モデル |
KL-650 |
適用生産範囲 |
Curing after dispensing or pasting of consumer electronincs |
寸法(mm) |
2150(L)*2050(W)*2150(H) |
重量(Kg) |
<2000KG |
加熱時間 |
10minute |
温度設定範囲 |
Room temperature – 200°C |
制御方法 |
±1.0°C |
Number of temperature zones |
4 |
Heating mode |
Large circulation of hot air, two sides blowing and top return air |
制御方法 |
PID closed-loop control +SSR drive |
PCB boad temperature distribution deviation |
±3.0°C |
Min beat |
15S |
PCB maximum size(mm) |
650(L)×460(W) |
レール幅調整範囲 |
80~460mm |
Track width adjustment |
Automatic width adjustment, and fixed track near the operating surface |
Product flow |
From left to right |
Layer spacing |
20mm |
Transport height(mm) |
950±30mm |
Number of layers |
60 layers |
Installed power |
67KW |