概要
1) Industry background: Intelligent hardware and mobile terminals are developing rapidly
2) The role of SMT equipment in high-density miniaturization
3) Typical application cases: smart watches, headphones, mobile phone motherboards
4) Technical highlights: reflow soldering, wave soldering, and intelligent transmission equipment
業界背景：インテリジェントハードウェアとモバイル端末が急速に発展している
In recent years, the smart hardware and mobile terminal industries have experienced rapid growth, encompassing multiple product categories, including smartphones, tablets, and wearables. Consumer demand for thinner, lighter, higher-performance, and more versatile products is increasing, driving increasingly stringent requirements for process precision and production efficiency on the manufacturing side.
As leading global electronics manufacturing service companies, Foxconn and Compal Electronics have enormous production capacity requirements for smartphone and laptop motherboard production, placing extremely high demands on the stability and automation of their SMT production lines. Against this backdrop, S&M, leveraging high-precision SMT complete line solutions, provides customers with fast, efficient, and stable production capabilities, helping them maintain their lead in the fiercely competitive market.
高密度微細化におけるSMT装置の役割
The evolution of smart hardware is driving PCB design towards higher density and smaller form factors. The precision of mounting tiny packages like BGA, QFN, and 0201 resistors and capacitors has become a core challenge for production lines.
Goertek, a leading global manufacturer of acoustic and wearable products, handles a large number of tiny components and high-density boards when producing Bluetooth headsets and smartwatches. Our reflow equipment enables reliable soldering while maintaining low void rates and high yields.
In high-density and miniaturized production scenarios, S&M’s SMT equipment significantly improves production line efficiency and product consistency for our customers, meeting the precision manufacturing requirements of smart terminal products.
代表的な応用例：スマートウォッチ、ヘッドホン、携帯電話マザーボード
In actual projects, S&M equipment has been widely used in various customer product production scenarios:
Foxconn uses our reflow and loading/unloading machines in its smartphone motherboard production, achieving high-speed, highly consistent batch soldering.
Compal Computer uses our peripheral equipment in its SMT production line for notebook and tablet motherboards, ensuring smooth transfer and efficient inspection of large-size PCBs.
These successful application cases fully demonstrate that S&M equipment is not only suitable for high-volume production scenarios, but also meets the needs of precision electronics manufacturing with extremely high accuracy and yield requirements.
技術的特長：リフローはんだ付け、インテリジェント伝送装置
S&M’s technological highlights lie in its full-line integration capabilities and deep support for precision manufacturing:
リフロー技術：はんだ接合部の空洞化を大幅に低減し、BGAおよびQFN部品の信頼性を向上させます。スマートフォンやウェアラブル機器の高水準な生産要求に適しています。.
Intelligent peripheral equipment: Including loader& unloader, buffer, docking stations, and PCBA Cleaning Conveyor, they enable efficient production line integration and automated flow.華通コンピュータのマザーボード生産ラインにおいて、S&Mのリフロー技術と周辺機器が連携し、高速生産ライン上の複雑な多層基板の安定した歩留まりを確実に保証し、全体の生産サイクルタイムを改善しています。.
アプリケーション・バリュー
アプリケーションの価値S&Mは、生産ラインの自動化を改善し、不良率を低減し、柔軟な生産拡大をサポートすることで、お客様が世界のスマートハードウェア市場で競争優位性を維持できるよう支援します。