{"id":3255,"date":"2025-10-02T13:57:45","date_gmt":"2025-10-02T05:57:45","guid":{"rendered":"https:\/\/www.chuxin-smt.com\/?p=3255"},"modified":"2026-07-14T19:02:03","modified_gmt":"2026-07-14T11:02:03","slug":"slug-the-anatomy-of-a-wave-soldering-machine","status":"publish","type":"post","link":"https:\/\/www.chuxin-smt.com\/pt\/slug-the-anatomy-of-a-wave-soldering-machine\/","title":{"rendered":"A anatomia de uma m\u00e1quina de solda por onda"},"content":{"rendered":"<h2 id=\"thecorestructureofthesmtproductionline\">A estrutura central da linha de produ\u00e7\u00e3o SMT<\/h2>\n<p>Uma linha de produ\u00e7\u00e3o SMT (tecnologia de montagem em superf\u00edcie) \u00e9 um sistema de montagem automatizado concebido para a produ\u00e7\u00e3o precisa e de grande volume de placas de circuito impresso (PCB). Compreender a sua estrutura central \u00e9 crucial para dominar a montagem e a soldadura eficientes de componentes electr\u00f3nicos. Todo o processo consiste numa s\u00e9rie de etapas cuidadosamente coordenadas, cada uma delas realizada por equipamento especializado. A base desta linha de produ\u00e7\u00e3o automatizada \u00e9 normalmente formada por v\u00e1rias m\u00e1quinas-chave ligadas para garantir uma transi\u00e7\u00e3o perfeita da placa nua para o produto acabado.<\/p>\n<p>No centro da estrutura da linha de produ\u00e7\u00e3o SMT est\u00e3o os seguintes componentes principais:<\/p>\n<ul>\n<li><strong>Carregador de PCB:<\/strong> O processo come\u00e7a <a href=\"https:\/\/www.chuxin-smt.com\/pt\/difference-between-loader-and-unloader-in-smt-lines\/\">com um carregador de placas de circuito impresso<\/a> , which automatically feeds bare boards from cassettes into the production line. This initial step eliminates manual handling and reduces the risk of contamination and damage. At the other end, a PCB unloader collects the completed PCBs and stacks them for the next stage of production or testing. The production line\u2019s automated handling is crucial to maintaining continuous, high-speed production . <a href=\"https:\/\/www.electronicdesign.com\/technologies\/components\/article\/21211105\/electronic-design-the-basics-of-surface-mount-technology-smt\">[Fonte: Electronic Design].<\/a><\/li>\n<li><strong>Impressora de pasta de solda:<\/strong> Once the bare board is loaded, it is sent to a solder paste printer. This machine uses a stencil and scraper to apply a precise layer of solder paste to the specific pads where the components are placed. Accuracy at this stage is crucial, as insufficient or excessive solder paste can result in soldering defects such as opens or solder bridges . <a href=\"https:\/\/www.epectec.com\/pcb\/assembly\/smt-process.html\">[Fonte: Epec Engineered Technologies]<\/a><\/li>\n<li><strong>M\u00e1quinas de coloca\u00e7\u00e3o de chips:<\/strong> Estes s\u00e3o o cora\u00e7\u00e3o da linha de produ\u00e7\u00e3o SMT. Recolhem componentes individuais de montagem em superf\u00edcie a partir de bobinas ou tabuleiros e colocam-nos com precis\u00e3o nas placas. As m\u00e1quinas modernas funcionam a velocidades extremamente elevadas, capazes de colocar milhares de componentes por hora com elevada precis\u00e3o, o que \u00e9 crucial para a efici\u00eancia da montagem SMT.<\/li>\n<li><strong>M\u00e1quina de soldar (soldadura por refluxo ou por onda):<\/strong> Ap\u00f3s a coloca\u00e7\u00e3o dos componentes, a placa de circuito impresso tem de ser aquecida para derreter a pasta de solda, criando uma liga\u00e7\u00e3o el\u00e9ctrica permanente. O m\u00e9todo mais comum utilizado em SMT \u00e9 <a href=\"https:\/\/www.chuxin-smt.com\/pt\/how-does-a-reflow-oven-work\/\">soldadura por refluxo<\/a> . A placa \u00e9 movida numa correia transportadora atrav\u00e9s de m\u00faltiplas zonas de aquecimento, seguindo um <a href=\"https:\/\/www.chuxin-smt.com\/pt\/slug-mastering-the-pcb-reflow-temperature-profile-2\/\">perfil de temperatura<\/a> para garantir que todas as juntas de solda s\u00e3o formadas corretamente sem danificar os componentes <a href=\"https:\/\/www.pcb-technologies.com\/smt-assembly-a-comprehensive-guide\/\">[fonte: PCB Technologies].