product description
Function Overview
CCXPro30 is a high-speed & high-precision solder paste printer with a repeatability of ±7 μm, a printing accuracy of ±15 μm, and a printing production cycle of 7 seconds (excluding printing solder paste and cleaning). CCXPro30 can handle PCB boards from 50mm × 50mm to 510mm × 510mm and can meet the printing requirements of fine-pitch devices such as 0201 (metric) and Pitch 0.25mm.
Basic features of the product:
2.1. Wide PCB size compatibility range, supporting PCBs of different thicknesses from 50mm × 50mm to 510mm × 510mm; 2.2. High-precision printing;
High positioning accuracy, repeat positioning accuracy ±7μm; Printing accuracy ±15μm; Support glue printing;
2.3. Fully automatic control can improve production efficiency, control quality and save costs;
Automatic steel mesh positioning; Automatic PCB correction;
Fully closed-loop scraper pressure feedback system;
Automatic steel mesh cleaning (3 cleaning methods: dry cleaning, wet cleaning, and vacuum cleaning, which can be used in any combination);
2.4. Adopting the suspended printing head independently developed by Huanchengxin Company and the full closed-loop feedback system of scraper pressure, the pressure control is precise, which can achieve perfect solder paste forming effect;
2.5. The programmable motor controls the separation speed and stroke of the scraper and steel mesh, which can flexibly realize a variety of demoulding methods; 2.6. The multifunctional PCB fixed positioning system makes PCB positioning convenient, fast and accurate;
2.7. Sistem pemosisian visual atas dan bawah; 2.8. Sistem pemrosesan gambar yang cerdas;
2.9, Support 2D, SPI connection, SPC function;
2.10. Printing translation is driven by a motor directly connected to the lead screw.
Solder paste printing range
3.1. Production and processing of SMT components such as resistors, capacitors, inductors, diodes, transistors, etc.:
0201 (metric), 03015 (metric), 01005, 0201, 0402, 0603, 0805, 1206 and other specifications; 3.2, IC: support SOP, TSOP, TSSOP, QFN and other packages, minimum pitch (Pitch) 0.25mm;
Support BGA, CSP packaging, minimum ball diameter (Ball) 0.2mm; 3.3, Printing size: 50mm × 50mm – 510mm × 510mm;
3.4, PCB specifications: thickness 0.4mm – 6mm;
3.5. FPC specification: thickness below 0.4mm (with fixture).
Scope of application
Manufacturing of semiconductors, Mini LED, Micro LED, smart phones, communications, LCD TVs, automotive electronics, medical power equipment, aerospace and other products/equipment, and production of general electronic products.
Product Specifications
*Data pengujian berikut ini didasarkan pada suhu sekitar 25 derajat Celcius dan kelembaban 60%.
| proyek | parameter | ||
| Akurasi Posisi Ulangi | ±7μm(@6σ Cmk≥2.0) | ||
| Akurasi Pencetakan | ±15μm(@6σ Cpk≥2.0) | ||
| Kecepatan/siklus pencetakan (Waktu Siklus) | <7s (excluding printing and cleaning time) | ||
| Pergantian Produk | <5Min | ||
| Ukuran Stensil Layar/Min (X×Y) | 370mm × 470mm | ||
| Ukuran/Maks Stensil Layar (X×Y) | 737mm × 737mm | ||
| Ukuran / Ketebalan Stensil Layar | 20mm - 40mm | ||
| Ukuran/Minimum Pencetakan PCB (Ukuran/Min PCB) (X×Y) | 50mm × 50mm | ||
| Ukuran/Maks Pencetakan PCB (Ukuran/Maks PCB) (X × Y) | 510mm × 510mm, 600mm * 510mm can be customized | ||
| Ukuran / Ketebalan PCB | 0.4 – 6mm (0.4mm and below require a jig) | ||
| Rasio Lengkungan PCB | ＜ 1% (berdasarkan panjang diagonal) | ||
| Ukuran Papan Bagian Bawah | 13mm, 23mm (opsional) | ||
| Ukuran Tepi Papan | 3 mm | ||
| Transportasi Tinggi | 900 ± 20 (mm) | ||
| Arah Transportasi | kiri-kanan; kanan-kiri; kiri-kiri; kanan-kanan | ||
