <a href=\"https:\/\/www.chuxin-smt.com\/fi\/wave-soldering-flux-selection-and-maintenance-guide\/\">opas vuon valintaan ja yll\u00e4pitoon.<\/a><\/p>\n<h3 id=\"criticalwarmupphase\">Kriittinen l\u00e4mmittelyvaihe<\/h3>\n<p>Vuon levitt\u00e4misen j\u00e4lkeen piirilevy siirtyy v\u00e4litt\u00f6m\u00e4sti esil\u00e4mmitysalueelle. T\u00e4ss\u00e4 vaiheessa koko kokoonpanon l\u00e4mp\u00f6tilaa nostetaan asteittain. Esil\u00e4mmitysprosessi ei pelk\u00e4st\u00e4\u00e4n l\u00e4mmit\u00e4 piirilevy\u00e4, vaan sill\u00e4 on my\u00f6s useita t\u00e4rkeit\u00e4 teht\u00e4vi\u00e4:<\/p>\n<ul>\n<li><strong>Virtauksen aktivointi:<\/strong> L\u00e4mp\u00f6 aktivoi vuon kemikaalit, mik\u00e4 parantaa sen kyky\u00e4 puhdistaa metallipintoja. Eri vuotoaineilla on omat aktivoitumisl\u00e4mp\u00f6tila-alueensa, joten <a href=\"\/fi\/httpsa-comprehensive-guide-to-wave-soldering-temperature\/\">l\u00e4mp\u00f6tilan s\u00e4\u00e4t\u00f6<\/a> is a critical parameter . <a href=\"https:\/\/www.epectec.com\/pcb\/wave-soldering\/pre-heat-stage.html\">[L\u00e4hde: EpecTec]<\/a><\/li>\n<li><strong>Liuottimen haihtuminen:<\/strong> Nestem\u00e4inen vuo sis\u00e4lt\u00e4\u00e4 liuottimia, joiden on haihtuttava ennen kuin levy altistuu juotosaallolle. Jos liuottimia ei poisteta, liuottimet kiehuvat rajusti joutuessaan kosketuksiin sulan juotteen kanssa ja aiheuttavat virheit\u00e4, kuten juotospalloja ja tyhji\u00f6it\u00e4.<\/li>\n<li><strong>L\u00e4mp\u00f6shokkien v\u00e4hent\u00e4minen:<\/strong> The most important role of preheating is minimizing thermal shock. Thermal shock refers to the stress imposed on a PCB and its components when temperatures change rapidly. The preheat zone slowly heats the components to a specific temperature (typically between 100\u00b0C and 130\u00b0C) to ensure that the temperature difference between the board and the solder wave (approximately 250\u00b0C) is not too large. This gradual temperature increase prevents damage such as board warping and component cracking or delamination . <a href=\"https:\/\/www.pcb-technologies.com\/blog\/prevent-thermal-shock-in-pcbs\">[L\u00e4hde: PCB Technologies]<\/a><\/li>\n<\/ul>\n<p>Fluksaus- ja esil\u00e4mmitysvaiheiden asianmukainen suorittaminen luo perustan sille, ett\u00e4 <a href=\"https:\/\/www.chuxin-smt.com\/fi\/slug-a-step-by-step-guide-to-the-wave-soldering-process\/\">koko aaltojuottoprosessin ajan<\/a> varmistaa, ett\u00e4 komponentit on kemiallisesti ja termisesti valmisteltu viimeisi\u00e4 juotosvaiheita varten.<\/p>\n<h2 id=\"theheartofthemachinesolderingpotsandwavemechanics\">Koneen syd\u00e4n: juotosastia ja aaltomekaniikka<\/h2>\n<p>Juotosastia on jokaisen aaltojuotoslaitteen syd\u00e4n, joka toimii sulan juotteen s\u00e4ili\u00f6n\u00e4. Potti aloittaa juotosprosessin kuumentamalla kiinte\u00e4n juotosseoksen (tyypillisesti lyijyt\u00f6n koostumus, kuten tina-hopea-kupari (SAC)) tarkkaan nestem\u00e4iseen tilaan. Tasaisen l\u00e4mp\u00f6tilan yll\u00e4pit\u00e4minen padassa on ratkaisevan t\u00e4rke\u00e4\u00e4 luotettavien juotosliitosten