<\/a> . Para placas com componentes de furo passante, <a href=\"https:\/\/www.chuxin-smt.com\/pt\/what-is-wave-soldering\/\">uma soldadura por onda<\/a> \u00e9 utilizada uma m\u00e1quina que passa a placa atrav\u00e9s de uma onda de solda derretida.<\/li>\n<li><strong>Transportadores de PCB: A liga\u00e7\u00e3o de todas estas m\u00e1quinas \u00e9 a<\/strong> <a href=\"https:\/\/www.chuxin-smt.com\/pt\/slug-the-complete-guide-to-pcb-conveyors\/\">Transportador de PCB<\/a> system . These automated conveyors transport circuit boards from one workstation to the next. Conveyor speed and stability are crucial to <a href=\"https:\/\/www.chuxin-smt.com\/pt\/pcb-conveyors-optimize-line-layout-and-improve-efficiency\/\">otimiza\u00e7\u00e3o do fluxo de trabalho<\/a> e evitar estrangulamentos ou desloca\u00e7\u00e3o de componentes durante o transporte. As linhas mais complexas podem tamb\u00e9m incorporar transportadores de reserva ou portas de vaiv\u00e9m para gerir dinamicamente o processo de produ\u00e7\u00e3o.<\/li>\n<\/ul>\n<h2 id=\"preparingtheboardfluxingandpreheatingareas\">Prepara\u00e7\u00e3o da placa: \u00c1reas de fluxo e pr\u00e9-aquecimento<\/h2>\n<p>Quando um conjunto de PCB passa por uma m\u00e1quina de soldadura por onda, entra primeiro nas zonas de aplica\u00e7\u00e3o de fluxo e de pr\u00e9-aquecimento. Estas fases iniciais s\u00e3o cruciais para preparar a placa para a forma\u00e7\u00e3o de uma junta de soldadura bem sucedida. Saltar estes passos ou geri-los de forma incorrecta pode resultar em in\u00fameros defeitos de soldadura.<\/p>\n<h3 id=\"theroleoffluxzone\">O papel da zona de fluxo<\/h3>\n<p>Antes de a placa de circuito impresso entrar em contacto com a solda fundida, passa por uma zona de fluxo, onde \u00e9 revestida com uma camada de fluxo. A principal fun\u00e7\u00e3o do fluxo \u00e9 limpar a superf\u00edcie met\u00e1lica e prepar\u00e1-la para a soldadura. Isto \u00e9 feito de tr\u00eas formas principais:<\/p>\n<ul>\n<li><strong>Remo\u00e7\u00e3o de \u00f3xidos:<\/strong> Metal surfaces (including component leads and PCB pads) naturally form oxide layers when exposed to air. These oxide layers prevent solder from forming a good metal bond. Flux contains chemical activators that effectively remove these oxides . <a href=\"https:\/\/www.aimsolder.com\/technical-articles\/importance-flux-soldering-applications\">[Fonte: AIM Solder]<\/a><\/li>\n<li><strong>Melhoria da humidade:<\/strong> Flux cleans the surface, allowing the molten solder to \u201cwet,\u201d or evenly distribute, over the metal pads and leads. This wetting is crucial for forming strong, reliable solder joints.<\/li>\n<li><strong>Evita a re-oxida\u00e7\u00e3o:<\/strong> O fluxo forma uma barreira protetora nas superf\u00edcies limpas, impedindo-as de re-oxidar \u00e0 medida que a placa passa pela zona de aquecimento da m\u00e1quina antes de chegar \u00e0 onda de solda.<\/li>\n<\/ul>\n<p>Flux can be applied by a variety of methods, including spraying, foaming, or dipping, with spray flux being the most common method in modern equipment due to its high precision and control. For more detailed information, see our <a href=\"https:\/\/www.chuxin-smt.com\/pt\/wave-soldering-flux-selection-and-maintenance-guide\/\">guia para a sele\u00e7\u00e3o e manuten\u00e7\u00e3o de fluxos.