{"id":5247,"date":"2026-08-17T12:01:05","date_gmt":"2026-08-17T04:01:05","guid":{"rendered":"https:\/\/www.chuxin-smt.com\/what-solder-is-used-in-electronics-a-comprehensive-guide-to-materials-and-techniques\/"},"modified":"2026-08-17T12:01:07","modified_gmt":"2026-08-17T04:01:07","slug":"what-solder-is-used-in-electronics-a-comprehensive-guide-to-materials-and-techniques","status":"publish","type":"post","link":"https:\/\/www.chuxin-smt.com\/hu\/what-solder-is-used-in-electronics-a-comprehensive-guide-to-materials-and-techniques\/","title":{"rendered":"What Solder Is Used in Electronics? A Comprehensive Guide to Materials and Techniques"},"content":{"rendered":"
\n

K\u00f6zz\u00e9t\u00e9tel:<\/strong> 10 August 2026
\n Olvas\u00e1si id\u0151:<\/strong> 12 minutes <\/p>\n

Reviewer:<\/strong> Simon Scrapes, Founder <\/h2>\n<\/blockquote>\n

What Solder Is Used in Electronics? A Comprehensive Guide to Materials and Techniques<\/p>\n

Your SMT line is humming along. Then the AOI flags a batch of bridges on a dense BGA panel. Or the field return comes back with a cold joint that failed six months in. The root cause is often the same thing manufacturers overlook until it costs them: the solder choice.<\/p>\n

Solder isn’t just filler metal. It’s the foundation of every electrical connection on your board, and getting it wrong drives up rework rates and scrap costs. The right alloy, flux chemistry, and reflow profile work together to minimize defects and keep production running smoothly.<\/p>\n

The complexity is real. You’ve got lead-free compliance deadlines to hit, high-density packages that punish sloppy profiles, and pressure to keep throughput up. Plus, solder defects still account for nearly 60% of PCB assembly failures in modern lines.<\/p>\n

So let’s break it down. This guide covers what kind of solder for electronics<\/a> actually works in production, how flux behaves in reflow and wave soldering, and what goes wrong when materials and processes don’t match. We’ll look at the real tradeoffs between leaded and lead-free alloys, how to pick the right flux for your line, and how to spot and fix common defects before they ship.<\/p>\n

Jace Liu is an SMT equipment sales and project manager with experience in SMT soldering solutions, helping manufacturers select the right materials and processes for their production lines.<\/em>## Author Credibility: About Jace Liu<\/p>\n

Jace Liu is an SMT equipment sales and project manager at Shenzhen Chuxin Electronic Equipment Co., Ltd. His work focuses on overseas markets for SMT manufacturing solutions, including lead-free reflow ovens, wave soldering systems, and complete production lines.<\/p>\n

His background sits at the intersection of electronics manufacturing, SMT process control, and soldering material selection. He helps production teams work through the tradeoffs between alloy choice, flux chemistry, and thermal profile tuning. That means when he writes about solder behavior in reflow or wave soldering, he’s drawing from real customer deployments rather than just theory.## What Solder Is and What It Does in Electronics<\/p>\n

Solder is the metal that holds your board together, literally. It’s the filler material that creates both the electrical connection between components and pads, and the mechanical bond that keeps everything in place. Without good solder joints, your circuit is just a pile of metal parts waiting to fail.<\/p>\n

Think of solder like the glue of electronics manufacturing. But unlike regular glue, it conducts electricity and forms a metallurgical bond with the metal surfaces it touches.<\/p>\n

The Four Main Solder Forms<\/h3>\n

You won’t use the same type of solder for hand repairs that you’d use on a production reflow line. Here’s the quick breakdown:<\/p>\n

Solder wire<\/strong> is what most people picture when they think of soldering. It’s a thin wire with flux inside, and it’s the go-to for hand soldering, repair work, and any place you need to apply solder one joint at a time.<\/p>\n

Solder paste<\/strong> is a thick mixture of tiny metal powder particles suspended in flux. This is what drives SMT assembly. You stencil it onto pads, place components on top, and then melt it in a reflow oven to form all the joints at once.<\/p>\n