aikaansaamiseksi. Kuten k\u00e4siteltiin <a href=\"https:\/\/www.chuxin-smt.com\/fi\/slug-a-comprehensive-guide-to-wave-soldering-temperature\/\">aaltojuottamisen l\u00e4mp\u00f6tilaopas<\/a> , pienetkin vaihtelut voivat johtaa vikoihin, kuten l\u00e4mp\u00f6shokkiin tai ep\u00e4t\u00e4ydelliseen kostumiseen. Ajan my\u00f6t\u00e4 sulan juotoksen pinta reagoi ilman kanssa muodostaen oksidien ja ep\u00e4puhtauksien kerroksen, jota kutsutaan kuonaksi. T\u00e4m\u00e4n kuonan s\u00e4\u00e4nn\u00f6llinen poistaminen on ratkaisevan t\u00e4rke\u00e4\u00e4, koska se voi tuoda ep\u00e4puhtauksia juotosprosessin aikana ja aiheuttaa j\u00e4\u00e4htymisen ja siltojen kaltaisia vikoja. <a href=\"https:\/\/www.kester.com\/knowledge-base\/dross-and-drossing\">[l\u00e4hde: Kester]<\/a> .<\/p>\n<p>From this carefully controlled solder pot, molten solder is pumped upward through the nozzle to form a solder wave\u2014the heart of the entire soldering process. Modern wave soldering systems almost universally utilize a dual-wave process to handle complex, mixed-technology PCBs. Understanding the unique role of each wave is key to mastering the soldering process, a topic we\u2019ll explore as we <a href=\"https:\/\/www.chuxin-smt.com\/fi\/slug-a-deep-dive-into-solder-wave-dynamics\/\">syventy\u00e4 syvemm\u00e4lle juotosaaltojen dynamiikkaan<\/a> .<\/p>\n<ol>\n<li><strong>Turbulenttinen aalto (Chip Wave):<\/strong> The first wave a PCB encounters is turbulent flow, typically bidirectional. Its aggressive, agitated flow is designed to ensure complete solder coverage, forcing solder into tight spaces such as plated through-holes and under surface-mount components. This action overcomes component shadowing and promotes good wetting of all solderable surfaces . <a href=\"https:\/\/www.epectec.com\/pcb\/wave-soldering\/process.html\">[L\u00e4hde: Epec Engineered Technologies]<\/a><\/li>\n<li><strong>Laminaarinen (sile\u00e4) aalto:<\/strong> Turbulenttisen aallon j\u00e4lkeen piirilevy kulkee toisen, tasaisemman aallon l\u00e4pi. Laminaarinen aalto virtaa yhteen suuntaan, jolloin pinta on rauhallinen ja vakaa. Sen tarkoituksena on suoristaa ja muotoilla: se poistaa turbulenttisen aallon j\u00e4tt\u00e4m\u00e4n ylim\u00e4\u00e4r\u00e4isen juotteen, poistaa l\u00e4hekk\u00e4in olevien nastojen v\u00e4liset juotosillat ja luo lopulta t\u00e4ydellisen juotosviilun.<\/li>\n<\/ol>\n<p>The effectiveness of the entire system depends on precise calibration of the solder wave\u2019s dynamic characteristics. Critical parameters such as <a href=\"https:\/\/www.chuxin-smt.com\/fi\/how-to-adjust-solder-wave-height-for-pcb-soldering-quality\/\">aallonkorkeus<\/a> , kuljettimen nopeuden (joka m\u00e4\u00e4ritt\u00e4\u00e4 kosketusaikaa) ja kuljettimen kulman on oltava t\u00e4ydellisesti synkronoitu. Tavoitteena on varmistaa riitt\u00e4v\u00e4 kosketusaika piirilevyn riitt\u00e4v\u00e4\u00e4n kastumiseen ilman, ett\u00e4 komponentit altistuvat liialliselle l\u00e4mp\u00f6rasitukselle. T\u00e4m\u00e4 tasapaino vakaan juotekylvyn ja dynaamisen juotosaallon v\u00e4lill\u00e4 m\u00e4\u00e4ritt\u00e4\u00e4 lopulta lopputuotteen laadun ja luotettavuuden.