{"id":2666,"date":"2025-08-21T09:15:53","date_gmt":"2025-08-21T01:15:53","guid":{"rendered":"https:\/\/www.chuxin-smt.com\/minimizing-thermal-stress-selective-wave-soldering-tips\/"},"modified":"2025-08-21T11:52:15","modified_gmt":"2025-08-21T03:52:15","slug":"minimizing-thermal-stress-selective-wave-soldering-tips","status":"publish","type":"post","link":"https:\/\/www.chuxin-smt.com\/ro\/minimizing-thermal-stress-selective-wave-soldering-tips\/","title":{"rendered":"Minimizarea stresului termic \u00een lipirea selectiv\u0103 prin und\u0103"},"content":{"rendered":"<figure class=\"wp-block-image aligncenter size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1200\" height=\"675\" class=\"wp-image-2661\" src=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738950-f8b7dd16d6b541c4aefb710cb8b0e921.webp\" alt=\"Minimizing Thermal Stress in Selective Wave Soldering\" srcset=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738950-f8b7dd16d6b541c4aefb710cb8b0e921.webp 1200w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738950-f8b7dd16d6b541c4aefb710cb8b0e921-300x169.webp 300w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738950-f8b7dd16d6b541c4aefb710cb8b0e921-1024x576.webp 1024w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738950-f8b7dd16d6b541c4aefb710cb8b0e921-768x432.webp 768w\" sizes=\"(max-width: 1200px) 100vw, 1200px\" title=\"Minimizing Thermal Stress in Selective Wave Soldering - S&amp;M Co.Ltd\" \/><\/figure>\r\n\r\n\r\n\r\n<p>Pute\u021bi reduce stresul termic \u00een procesul de lipire selectiv\u0103 cu und\u0103 prin utilizarea pre\u00eenc\u0103lzirii, controlului temperaturii \u0219i \u00eenc\u0103lzirii selective.<\/p>\r\n\r\n\r\n\r\n<ul class=\"wp-block-list\">\r\n<li>\r\n<p><a href=\"https:\/\/www.mclpcb.com\/blog\/wave-soldering-issues\/\" target=\"_blank\" rel=\"nofollow noopener\">Pre\u00eenc\u0103lzirea \u00eenc\u0103lze\u0219te lent placa PCB<\/a>. Acest lucru opre\u0219te \u0219ocul termic \u0219i ajut\u0103 la prevenirea fisur\u0103rii sau ridic\u0103rii pieselor.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Dac\u0103 s\u0103ri\u021bi peste pre\u00eenc\u0103lzire, pute\u021bi \u00eent\u00e2mpina probleme precum umplerea insuficient\u0103 a g\u0103urilor sau ridicarea pieselor, deoarece temperatura nu este constant\u0103.<\/p>\r\n<\/li>\r\n<li>\r\n<p><a href=\"https:\/\/www.seeedstudio.com\/blog\/2021\/06\/18\/why-pcb-preheating-is-so-important\/\" target=\"_blank\" rel=\"noopener\">Un control bun al temperaturii asigur\u0103 c\u0103 placa se \u00eenc\u0103lze\u0219te suficient \u00eenainte de valul de lipire.<\/a>. Acest lucru contribuie la realizarea unor \u00eembin\u0103ri mai bune prin lipire \u0219i reduce riscul de defectare a pieselor.<\/p>\r\n<\/li>\r\n<\/ul>\r\n\r\n\r\n\r\n<h2 class=\"wp-block-heading\">Principalele concluzii<\/h2>\r\n\r\n\r\n\r\n<ul class=\"wp-block-list\">\r\n<li>\r\n<p>\u00cenc\u0103lzi\u021bi lent placa PCB \u00eentre 100 \u00b0C \u0219i 150 \u00b0C. Acest lucru ajut\u0103 la prevenirea \u0219ocului termic. De asemenea, \u00eempiedic\u0103 cr\u0103parea sau ridicarea pieselor.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Ceas <a href=\"https:\/\/www.chuxin-smt.com\/ro\/improve-wave-soldering-quality-5-effective-methods\/\" target=\"_blank\" rel=\"noopener\">set\u0103ri val de lipit<\/a> cum ar fi temperatura, \u00een\u0103l\u021bimea valurilor \u0219i timpul de sta\u021bionare. Acest lucru asigur\u0103 \u00eembin\u0103ri solide prin lipire. De asemenea, ajut\u0103 la prevenirea deterior\u0103rii.