Solder bars<\/strong> are large chunks of metal used in wave soldering machines. The machine melts the bar and pumps the molten solder up into a wave that boards pass through, soldering all the through-hole components in one pass.<\/p>\n

Solder preforms<\/strong> are tiny cut pieces of solder shaped for specific joints. They’re precision tools for situations where you need exact solder volume, like certain BGA repairs or specialized assembly work.<\/p>\n

\"Documentary<\/figure>\n<\/p>\n

Why Wetting Matters<\/h3>\n

Good solder joints happen when the molten solder spreads out and bonds properly with the metal surfaces. This is called wetting. When wetting works, you get a smooth, shiny fillet that flows up the component lead and onto the pad. When it fails, you get weak joints that crack or fail electrically.<\/p>\n

Poor wetting looks rough, dull, or grainy. It means the solder didn’t fully bond with the surface, and those joints will likely fail later under thermal stress or vibration.<\/p>\n

The right solder choice affects wetting directly. Different alloys wet differently, and that’s why alloy selection matters for your specific board, components, and process.<\/p>\n

\n

Pro Insight:<\/strong> SAC305 dominates lead-free SMT lines<\/a> for good reason. It wets reasonably well, has broad supplier support, and the process window is well understood. But it still needs to be matched to your thermal profile, component mix, and reliability target. Don’t just pick it because everyone else does. Pick it because it fits your specific situation.<\/p>\n

What Kind of Solder for Electronics: Leaded vs Lead-Free and Which Alloy Fits the Job<\/h2>\n<\/blockquote>\n

Here’s where things get interesting. The solder alloy you pick does more than just melt and solidify. It sets your reflow temperature, affects how long your joints last under thermal stress, determines whether you’re RoHS compliant, and influences your per-board cost. That’s a lot of weight on a metal choice.<\/p>\n

Let’s start with the two big families.<\/p>\n

Leaded solder<\/strong> (usually Sn63\/Pb37 or Sn60\/Pb40) melts at 183 degrees Celsius. That lower temperature makes life easier on your line because you get a wider process window, better wetting, and joints that are simpler to rework when something goes wrong. The tradeoff is regulatory: most consumer electronics can’t use lead anymore under RoHS rules, so leaded solder is now mostly confined to aerospace, military, and legacy programs where exemptions still apply [1][11].<\/p>\n

Lead-free solder<\/strong> is the default for most SMT work in 2026. The SAC family (tin-silver-copper) dominates, with SAC305 being the most common choice. It melts about 35 degrees higher than tin-lead, which sounds minor but creates real process challenges. Higher peak temperatures mean more stress on components, higher energy bills, and tighter requirements for board and package warpage control [8][15].<\/p>\n

So why does SAC305 still win so often? It gives decent wetting, has tons of supplier support, and the process knowledge base is massive. You can find qualified profiles, compatible components, and experienced technicians pretty easily. That’s not nothing when you’re trying to scale production.<\/p>\n

The right alloy really comes down to your specific situation. A dense BGA board for consumer electronics has different needs than an automotive module that sits through thermal cycling for 15 years. High-reliability programs sometimes stick with leaded solder specifically because the process margin is friendlier and the long-term fatigue behavior is better understood [10][11].<\/p>\n

| Alloy Family | Melting Range | Common Use Cases | Main Tradeoffs |
\n|—|—|—|—|
\n| Sn63\/Pb37 | 183\u00b0C (eutectic) | Aerospace, military, legacy repair | Not RoHS compliant for most electronics |
\n| SAC305 | 217-220\u00b0C | Consumer SMT, automotive, general production | Tighter process window, higher reflow temp |
\n| SnCu | ~227\u00b0C | Wave soldering, cost-sensitive boards | Higher temp, less common than SAC |
\n| SnBi | ~139\u00b0C | Heat-sensitive repair, low-temp applications | Lower strength, niche use |<\/p>\n

\n

Pro Insight:<\/strong> SAC305 dominates lead-free SMT lines for good reason. It wets reasonably well, has broad supplier support, and the process window is well understood. But it still needs to be matched to your thermal profile, component mix, and reliability target. Don’t just pick it because everyone else does. Pick it because it fits your specific situation.<\/p>\n<\/blockquote>\n