<\/p>\n<h2 id=\"finalassemblycoolingcleaningandinspection\">Loppukokoonpano: j\u00e4\u00e4hdytys, puhdistus ja tarkastus<\/h2>\n<p>The soldering process for printed circuit boards (PCBs) doesn\u2019t end when the solder melts. The cooling phase is a critical and controlled step that allows the molten solder to solidify, forming a strong and reliable electrical connection. If this phase is rushed or performed incorrectly, the meticulous work of preheating and reflow can be undone, leading to a host of defects.<\/p>\n<h3 id=\"thekeyroleofcoolingrate\">J\u00e4\u00e4hdytysnopeuden keskeinen merkitys<\/h3>\n<p>Kun piirilevy saavuttaa huippul\u00e4mp\u00f6tilan juotosprosessin aikana, se siirtyy <a href=\"https:\/\/www.chuxin-smt.com\/fi\/slug-a-comprehensive-guide-to-the-reflow-oven-cooling-zone\/\">j\u00e4\u00e4hdytysvy\u00f6hyke<\/a> . The primary goal here is to reduce the component temperature at a controlled rate. This rate is arguably the most critical parameter during this stage, as it directly impacts the solder joint\u2019s microstructure, thus affecting its mechanical strength and long-term reliability.<\/p>\n<p>Optimaalinen j\u00e4\u00e4hdytysnopeus (tyypillisesti noin -4 \u00b0C sekunnissa) on ratkaisevan t\u00e4rke\u00e4\u00e4 hienorakeisen mikrorakenteen kehittymiselle juotteeseen. <a href=\"https:\/\/www.circuitnet.com\/experts\/85915.html\">[l\u00e4hde: CircuitNet]<\/a> . This fine-grained structure enhances the joint\u2019s fatigue resistance and overall durability. However, deviations from the optimal cooling rate can cause serious problems:<\/p>\n<ul>\n<li><strong>J\u00e4\u00e4htyminen liian nopeasti:<\/strong> Nopea l\u00e4mp\u00f6tilan lasku voi aiheuttaa l\u00e4mp\u00f6shokin, joka aiheuttaa j\u00e4nnityst\u00e4, joka voi halkaista piirilevyn alustan tai itse komponentit. T\u00e4m\u00e4 on erityisen vaarallista herkille keraamisille kondensaattoreille.<\/li>\n<li><strong>Liian hidas j\u00e4\u00e4hdytys:<\/strong> Cooling too slowly can lead to excessive growth of intermetallic compounds (IMC) at the solder-component lead interface. While a thin IMC layer is desirable for a good connection, a thick, brittle IMC layer can compromise the integrity of the joint, making it susceptible to failure under stress or vibration . <a href=\"https:\/\/www.belpower-solutions.com\/resource\/soldering-process-control-for-pcba\">[L\u00e4hde: Bel Power Solutions]<\/a><\/li>\n<\/ul>\n<p>Mastering <a href=\"https:\/\/www.chuxin-smt.com\/fi\/reflow-soldering-cooling-system-importance-optimization\/\">reflow-juottamisen j\u00e4\u00e4hdytysj\u00e4rjestelm\u00e4si<\/a> on avainasemassa n\u00e4iden ongelmien ehk\u00e4isemisess\u00e4 ja tasalaatuisten tulosten varmistamisessa.<\/p>\n<h3 id=\"postweldcleaningandinspection\">Hitsauksen j\u00e4lkeinen puhdistus ja tarkastus<\/h3>\n<p>Kun levy on j\u00e4\u00e4htynyt ja juotosliitokset ovat j\u00e4hmettyneet, kokoonpano siirtyy juottamisen j\u00e4lkeiseen vaiheeseen laadun tarkistamiseksi ja lopullisen k\u00e4yt\u00f6n valmistelemiseksi.