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Folosi\u021bi bariere termice \u0219i alege\u021bi cu aten\u021bie fluxul. Astfel, piesele sensibile vor fi protejate. De asemenea, fluxul va curge mai bine.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Verifica\u021bi procesul de lipire \u00een timp real cu ajutorul senzorilor \u0219i camerelor. Acest lucru ajut\u0103 la identificarea timpurie a problemelor. De asemenea, men\u021bine calitatea la un nivel ridicat.<\/p>\r\n<\/li>\r\n<li>\r\n<p><a href=\"https:\/\/www.chuxin-smt.com\/ro\/high-precision-welding-selective-wave-soldering-solutions\/\" target=\"_blank\" rel=\"noopener\">Proiecta\u021bi-v\u0103 PCB-ul<\/a> cu reliefuri termice \u0219i cupru echilibrat. Acest lucru distribuie c\u0103ldura uniform. Ajut\u0103 la prevenirea deform\u0103rii sau a punctelor fierbin\u021bi.<\/p>\r\n<\/li>\r\n<\/ul>\r\n\r\n\r\n\r\n<h2 class=\"wp-block-heading\">No\u021biuni de baz\u0103 privind stresul termic<\/h2>\r\n\r\n\r\n\r\n<figure class=\"wp-block-image aligncenter size-large\"><img decoding=\"async\" width=\"1200\" height=\"675\" class=\"wp-image-2662\" src=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738951-45aa593073fd4dc88d84128e189bcf13.webp\" alt=\"Thermal Stress Basics\" srcset=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738951-45aa593073fd4dc88d84128e189bcf13.webp 1200w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738951-45aa593073fd4dc88d84128e189bcf13-300x169.webp 300w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738951-45aa593073fd4dc88d84128e189bcf13-1024x576.webp 1024w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738951-45aa593073fd4dc88d84128e189bcf13-768x432.webp 768w\" sizes=\"(max-width: 1200px) 100vw, 1200px\" title=\"Minimizing Thermal Stress in Selective Wave Soldering1 - S&amp;M Co.Ltd\" \/><\/figure>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Cauze<\/h3>\r\n\r\n\r\n\r\n<p>Stresul termic apare atunci c\u00e2nd componentele de pe placa de circuit imprimat se m\u0103resc sau se mic\u0219oreaz\u0103 la viteze diferite. Fiecare material, cum ar fi cipul, lipitura \u0219i cuprul, \u00ee\u0219i modific\u0103 dimensiunea \u00een mod diferit. Acest lucru se datoreaz\u0103 faptului c\u0103 fiecare are o <a href=\"https:\/\/www.mdpi.com\/2079-9292\/11\/1\/62\" target=\"_blank\" rel=\"nofollow noopener\">coeficient diferit de dilatare termic\u0103 (CTE)<\/a>. C\u00e2nd \u00eenc\u0103lzi\u021bi placa, aceste diferen\u021be provoac\u0103 tensiuni \u00een punctele de contact dintre materiale. Cele mai mari tensiuni apar \u00eentre cip \u0219i lipitur\u0103. \u00cenc\u0103lzirea \u0219i r\u0103cirea repetat\u0103 a pl\u0103cii agraveaz\u0103 tensiunile. Dup\u0103 mai multe cicluri, pot ap\u0103rea fisuri \u00een punctul de contact dintre cip \u0219i lipitur\u0103. Dac\u0103 alege\u021bi o lipitur\u0103 cu un CTE apropiat de cel al cipului, pute\u021bi reduce tensiunile \u0219i prelungi durata de via\u021b\u0103 a pl\u0103cii.<\/p>\r\n\r\n\r\n\r\n<p>Lipirea selectiv\u0103 cu und\u0103 v\u0103 permite s\u0103 controla\u021bi unde se duce c\u0103ldura. Aceasta <a href=\"https:\/\/www.pcbaaa.com\/selective-wave-soldering-vs-traditional-wave-soldering-which-is-better\/\" target=\"_blank\" rel=\"nofollow noopener\">nu \u00eenc\u0103lze\u0219te \u00eentreaga plac\u0103<\/a> ca lipirea tradi\u021bional\u0103 cu valuri. \u00cen schimb, aceasta <a href=\"https:\/\/www.linkedin.com\/pulse\/role-significance-selective-wave-soldering-pcba-alice-wu-sru7c\" target=\"_blank\" rel=\"nofollow noopener\">\u00eenc\u0103lze\u0219te numai punctele care necesit\u0103 lipire<\/a>. Acest lucru men\u021bine restul pl\u0103cii mai rece. De asemenea, protejeaz\u0103 componente precum conectorii \u0219i circuitele integrate. Prin faptul c\u0103 nu scufunda\u021bi \u00eentreaga plac\u0103 \u00een lipitur\u0103 fierbinte, reduce\u021bi c\u0103ldura de pe plac\u0103. Acest lucru ajut\u0103 la men\u021binerea \u00een siguran\u021b\u0103 a componentelor SMT.