<\/a><\/p>\n<h3 id=\"criticalwarmupphase\">Fase cr\u00edtica de aquecimento<\/h3>\n<p>Ap\u00f3s a aplica\u00e7\u00e3o do fluxo, a placa de circuito impresso entra imediatamente na zona de pr\u00e9-aquecimento. Esta fase consiste em aumentar gradualmente a temperatura de todo o conjunto. O processo de pr\u00e9-aquecimento faz mais do que apenas aquecer a placa; tamb\u00e9m desempenha v\u00e1rias fun\u00e7\u00f5es importantes:<\/p>\n<ul>\n<li><strong>Ativa\u00e7\u00e3o do fluxo:<\/strong> O calor ativa os qu\u00edmicos do fluxo, aumentando a sua capacidade de limpar superf\u00edcies met\u00e1licas. Os diferentes fluxos t\u00eam intervalos de temperatura de ativa\u00e7\u00e3o espec\u00edficos, pelo que <a href=\"\/pt\/httpsa-comprehensive-guide-to-wave-soldering-temperature\/\">controlo da temperatura<\/a> is a critical parameter . <a href=\"https:\/\/www.epectec.com\/pcb\/wave-soldering\/pre-heat-stage.html\">[Fonte: EpecTec]<\/a><\/li>\n<li><strong>Evapora\u00e7\u00e3o do solvente:<\/strong> O fluxo l\u00edquido cont\u00e9m solventes que devem evaporar antes de a placa ser exposta \u00e0 onda de solda. Se os solventes n\u00e3o forem removidos, estes solventes entrar\u00e3o em ebuli\u00e7\u00e3o violenta quando entrarem em contacto com a solda fundida, causando defeitos como bolas de solda e vazios.<\/li>\n<li><strong>Reduzir o choque t\u00e9rmico:<\/strong> The most important role of preheating is minimizing thermal shock. Thermal shock refers to the stress imposed on a PCB and its components when temperatures change rapidly. The preheat zone slowly heats the components to a specific temperature (typically between 100\u00b0C and 130\u00b0C) to ensure that the temperature difference between the board and the solder wave (approximately 250\u00b0C) is not too large. This gradual temperature increase prevents damage such as board warping and component cracking or delamination . <a href=\"https:\/\/www.pcb-technologies.com\/blog\/prevent-thermal-shock-in-pcbs\">[Fonte: PCB Technologies].<\/a><\/li>\n<\/ul>\n<p>A execu\u00e7\u00e3o correta das fases de fluxagem e pr\u00e9-aquecimento estabelece as bases <a href=\"https:\/\/www.chuxin-smt.com\/pt\/slug-a-step-by-step-guide-to-the-wave-soldering-process\/\">para todo o processo de soldadura por onda<\/a> , A Comiss\u00e3o Europeia est\u00e1 a trabalhar no sentido de assegurar que os componentes est\u00e3o qu\u00edmica e termicamente preparados para as etapas finais de soldadura.<\/p>\n<h2 id=\"theheartofthemachinesolderingpotsandwavemechanics\">O cora\u00e7\u00e3o da m\u00e1quina: potes de soldadura e mec\u00e2nica ondulat\u00f3ria<\/h2>\n<p>O cadinho de solda \u00e9 o cora\u00e7\u00e3o de qualquer m\u00e1quina de solda por onda, servindo como um reservat\u00f3rio para a solda derretida. O cadinho inicia o processo de soldadura aquecendo a liga de solda s\u00f3lida (normalmente uma composi\u00e7\u00e3o sem chumbo, como estanho-prata-cobre (SAC)) at\u00e9 um estado l\u00edquido preciso. A manuten\u00e7\u00e3o de uma temperatura consistente dentro da panela \u00e9 crucial para obter juntas de solda fi\u00e1veis. Conforme discutido no nosso <a href=\"https:\/\/www.chuxin-smt.com\/pt\/slug-a-comprehensive-guide-to-wave-soldering-temperature\/\">guia de temperatura de soldadura por onda<\/a> , Mesmo pequenas flutua\u00e7\u00f5es podem levar a defeitos como choque t\u00e9rmico ou humedecimento incompleto. Com o tempo, a superf\u00edcie da solda fundida reage com o ar, formando uma camada de \u00f3xidos e impurezas conhecida como esc\u00f3ria. A remo\u00e7\u00e3o regular desta esc\u00f3ria \u00e9 crucial, uma vez que pode introduzir contaminantes durante o processo de soldadura e causar defeitos como a forma\u00e7\u00e3o de gelo e a forma\u00e7\u00e3o de pontes <a href=\"https:\/\/www.kester.com\/knowledge-base\/dross-and-drossing\">[fonte: Kester]<\/a> .