| モデル | KL-650 |
| 適用生産範囲 | Curing after dispensing or pasting of consumer electronincs |
| 寸法(mm) | 2150(L)*2050(W)*2150(H) |
| 重量(Kg) | <2000KG |
| 加熱時間 | 10minute |
| 温度設定範囲 | Room temperature – 200°C |
| 制御方法 | ±1.0°C |
| Number of temperature zones | 4 |
| Heating mode | Large circulation of hot air, two sides blowing and top return air |
| 制御方法 | PID closed-loop control +SSR drive |
| PCB boad temperature distribution deviation | ±3.0°C |
| Min beat | 15S |
| PCB maximum size(mm) | 650(L)×460(W) |
| レール幅調整範囲 | 80~460mm |
| Track width adjustment | Automatic width adjustment, and fixed track near the operating surface |
| Product flow | From left to right |
| Layer spacing | 20mm |
| Transport height(mm) | 950±30mm |
| Number of layers | 60 layers |
| Installed power | 67KW |