<\/p>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Efecte<\/h3>\r\n\r\n\r\n\r\n<p>Stresul termic poate cauza multe probleme pentru \u00eembin\u0103rile \u0219i piesele sudate. Iat\u0103 c\u00e2teva efecte comune:<\/p>\r\n\r\n\r\n\r\n<ul class=\"wp-block-list\">\r\n<li>\r\n<p>\u00cembin\u0103rile sudate se pot fisura, \u00een special \u00een locul \u00een care sudura \u00eent\u00e2lne\u0219te cipul.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Straturile de compu\u0219i intermetalici (IMC) din lipitur\u0103 pot deveni mai groase \u0219i mai fragile, ceea ce sl\u0103be\u0219te \u00eembin\u0103rile.<\/p>\r\n<\/li>\r\n<li>\r\n<p>\u00cembin\u0103rile sudate nu rezist\u0103 at\u00e2t de mult c\u00e2nd placa se \u00eenc\u0103lze\u0219te \u0219i se r\u0103ce\u0219te des.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Dispozitivele electronice se pot defecta \u0219i <a href=\"https:\/\/pmc.ncbi.nlm.nih.gov\/articles\/PMC11123225\/\" target=\"_blank\" rel=\"nofollow noopener\">aproximativ 70% din aceste defec\u021biuni<\/a> provin din probleme de ambalare \u0219i asamblare, adesea din cauza defectelor termice ale \u00eembin\u0103rilor sudate.<\/p>\r\n<\/li>\r\n<li>\r\n<p>\u00cembin\u0103rile de lipire mai mici \u0219i lipirile f\u0103r\u0103 plumb pot agrava aceste probleme, acceler\u00e2nd cre\u0219terea IMC.<\/p>\r\n<\/li>\r\n<\/ul>\r\n\r\n\r\n\r\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\r\n<p>Sfat: Pute\u021bi spori fiabilitatea pl\u0103cii dvs. urm\u0103rind ciclurile de temperatur\u0103 \u0219i aleg\u00e2nd materiale cu valori CTE similare.<\/p>\r\n<\/blockquote>\r\n\r\n\r\n\r\n<h2 class=\"wp-block-heading\">Factori cheie<\/h2>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Profilul temperaturii<\/h3>\r\n\r\n\r\n\r\n<p>Este important s\u0103 urm\u0103ri\u021bi <a href=\"https:\/\/www.hvttec.com\/what-is-the-optimal-temperature-for-selective-wave-soldering.html\" target=\"_blank\" rel=\"nofollow noopener\">profilul temperaturii<\/a> \u00een timpul lipirii selective cu und\u0103. Acest lucru ajut\u0103 la men\u021binerea siguran\u021bei PCB-ului \u0219i a componentelor sale. <a href=\"https:\/\/www.allpcb.com\/fr-FR\/blog\/pcb-assembly\/optimizing-wave-soldering-temperature-a-key-factor-for-reliable-pcb-joints.html\" target=\"_blank\" rel=\"nofollow noopener\">Pre\u00eenc\u0103lzirea pl\u0103cii \u00eentre 100 \u00b0C \u0219i 150 \u00b0C timp de 60 p\u00e2n\u0103 la 120 de secunde<\/a> este util. Reduce \u0219ocul termic \u0219i face fluxul s\u0103 func\u021bioneze. Acest pas preg\u0103te\u0219te placa pentru lipire. De asemenea, se asigur\u0103 c\u0103 fluxul poate cur\u0103\u021ba oxizii. Dac\u0103 \u00eenc\u0103lzi\u021bi placa \u00eencet, la 1-3 \u00b0C pe secund\u0103, evita\u021bi schimb\u0103rile rapide \u00een <a href=\"https:\/\/wraycastle.com\/blogs\/knowledge-base\/soldering-temperature\" target=\"_blank\" rel=\"noopener\">temperatur\u0103<\/a>. Schimb\u0103rile rapide pot provoca stres termic.