<\/p>\n<p><strong>1. Puhdistus:<\/strong><br \/>\n The soldering process often leaves behind flux residue. While \u201cno-clean\u201d fluxes are common, their residue can sometimes interfere with probing during in-circuit testing or prevent conformal coatings from properly adhering. Cleaning is essential for high-reliability applications in the automotive, medical, or aerospace industries. Flux residue can be acidic and absorb moisture from the air, potentially causing corrosion and electrical shorts over time <a href=\"https:\/\/www.epectec.com\/pcb\/assembly\/post-soldering-cleaning.html\">[l\u00e4hde: Epec]<\/a> . N\u00e4iden haitallisten ep\u00e4puhtauksien poistamiseen voidaan k\u00e4ytt\u00e4\u00e4 erilaisia puhdistusmenetelmi\u00e4, kuten vesipohjaisia, puolivesipohjaisia ja liuotinpohjaisia j\u00e4rjestelmi\u00e4.<\/p>\n<p><strong>2. Tarkastus ja testaus:<\/strong><br \/>\n Laadun varmistamiseksi jokainen komponentti tarkastetaan tarkasti. T\u00e4rkeimpi\u00e4 menetelmi\u00e4 ovat mm:<\/p>\n<ul>\n<li><strong>Automaattinen optinen tarkastus (AOI):<\/strong> An AOI system uses a high-resolution camera to scan the PCB and compare it to a detailed template of a \u201cgold\u201d board. It can quickly detect defects such as solder bridges, open circuits, insufficient solder, and incorrect component placement.<\/li>\n<li><strong>Automaattinen r\u00f6ntgentarkastus (AXI):<\/strong> AXI on ratkaisevan t\u00e4rke\u00e4 komponenteille, joissa on piilossa olevia juotosliitoksia, kuten BGA-levyj\u00e4 (Ball Grid Array). R\u00f6ntgens\u00e4teet voivat l\u00e4p\u00e4ist\u00e4 komponentin rungon ja tuottaa kuvia sen alla olevista liitoksista, jolloin paljastuvat viat, joita optiset j\u00e4rjestelm\u00e4t eiv\u00e4t pysty havaitsemaan, kuten <a href=\"https:\/\/www.chuxin-smt.com\/fi\/how-to-reduce-voids-in-reflow-soldering-process-tips\/\">juotosh\u00e4vi\u00f6t<\/a> or shorts . <a href=\"https:\/\/www.creativehitech.com\/blog\/basics-of-automated-x-ray-inspection-axi-for-pcb\/\">[L\u00e4hde: Creative Hi-Tech]<\/a><\/li>\n<\/ul>\n<p>T\u00e4m\u00e4n tarkastuksen j\u00e4lkeen suoritetaan yleens\u00e4 toiminnallinen testaus, jolla varmistetaan, ett\u00e4 piirilevyyn on kytketty virta ja ett\u00e4 se toimii suunnitellulla tavalla. T\u00e4ss\u00e4 lopputarkastuksessa varmistetaan, ett\u00e4 koko <a href=\"https:\/\/www.chuxin-smt.com\/fi\/slug-a-deep-dive-into-the-reflow-soldering-process\/\">reflow<\/a> tai <a href=\"https:\/\/www.chuxin-smt.com\/fi\/slug-a-step-by-step-guide-to-the-wave-soldering-process\/\">aaltojuotosprosessi<\/a> on saatu onnistuneesti p\u00e4\u00e4t\u00f6kseen, ja tuloksena on luotettava ja t\u00e4ysin toimiva elektroniikkakokoonpano.