| Kecepatan Transportasi | 100-1500 (mm/detik) Kontrol yang dapat diprogram | ||
| Positioning of PCB
(Board Positioning) |
Sistem Pendukung | Pin ejektor magnetik/penyangga tepi | |
| Sistem Penjepit | Elastic side clamp/Z-axis pressure plate/vacuum suction | ||
| Kepala cetak | Kepala cetak yang dikontrol secara elektronik yang dapat diprogram (standar) | ||
| Kecepatan Pengikis | 10 - 200 (mm/detik) | ||
| Tekanan Pengikis | 0 – 15(kg) (Program control/full closed loop pressure feedback) | ||
| Sudut Pengikis | 60°/55°/45° (opsional) | ||
| Jenis Pengikis | Pengikis baja, pengikis karet, pengikis jenis lain perlu disesuaikan | ||
| Kecepatan Pemisahan Stensil | 0,01 - 125 (mm/detik) kontrol tiga tahap yang dapat diprogram | ||
| Metode Pembersihan | Cuci kering, cuci basah, penyedotan debu (dapat diprogram dalam kombinasi apa pun) | ||
| Rentang Penyesuaian Tabel | X: ±4mm; Y: ±6mm ; θ : ±2 ° | ||
| Jenis fidusia gambar | Fiducial geometri standar, bantalan/bukaan | ||
| Sistem Kamera | Kamera digital/sistem penglihatan koaksial teleskopik/sumber cahaya LED koaksial independen empat arah/berbentuk cincin | ||
| CCD (Kamera) | 5 megapixels, 6.4mm × 4.8mm upper and lower dual fields of view, pixel accuracy 2.7 μm (optional field of view 10mm × 8mm) | ||
| Tekanan Udara | 4 - 6 (Kg/cm2) | ||
| Konsumsi Udara | Sekitar 0,007 m³ / menit | ||
| Metode Kontrol | Kontrol PC | ||
| Catu Daya | AC:220-240V,50/60HZ 1Φ 2.5KW，13A | ||
| Dimensi Mesin (P × L × T) | 1250 × 1440 × 1510 (mm) (excluding the lighthouse height, see the product external dimensions) | ||
| Berat mesin | Approx :1200Kg | ||
| Suhu Operasi | -20℃ - +45℃ | ||
| Kelembaban Operasi | 30% – 60% | ||
Konfigurasi Mesin
1. Kontrol elektronik yang dapat diprogram untuk menyesuaikan tekanan pengikis Kepala pencetakan pengikis yang ditangguhkan:
1.1. The scraper pressure can be adjusted by programmable method, and the pressure can be controlled accurately;
1.2. The front and rear scraper pressures are adjusted independently to ensure that the pressure imbalance caused by the fatigue deformation of the scraper material will not cause the difference in printing between the front and rear;
1.3. Programmable motor controls the separation speed and stroke of scraper and steel mesh;
2. Standard stainless steel scraper, unique design, longer blade life; 3. Visual alignment system;
4. Platform UVW automatic correction system; 5. Steel mesh Y-axis positioning function
6. Digital display of temperature and humidity inside the equipment 7. PCB clamping and supporting device:
7.1, Magnetic ejector pin;
7.2. PCB side flexible clamping device to ensure that the PCB will not bend or deform when clamped; 7.3. Z-axis pressure plate;
7.4, strong vacuum suction;
7.5, Flexible automatic ejector (optional);
8. CNC guide rails adjust the transport width and transport speed;
9. Three programmable steel mesh cleaning systems: dry, wet and vacuum, which can be combined arbitrarily; 10. Industrial control computer, Windows 7 operating system, Chinese/English interface;
11. Intelligent software diagnostic system;
12. Support 2D, SPI connection, SPC software functions; 13. Standard SMEMA connection interface.
Disclaimer:
Due to the real-time changes in product batches and production and supply factors, in order to provide accurate product information, specifications and parameters, and product features as much as possible, Huanchengxin may adjust and revise the text descriptions, picture effects and other contents on the above pages in real time to match the actual product performance, specifications, parameters, parts and other information; if there is a need to modify and adjust the above pages, no special notice will be given;