I’ve seen manufacturers save money on alloy cost only to spend it all on rework when the profile didn’t match the higher melting point. The cheapest solder isn’t always the cheapest option when you factor in defect rates and touch-up time. Take the time to match your alloy to your actual production reality, not just what’s cheapest on the spec sheet.<\/p>\n

For most SMT lines running in 2026, SAC305 or a closely related variant is the practical default. But if your board has heavy copper planes, mixed pitch packages, or thermal cycling requirements, it pays to dig deeper into the tradeoffs before committing to a production alloy.<\/p>\n

What Type of Flux Is Used in Electronics Soldering<\/h2>\n

Flux is the reason your solder actually sticks. Without it, the oxides on your copper pads and component leads would prevent wetting entirely, no matter how perfect your reflow profile. Flux does three things during soldering: it removes oxides from metal surfaces, it prevents new oxides from forming while the joint is hot, and it reduces surface tension so molten solder spreads properly [2][18].<\/p>\n

Think of flux as the cleaning crew that shows up right before the solder does its job. If the surfaces aren’t clean, the metallurgical bond won’t form, and that’s how you get those frustrating cold joints and insufficient wetting failures.<\/p>\n

The Main Flux Types<\/h3>\n

Rosin flux<\/strong> comes from natural tree sap, and it’s been around forever. It gives good wetting and is common in hand soldering and rework. The tradeoff is residue. Rosin leaves stuff behind on the board, and depending on your reliability requirements, you might need to clean it off. Rosin mildly activated (RMA) is a popular middle ground that balances activity with manageable residues [6][8].<\/p>\n

No-clean flux<\/strong> is designed to stay on the board without causing problems. The residues it leaves behind are generally safe to leave in place for most assemblies, which makes it popular in high-volume production where cleaning adds time and cost [1][6].<\/p>\n

Water-soluble flux<\/strong> is the heavy-duty option. It uses stronger chemistry, usually organic acids, to tackle stubborn oxides. But those active residues need to be washed off thoroughly after soldering or they can cause corrosion problems down the line. If your line has a wash station, water-soluble flux might be worth the extra step [1][3][6].<\/p>\n

Low-residue flux<\/strong> is basically the modern production standard. It overlaps with no-clean in practice and leaves minimal residue that usually doesn’t require cleaning.<\/p>\n

\n

Expert Tip:<\/strong> Flux activity level should be matched to cleaning capability, board density, and contamination risk rather than chosen by habit. If you’re running dense fine-pitch boards with limited access for cleaning, no-clean makes sense. But if your boards have heavy oxidation or mixed metal surfaces, you might need higher activity even if it means adding a cleaning step.<\/p>\n<\/blockquote>\n

Choosing the Right Flux for Your Process<\/h3>\n

The right flux really comes down to your specific situation. High-reliability aerospace or medical boards often favor low-activity, low-halide fluxes when they can produce acceptable wetting, because fewer residues mean fewer long-term reliability risks [1][2]. Boards with heavy contamination or poor surface finishes might need the stronger chemistry of water-soluble flux to get good joints at all.<\/p>\n

For reflow forraszt\u00e1s<\/a>, no-clean and low-residue fluxes are the standard choice in most SMT lines. Wave soldering follows similar logic, with low-residue fluxes dominating modern lead-free production, though water-soluble still has a place when higher activity is needed and post-solder cleaning is built into the process [4][6]. Hand soldering tends to use rosin-based or RMA fluxes, especially when cleaning afterward is practical.<\/p>\n

One more thing. Using more flux than you actually need is a common mistake. Excess flux increases residue risk and can actually cause problems with slump and solder balls. When we work with production teams on profile optimization, we usually recommend using the minimum flux amount that still gives good soldering results [13].## How the Reflow Soldering Process Works in Electronics Manufacturing<\/p>\n

Reflow soldering is the workhorse of modern SMT assembly. It’s what turns a board with stenciled paste and placed components into a finished assembly, all in one pass through a heated chamber.<\/p>\n

Here’s the basic flow. First, solder paste gets printed onto the pads through a stencil. Then a pick-and-place machine drops components onto the wet paste. The board travels through the reflow oven on a conveyor, and the paste goes through a controlled heating profile that melts the solder and forms the joints.<\/p>\n

