리플로우 오븐

A reflow oven is a key machine in the Surface Mount Technology (SMT) line. Its primary job is to use a precise heating and cooling sequence, known as a “thermal profile,” to melt solder paste. This process creates strong, reliable electrical bonds between electronic components and the Printed Circuit Board (PCB).

The Four Critical Stages of the Reflow Soldering Profile

This thermal profile is divided into four distinct zones, each with a specific function.

1. Preheat Zone

• Purpose: Gradually raises the assembly’s temperature.

• Key Actions:

  • Prevents thermal shock (cracking) to sensitive components.

  • Safely evaporates volatile solvents from the solder paste.

2. Soak (Thermal Stabilization) Zone

• Purpose: Equalizes the temperature across the entire board.

• Key Actions:

  • Ensures large and small components reach a uniform temperature.

  • Activates the flux, which cleans the surfaces for soldering.

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3. Reflow (Time Above Liquidus) Zone

• Purpose: The peak temperature stage where soldering happens.

• Key Actions:

  • The oven temperature rises above the solder’s melting point.

  • Molten solder “wets” the component leads and PCB pads, forming the permanent joint.

Learn More:  How to Set a Reflow Oven Temperature Profile for Better Soldering

4. Cooling Zone

• Purpose: Rapidly and in a controlled manner, cools the assembly to solidify the solder.

• Key Actions:

  • A fast cooling rate (e.g., 3-6°C per second) is critical for a strong, fine-grain joint structure.

     
     

  • S&M ovens use high-efficiency top and bottom convection for optimal cooling.

     
     

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