<\/p>\n<p>From this carefully controlled solder pot, molten solder is pumped upward through the nozzle to form a solder wave\u2014the heart of the entire soldering process. Modern wave soldering systems almost universally utilize a dual-wave process to handle complex, mixed-technology PCBs. Understanding the unique role of each wave is key to mastering the soldering process, a topic we\u2019ll explore as we <a href=\"https:\/\/www.chuxin-smt.com\/pt\/slug-a-deep-dive-into-solder-wave-dynamics\/\">aprofundar a din\u00e2mica das ondas de solda<\/a> .<\/p>\n<ol>\n<li><strong>Onda Turbulenta (Chip Wave):<\/strong> The first wave a PCB encounters is turbulent flow, typically bidirectional. Its aggressive, agitated flow is designed to ensure complete solder coverage, forcing solder into tight spaces such as plated through-holes and under surface-mount components. This action overcomes component shadowing and promotes good wetting of all solderable surfaces . <a href=\"https:\/\/www.epectec.com\/pcb\/wave-soldering\/process.html\">[Fonte: Epec Engineered Technologies]<\/a><\/li>\n<li><strong>Onda laminar (suave):<\/strong> Ap\u00f3s a onda turbulenta, o PCB passa por uma segunda onda, mais suave. A onda laminar flui numa \u00fanica dire\u00e7\u00e3o, resultando numa superf\u00edcie calma e est\u00e1vel. O seu objetivo \u00e9 endireitar e dar forma: remove o excesso de solda depositado pela onda turbulenta, elimina as pontes de solda entre pinos pouco espa\u00e7ados e, por fim, cria um filete de solda perfeito.<\/li>\n<\/ol>\n<p>The effectiveness of the entire system depends on precise calibration of the solder wave\u2019s dynamic characteristics. Critical parameters such as <a href=\"https:\/\/www.chuxin-smt.com\/pt\/how-to-adjust-solder-wave-height-for-pcb-soldering-quality\/\">altura da onda<\/a> , A velocidade do transportador (que determina o tempo de contacto) e o \u00e2ngulo do transportador devem estar perfeitamente sincronizados. O objetivo \u00e9 assegurar um tempo de contacto suficiente para uma molhagem adequada da placa de circuito impresso sem submeter os componentes a um stress t\u00e9rmico excessivo. Este equil\u00edbrio entre um banho de solda est\u00e1vel e uma onda de solda din\u00e2mica determina, em \u00faltima an\u00e1lise, a qualidade e a fiabilidade do produto final.<\/p>\n<h2 id=\"finalassemblycoolingcleaningandinspection\">Montagem final: arrefecimento, limpeza e inspe\u00e7\u00e3o<\/h2>\n<p>The soldering process for printed circuit boards (PCBs) doesn\u2019t end when the solder melts. The cooling phase is a critical and controlled step that allows the molten solder to solidify, forming a strong and reliable electrical connection. If this phase is rushed or performed incorrectly, the meticulous work of preheating and reflow can be undone, leading to a host of defects.<\/p>\n<h3 id=\"thekeyroleofcoolingrate\">O papel fundamental da taxa de arrefecimento<\/h3>\n<p>Depois de a placa de circuito impresso atingir a temperatura m\u00e1xima durante o processo de soldadura, entra em <a href=\"https:\/\/www.chuxin-smt.com\/pt\/slug-a-comprehensive-guide-to-the-reflow-oven-cooling-zone\/\">a zona de arrefecimento<\/a> . The primary goal here is to reduce the component temperature at a controlled rate. This rate is arguably the most critical parameter during this stage, as it directly impacts the solder joint\u2019s microstructure, thus affecting its mechanical strength and long-term reliability.<\/p>\n<p>As taxas de arrefecimento \u00f3ptimas (normalmente cerca de -4\u00b0C por segundo) s\u00e3o cruciais para o desenvolvimento de uma microestrutura de gr\u00e3o fino na solda <a href=\"https:\/\/www.circuitnet.com\/experts\/85915.html\">[fonte: CircuitNet].