Sfaturi de configurare a procesului de lipire cu undă și soluții pentru defectele comune. Reglați parametrii, reduceți punțile și creșteți calitatea asamblării PCB cu metode dovedite.
Improve Wave Soldering quality with five proven methods for fewer defects, stronger joints, and higher first-pass yield in PCB assembly.
Optimizarea sistemelor de răcire pentru lipirea prin reflow asigură îmbinări puternice, previne defectele și sporește fiabilitatea PCB cu metode de răcire controlate.
Nitrogen usage in reflow ovens typically ranges from 18–30 m³/hr, maintaining low oxygen levels to reduce oxidation and improve solder joint quality.
Wave soldering suits high-volume through-hole boards, while reflow excels with complex, high-density SMT designs. Choose based on your production needs.
Comparing Wave and Selective Wave Soldering Methods Explore key differences to choose the best PCB soldering method. Features Wave Soldering
Select the ideal wave soldering machine by evaluating PCB size, production volume, component types, and automation needs for your assembly line.
Select the ideal reflow oven size for your PCB volume by matching oven zones and capacity to your board size, production needs, and future growth.
Nitrogen in a reflow oven reduces oxidation, improves solder joint quality, and lowers defects, making it essential for reliable electronics manufacturing.
Buying SMT equipment? Learn the process, avoid common pitfalls, and get expert tips to choose the right SMT equipment for your production needs.