<\/p>\n<h2 id=\"source\">l\u00e4hde<\/h2>\n<ul>\n<li><a href=\"https:\/\/www.aimsolder.com\/technical-articles\/importance-flux-soldering-applications\">AIM Solder \u2013 The Importance of Flux in Soldering Applications<\/a><\/li>\n<li><a href=\"https:\/\/www.belpower-solutions.com\/resource\/soldering-process-control-for-pcba\">Bel Power Solutions \u2013 PCBA Soldering Process Control<\/a><\/li>\n<li><a href=\"https:\/\/www.circuitnet.com\/experts\/85915.html\">CircuitNet \u2013 Effects of Cooling Rate<\/a><\/li>\n<li><a href=\"https:\/\/www.creativehitech.com\/blog\/basics-of-automated-x-ray-inspection-axi-for-pcb\/\">Creative Hi-Tech \u2013 PCB Automated X-ray Inspection (AXI) Basics<\/a><\/li>\n<li><a href=\"https:\/\/www.electronicdesign.com\/technologies\/components\/article\/21211105\/electronic-design-the-basics-of-surface-mount-technology-smt\">Electronic Design \u2013 Surface Mount Technology (SMT) Basics<\/a><\/li>\n<li><a href=\"https:\/\/www.epectec.com\/pcb\/assembly\/post-soldering-cleaning.html\">Epec Engineered Technologies \u2013 Post-Solder PCB Cleaning<\/a><\/li>\n<li><a href=\"https:\/\/www.epectec.com\/pcb\/assembly\/smt-process.html\">Epec Engineered Technologies \u2013 SMT Assembly Process<\/a><\/li>\n<li><a href=\"https:\/\/www.epectec.com\/pcb\/wave-soldering\/process.html\">Epec Engineering Technology \u2013 Wave Soldering Process<\/a><\/li>\n<li><a href=\"https:\/\/www.epectec.com\/pcb\/wave-soldering\/pre-heat-stage.html\">Epec Engineered Technologies \u2013 Wave Soldering Preheat Stage<\/a><\/li>\n<li><a href=\"https:\/\/www.kester.com\/knowledge-base\/dross-and-drossing\">Kester - roskat ja roskat<\/a><\/li>\n<li><a href=\"https:\/\/www.pcb-technologies.com\/blog\/prevent-thermal-shock-in-pcbs\">PCB Technology \u2013 How to Prevent Thermal Shock in PCBs<\/a><\/li>\n<li><a href=\"https:\/\/www.pcb-technologies.com\/smt-assembly-a-comprehensive-guide\/\">PCB Technology \u2013 SMT Assembly \u2013 Comprehensive Guide<\/a><\/li>\n<\/ul>\n<p>\u201c`<\/p>","protected":false},"excerpt":{"rendered":"<p>The core structure of the SMT production line An SMT (surface mount technology) production line is an automated assembly system [&hellip;]<\/p>","protected":false},"author":1,"featured_media":3254,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"categories":[1],"tags":[],"class_list":["post-3255","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-company-news"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.chuxin-smt.com\/fi\/wp-json\/wp\/v2\/posts\/3255","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.chuxin-smt.com\/fi\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.chuxin-smt.com\/fi\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/fi\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/fi\/wp-json\/wp\/v2\/comments?post=3255"}],"version-history":[{"count":0,"href":"https:\/\/www.chuxin-smt.com\/fi\/wp-json\/wp\/v2\/posts\/3255\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/fi\/wp-json\/wp\/v2\/media\/3254"}],"wp:attachment":[{"href":"https:\/\/www.chuxin-smt.com\/fi\/wp-json\/wp\/v2\/media?parent=3255"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/fi\/wp-json\/wp\/v2\/categories?post=3255"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/fi\/wp-json\/wp\/v2\/tags?post=3255"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}