<\/a> . This fine-grained structure enhances the joint\u2019s fatigue resistance and overall durability. However, deviations from the optimal cooling rate can cause serious problems:<\/p>\n<ul>\n<li><strong>Arrefecimento demasiado r\u00e1pido:<\/strong> Uma queda r\u00e1pida da temperatura pode provocar um choque t\u00e9rmico, gerando tens\u00f5es que podem rachar o substrato da placa de circuito impresso ou os pr\u00f3prios componentes. Isto \u00e9 especialmente perigoso para condensadores de cer\u00e2mica sens\u00edveis.<\/li>\n<li><strong>Arrefecimento demasiado lento:<\/strong> Cooling too slowly can lead to excessive growth of intermetallic compounds (IMC) at the solder-component lead interface. While a thin IMC layer is desirable for a good connection, a thick, brittle IMC layer can compromise the integrity of the joint, making it susceptible to failure under stress or vibration . <a href=\"https:\/\/www.belpower-solutions.com\/resource\/soldering-process-control-for-pcba\">[Fonte: Bel Power Solutions].<\/a><\/li>\n<\/ul>\n<p>Masteriza\u00e7\u00e3o <a href=\"https:\/\/www.chuxin-smt.com\/pt\/reflow-soldering-cooling-system-importance-optimization\/\">o seu sistema de arrefecimento para soldadura por refluxo<\/a> \u00e9 fundamental para evitar estes problemas e garantir resultados consistentes e de alta qualidade.<\/p>\n<h3 id=\"postweldcleaningandinspection\">Limpeza e inspe\u00e7\u00e3o p\u00f3s-soldadura<\/h3>\n<p>Depois de a placa ter arrefecido e as juntas de soldadura terem solidificado, a montagem passa para a fase de p\u00f3s-soldadura para verificar a qualidade e prepar\u00e1-la para a aplica\u00e7\u00e3o final.<\/p>\n<p><strong>1. Limpeza:<\/strong><br \/>\n The soldering process often leaves behind flux residue. While \u201cno-clean\u201d fluxes are common, their residue can sometimes interfere with probing during in-circuit testing or prevent conformal coatings from properly adhering. Cleaning is essential for high-reliability applications in the automotive, medical, or aerospace industries. Flux residue can be acidic and absorb moisture from the air, potentially causing corrosion and electrical shorts over time <a href=\"https:\/\/www.epectec.com\/pcb\/assembly\/post-soldering-cleaning.html\">[fonte: Epec].<\/a> . Pode ser utilizada uma variedade de m\u00e9todos de limpeza, incluindo sistemas aquosos, semi-aquosos e \u00e0 base de solventes, para remover estes contaminantes nocivos.<\/p>\n<p><strong>2. Inspe\u00e7\u00e3o e ensaio:<\/strong><br \/>\n Para garantir a qualidade, cada componente \u00e9 submetido a uma inspe\u00e7\u00e3o rigorosa. Os principais m\u00e9todos incluem:<\/p>\n<ul>\n<li><strong>Inspe\u00e7\u00e3o \u00d3tica Automatizada (AOI):<\/strong> An AOI system uses a high-resolution camera to scan the PCB and compare it to a detailed template of a \u201cgold\u201d board. It can quickly detect defects such as solder bridges, open circuits, insufficient solder, and incorrect component placement.<\/li>\n<li><strong>Inspe\u00e7\u00e3o automatizada por raios X (AXI):<\/strong> O AXI \u00e9 crucial para componentes com juntas de soldadura ocultas, tais como matrizes de grelha esf\u00e9rica (BGAs). Os raios X podem penetrar no corpo do componente e gerar imagens das liga\u00e7\u00f5es subjacentes, revelando defeitos que os sistemas \u00f3pticos n\u00e3o conseguem detetar, tais como <a href=\"https:\/\/www.chuxin-smt.com\/pt\/how-to-reduce-voids-in-reflow-soldering-process-tips\/\">vazios de solda<\/a> or shorts . <a href=\"https:\/\/www.creativehitech.com\/blog\/basics-of-automated-x-ray-inspection-axi-for-pcb\/\">[Fonte: Creative Hi-Tech].