The reflow profile itself has four main stages.<\/p>\n

El\u0151meleg\u00edt\u00e9s<\/strong> gradually raises the board temperature to avoid thermal shock. Too fast, and you can crack sensitive components or cause pad lift. Too slow, and you waste time and energy.<\/p>\n

\u00c1ztassa<\/strong> holds the board at a lower temperature (usually 150 to 190 degrees Celsius) for 60 to 120 seconds. This lets the flux activate and release gases from the paste before things get really hot. If you skip or rush this stage, you get more voiding and solder balls.<\/p>\n

Reflow<\/strong> is where the solder melts. For SAC305 lead-free paste, peak temperature typically hits 235 to 250 degrees Celsius. The time above liquidus (how long the solder stays molten) matters a lot for wetting quality. Too short, and joints don’t form properly. Too long, and you risk intermetallic compound overgrowth and component damage.<\/p>\n

H\u0171t\u00e9s<\/strong> brings the board back down. Controlled cooling at 2 to 4 degrees per second helps form a fine grain structure in the joint. Cool too fast, and the board can warp. Cool too slow, and you might get rough, weak joints.<\/p>\n

\"Close<\/figure>\n<\/p>\n

Why Profile Control Matters<\/h3>\n

Every defect mode ties back to the profile somewhere. Tombstoning happens when one side of a component reflows before the other, pulling the part upright. It’s often a soak or ramp problem. Voiding happens when gas gets trapped during reflow, usually because the ramp was too fast or the soak wasn’t long enough for proper de-gassing. Solder balling and insufficient wetting also trace back to profile issues more often than solder or flux problems alone.<\/p>\n

This is why profile characterization matters for every new board. Hotspots from heavy copper planes or large BGAs create temperature spread across the assembly, and that spread drives defects if you don’t account for it.<\/p>\n

Line Balance and Throughput<\/h3>\n

Profile tuning isn’t just about quality. It’s about keeping your line balanced. A profile that’s too conservative bottlenecks throughput. One that’s aggressive might look fast on paper but cause so many defects that your actual output drops. The sweet spot balances cycle time, defect rate, and energy use.<\/p>\n

Modern reflow ovens like those from Shenzhen Chuxin Electronic Equipment Co., Ltd. give manufacturers better zone control and real-time monitoring to hit that balance more consistently.<\/p>\n

For high-density assemblies in 2026, profile control is non-negotiable. As packages get smaller and thermal budgets tighten, the difference between a qualified profile and a guess shows up in your first-pass yield numbers.## Common Soldering Defects and What They Mean<\/p>\n

When something goes wrong on your line, the defect type tells you where to look. Each failure mode has its own personality, so to speak, and recognizing it fast saves hours of troubleshooting.<\/p>\n

Cold solder joints<\/strong> look rough and grainy. They happen when the solder didn’t fully melt or the joint moved while cooling. Usually this traces back to temperature, not the solder itself. Your profile might have been too cold, or maybe the component absorbed heat faster than expected. Contaminated pads cause this too, sometimes from improper storage or handling before assembly.<\/p>\n

Solder bridges<\/strong> are exactly what they sound like: solder connecting pads that should stay separate. This creates a short and it’s one of the more common SMT headaches, especially with dense fine-pitch parts<\/a>. Too much paste, stencil issues, or components shifting during reflow usually cause bridges.<\/p>\n

\u00dcress\u00e9gek<\/strong> are gas pockets trapped inside the joint. You cannot see them from the outside, which makes them sneaky. They weaken the joint mechanically and create hotspots that shorten lifespan. Fast ramps and inadequate soak periods tend to produce voids, and X-ray inspection is really the only reliable way to spot them [4][12][16].<\/p>\n

Insufficient wetting<\/strong> happens when solder fails to spread properly onto the pad or lead. You see poor fillet formation and the joint looks like it is sitting on top rather than bonding. Low temperature, oxidation, and weak flux activity are the usual suspects here.<\/p>\n

Solder balls<\/strong> are stray solder spheres near the joint. These can cause latent shorts if they migrate. They often come from too-aggressive ramp rates or paste slump issues.<\/p>\n

