Why the Cooling Zone Matters in Reflow Ovens
The cooling zone in reflow ovens is critical for swiftly reducing PCB temperature post-solder melting, solidifying reliable solder joints. Best practices include controlling the cooling rate between 2°C to 6°C per second, addressing common challenges like uneven cooling and thermal stress. Advanced technologies, including closed-loop convection control and configurable cooling zones, enhance consistency, energy efficiency, and sustainability. Implementing these systems not only optimizes production efficiency but also reduces operational costs by lowering nitrogen consumption and energy expenditure. Manufacturers are encouraged to adopt cutting-edge cooling solutions to maintain competitive advantages in the evolving electronics market.