<\/a><\/li>\n<\/ul>\n<p>Ap\u00f3s esta inspe\u00e7\u00e3o, \u00e9 normalmente efectuado um teste funcional para garantir que a placa est\u00e1 corretamente alimentada e a funcionar como previsto. Este controlo final verifica se toda a <a href=\"https:\/\/www.chuxin-smt.com\/pt\/slug-a-deep-dive-into-the-reflow-soldering-process\/\">refluxo<\/a> ou <a href=\"https:\/\/www.chuxin-smt.com\/pt\/slug-a-step-by-step-guide-to-the-wave-soldering-process\/\">processo de soldagem por onda<\/a> foi conclu\u00edda com \u00eaxito, resultando num conjunto eletr\u00f3nico fi\u00e1vel e totalmente funcional.<\/p>\n<h2 id=\"source\">fonte<\/h2>\n<ul>\n<li><a href=\"https:\/\/www.aimsolder.com\/technical-articles\/importance-flux-soldering-applications\">AIM Solder \u2013 The Importance of Flux in Soldering Applications<\/a><\/li>\n<li><a href=\"https:\/\/www.belpower-solutions.com\/resource\/soldering-process-control-for-pcba\">Bel Power Solutions \u2013 PCBA Soldering Process Control<\/a><\/li>\n<li><a href=\"https:\/\/www.circuitnet.com\/experts\/85915.html\">CircuitNet \u2013 Effects of Cooling Rate<\/a><\/li>\n<li><a href=\"https:\/\/www.creativehitech.com\/blog\/basics-of-automated-x-ray-inspection-axi-for-pcb\/\">Creative Hi-Tech \u2013 PCB Automated X-ray Inspection (AXI) Basics<\/a><\/li>\n<li><a href=\"https:\/\/www.electronicdesign.com\/technologies\/components\/article\/21211105\/electronic-design-the-basics-of-surface-mount-technology-smt\">Electronic Design \u2013 Surface Mount Technology (SMT) Basics<\/a><\/li>\n<li><a href=\"https:\/\/www.epectec.com\/pcb\/assembly\/post-soldering-cleaning.html\">Epec Engineered Technologies \u2013 Post-Solder PCB Cleaning<\/a><\/li>\n<li><a href=\"https:\/\/www.epectec.com\/pcb\/assembly\/smt-process.html\">Epec Engineered Technologies \u2013 SMT Assembly Process<\/a><\/li>\n<li><a href=\"https:\/\/www.epectec.com\/pcb\/wave-soldering\/process.html\">Epec Engineering Technology \u2013 Wave Soldering Process<\/a><\/li>\n<li><a href=\"https:\/\/www.epectec.com\/pcb\/wave-soldering\/pre-heat-stage.html\">Epec Engineered Technologies \u2013 Wave Soldering Preheat Stage<\/a><\/li>\n<li><a href=\"https:\/\/www.kester.com\/knowledge-base\/dross-and-drossing\">Kester - Borras e borras<\/a><\/li>\n<li><a href=\"https:\/\/www.pcb-technologies.com\/blog\/prevent-thermal-shock-in-pcbs\">PCB Technology \u2013 How to Prevent Thermal Shock in PCBs<\/a><\/li>\n<li><a href=\"https:\/\/www.pcb-technologies.com\/smt-assembly-a-comprehensive-guide\/\">PCB Technology \u2013 SMT Assembly \u2013 Comprehensive Guide<\/a><\/li>\n<\/ul>\n<p>\u201c`<\/p>","protected":false},"excerpt":{"rendered":"<p>The core structure of the SMT production line An SMT (surface mount technology) production line is an automated assembly system [&hellip;]<\/p>","protected":false},"author":1,"featured_media":3254,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"categories":[1],"tags":[],"class_list":["post-3255","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-company-news"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.chuxin-smt.com\/pt\/wp-json\/wp\/v2\/posts\/3255","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.chuxin-smt.com\/pt\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.chuxin-smt.com\/pt\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/pt\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/pt\/wp-json\/wp\/v2\/comments?post=3255"}],"version-history":[{"count":0,"href":"https:\/\/www.chuxin-smt.com\/pt\/wp-json\/wp\/v2\/posts\/3255\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/pt\/wp-json\/wp\/v2\/media\/3254"}],"wp:attachment":[{"href":"https:\/\/www.chuxin-smt.com\/pt\/wp-json\/wp\/v2\/media?parent=3255"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/pt\/wp-json\/wp\/v2\/categories?post=3255"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/pt\/wp-json\/wp\/v2\/tags?post=3255"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}