\n

From Our Experience:<\/strong> We once traced a batch of cold joints back to improper tray storage. The components sat on damp foam for a weekend before assembly. The pads looked fine under AOI, but the moisture was creating micro-contamination at the interface. Check your incoming storage, not just your profile, when cold joints appear on previously good setups.<\/p>\n<\/blockquote>\n

How Inspection Changes the Game<\/h3>\n

AOI catches visible defects like bridges, solder balls, and wetting issues quickly. X-ray reveals internal problems like voids and hidden cold joints. Electrical test confirms whether questionable joints actually conduct.<\/p>\n

The rework path depends on the defect. Bridges get reheated and cleaned. Insufficient wetting might need higher temperature or flux touch-up. Voids usually require board-level rework if the percentage is too high. Solder balls get removed and the area cleaned.<\/p>\n

\"Engineering<\/figure>\n<\/p>\n

Knowing the defect type narrows your search fast. Most of the time, the root cause sits in one of three places: your profile, your materials, or your storage and handling. Pinpoint it before you touch the solder spec.## Choosing Solder Materials and Techniques by Production Scenario<\/p>\n

Not every line needs the same solder setup. What works for a high-volume SMT cell doesn’t work for hand repair, and prototyping has its own priorities. Here’s how to match your materials and process to what you’re actually doing.<\/p>\n

SMT Assembly Lines<\/h3>\n

For high-volume surface mount, solder paste is your only real option. SAC305 dominates for good reason. It wets well, suppliers stock it everywhere, and your team already knows how to profile for it. No-clean flux paste is the standard because it skips the wash step and keeps throughput up.<\/p>\n

The tradeoff is process control. Paste storage matters a lot. Keep it refrigerated, let it warm up slowly, and use it within the shelf life printed on the jar. We’ve seen manufacturers save money on cheaper paste only to watch voiding spike because the material was past its prime.<\/p>\n

Hull\u00e1mforraszt\u00e1s<\/h3>\n

Through-hole components need bar solder in a wave pot. SnCu has taken over most lead-free wave applications because it handles the higher bath temperatures better than SAC without oxidizing as fast. Low-residue wave flux goes with it, applied by spray or foam before the board hits the wave.<\/p>\n

Bath maintenance is non-negotiable here. You need to skim dross regularly, monitor copper content, and stick to a real maintenance schedule. Letting the bath run dirty produces a predictable cascade of defects: poor wetting, icicles, bridges.<\/p>\n

Hand Repair and Rework<\/h3>\n

Hand soldering calls for flux-core wire solder. Sn63\/Pb37 still dominates bench work because the lower temperature and forgiving wetting make life easier when you’re working under a microscope. SAC305 works too, but you need more heat and more patience.<\/p>\n

For heat-sensitive repairs, SnBi alloys drop the melting point down to around 139 degrees Celsius. Lower temp means less risk of lifting pads or cooking nearby components. The joint strength isn’t as high, so use it where the repair sees low mechanical stress.<\/p>\n

Prototyping and Low-Volume Runs<\/h3>\n

Prototypes need flexibility more than optimization. Most shops keep both leaded and lead-free wire on hand, plus a selection of paste types. You’re trading perfect process control for the ability to adapt quickly when a board revision changes your thermal profile.<\/p>\n

Storage matters less for low-volume work, but don’t ignore it entirely. Old paste still works, mostly, until it doesn’t and you’re chasing slump defects you can’t explain.<\/p>\n

Quick Reference: Solder Selection by Application<\/h3>\n

| Application | Solder Form | Alloy | Flux Type | Notes |
\n|—|—|—|—|—|
\n| SMT production | Paste | SAC305 | No-clean\/low-residue | Store refrigerated, track shelf life |
\n| Wave soldering | Bar | SnCu, SAC | Low-residue wave | Maintain bath chemistry, skim dross |
\n| Hand repair | Wire | Sn63\/Pb37 or SAC305 | Rosin or RMA core | Match alloy to original board |
\n| Low-temp repair | Wire or paste | SnBi | RMA | Avoid high-stress joints |
\n| Prototype build | Paste or wire | Either family | Varies | Keep both alloy families available |
\n| Selective soldering<\/a> | Paste or preforms | Match assembly | Low-residue | Precise deposit control needed |<\/p>\n

Storage, Shelf Life, and Supplier Consistency<\/h3>\n

Paste shelf life runs about 3 to 6 months refrigerated, shorter at room temperature. Solder wire lasts longer but absorbs moisture over time, especially in humid climates. Bar solder in wave pots needs ongoing attention to oxidation and contamination levels.<\/p>\n

Switching suppliers mid-production is risky. Even with the same alloy designation, particle size distribution in paste and flux chemistry vary enough to shift your defect rates. Qualify new lots on a few boards before running them through full production.<\/p>\n

Operator Training Notes<\/h3>\n

Process control breaks down fastest at the operator level. Make sure your team knows why paste storage matters, what proper wetting looks like, and how to spot flux-related defects early. A 30-minute refresher on common defect signatures pays back faster than you might expect, especially when you’re bringing new people onto the line.<\/p>\n

The right solder choice only helps if your process follows through.## Conclusion: A Practical Solder Selection Checklist for Electronics Teams<\/p>\n

Solder selection comes down to matching your materials to your actual production goals, not to what’s cheapest or most familiar. Here’s a quick validation sequence to work through before committing to a new solder setup on a live line.<\/p>\n

First<\/strong>, define your compliance requirements. RoHS compliance drives you toward lead-free alloys like SAC305 for most consumer and automotive work. Legacy aerospace or military programs might still use tin-lead where exemptions apply.<\/p>\n

Second<\/strong>, match your flux to your cleaning capability. No-clean fluxes work when you want to skip washing. Water-soluble fluxes need a wash step but handle tougher surfaces better.<\/p>\n

Third<\/strong>, profile your assembly, not a generic target. Run thermocouples across your thermal extremes and tune ramp, soak, and peak to match your board and components.<\/p>\n

Fourth<\/strong>, validate with inspection. AOI catches visible defects. X-ray catches hidden voids in BGAs and QFNs. Electrical test confirms what visual inspection might miss.<\/p>\n

Finally<\/strong>, track your data. First-pass yield, defect rates, and rework costs tell you whether your choices are working or whether you need to re-qualify a different alloy or flux combination.<\/p>\n

| Decision Factor | Primary Consideration | Quick Test |
\n|—|—|—|
\n| Compliance | RoHS or legacy program? | Verify exemption status first |
\n| Alloy choice | Thermal profile fit, reliability target | Profile trial on production board |
\n| Flux type | Cleaning capability, surface condition | Trial run with inspection |
\n| Process control | Profile optimization, storage conditions | Monitor FPY and defect data |<\/p>\n

The right solder choice only helps if your process follows through. Qualify it properly, inspect consistently, and let the data tell you when to adjust.<\/p>\n

\n

Expert Recommendation:<\/strong> Before switching solder alloys or flux types mid-production, always run a qualification lot of at least 50 boards through your full process with inspection and test data collected. That small step prevents the kind of defect spike that costs way more than the time it takes.<\/p>\n<\/blockquote>","protected":false},"excerpt":{"rendered":"

Solder isn’t just filler metal\u2014it’s the foundation of every electrical connection on your board, and the wrong choice silently drives up rework rates and scrap costs. This practical guide covers what actually works in production: how to choose between leaded and lead-free alloys, match flux chemistry to your process, and tune reflow profiles to minimize common defects. It’s the no-nonsense reference SMT teams actually need.<\/p>","protected":false},"author":1,"featured_media":5175,"comment_status":"closed","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"categories":[1],"tags":[],"class_list":["post-5247","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-company-news"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.chuxin-smt.com\/hu\/wp-json\/wp\/v2\/posts\/5247","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.chuxin-smt.com\/hu\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.chuxin-smt.com\/hu\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/hu\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/hu\/wp-json\/wp\/v2\/comments?post=5247"}],"version-history":[{"count":0,"href":"https:\/\/www.chuxin-smt.com\/hu\/wp-json\/wp\/v2\/posts\/5247\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/hu\/wp-json\/wp\/v2\/media\/5175"}],"wp:attachment":[{"href":"https:\/\/www.chuxin-smt.com\/hu\/wp-json\/wp\/v2\/media?parent=5247"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/hu\/wp-json\/wp\/v2\/categories?post=5247"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/hu\/wp-json\/wp\/v2\/tags?post=5247"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}