<\/p>\r\n\r\n\r\n\r\n<p>Iat\u0103 un tabel cu cele mai bune set\u0103ri ale profilului de temperatur\u0103:<\/p>\r\n\r\n\r\n\r\n<figure class=\"wp-block-table\">\r\n<table class=\"has-fixed-layout\"><colgroup><col \/><col \/><\/colgroup>\r\n<tbody>\r\n<tr>\r\n<th colspan=\"1\" rowspan=\"1\">\r\n<p>Parametrul profilului de temperatur\u0103<\/p>\r\n<\/th>\r\n<th colspan=\"1\" rowspan=\"1\">\r\n<p>Interval recomandat \/ Descriere<\/p>\r\n<\/th>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Temperatura de pre\u00eenc\u0103lzire<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>100 \u00b0C p\u00e2n\u0103 la 150 \u00b0C<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Temperatura b\u0103ii de lipit<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>250 \u00b0C p\u00e2n\u0103 la 300 \u00b0C<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Rata de r\u0103cire<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>2\u20134 \u00b0C pe secund\u0103<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Mediul azotat<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>250 \u00b0C\u2013270 \u00b0C pentru \u00eembin\u0103ri f\u0103r\u0103 goluri<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Monitorizarea temperaturii<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Utiliza\u021bi termocupluri sau senzori IR<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Calibrarea echipamentelor<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Calibrare periodic\u0103<\/p>\r\n<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/figure>\r\n\r\n\r\n\r\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\r\n<p>Not\u0103: <a href=\"https:\/\/jhdpcb.com\/blog\/wave-and-reflow-soldering\/\" target=\"_blank\" rel=\"nofollow noopener\">R\u0103cirea pl\u0103cii la 2\u20134 \u00b0C pe secund\u0103<\/a> \u00eempiedic\u0103 \u00eendoirea PCB-ului. De asemenea, men\u021bine \u00eembin\u0103rile sudate rezistente.<\/p>\r\n<\/blockquote>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Timpul de sta\u021bionare<\/h3>\r\n\r\n\r\n\r\n<p><a href=\"https:\/\/www.wevolver.com\/article\/soldering-temperature-optimizing-heat-for-reliable-electronic-assemblies\" target=\"_blank\" rel=\"nofollow noopener\">Timp de repaus<\/a> este durata de timp \u00een care placa intr\u0103 \u00een contact cu valul de lipit. Trebuie s\u0103 urm\u0103ri\u021bi cu aten\u021bie acest timp. Dac\u0103 placa r\u0103m\u00e2ne prea mult timp \u00een lipit, poate deteriora p\u0103r\u021bile sensibile. Se pot produce fenomene precum ridicarea firului de leg\u0103tur\u0103, deteriorarea matri\u021bei sau topirea plasticului. Timpii de sta\u021bionare mai lungi \u00eenseamn\u0103 mai mult\u0103 c\u0103ldur\u0103, ceea ce cre\u0219te stresul termic. Utiliza\u021bi cea mai sc\u0103zut\u0103 temperatur\u0103 care v\u0103 permite s\u0103 lipi\u021bi \u00een doar c\u00e2teva secunde. Astfel, timpul de sta\u021bionare r\u0103m\u00e2ne scurt. L\u0103sarea pl\u0103cii s\u0103 se r\u0103ceasc\u0103 \u00eentre \u00eembin\u0103ri \u00eempiedic\u0103 acumularea c\u0103ldurii.<\/p>\r\n\r\n\r\n\r\n<ul class=\"wp-block-list\">\r\n<li>\r\n<p>Un timp de sta\u021bionare prea lung \u00eenseamn\u0103 un risc mai mare de deteriorare.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Un timp de sta\u021bionare prea scurt \u00eenseamn\u0103 \u00eembin\u0103ri slabe ale lipiturii.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Trebuie s\u0103 g\u0103si\u021bi perioada potrivit\u0103 pentru consiliul dumneavoastr\u0103.<\/p>\r\n<\/li>\r\n<\/ul>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Sensibilitatea componentelor<\/h3>\r\n\r\n\r\n\r\n<p>Unele piese sunt mai sensibile la c\u0103ldur\u0103 dec\u00e2t altele. Verifica\u021bi \u00eentotdeauna specifica\u021biile fiec\u0103rei piese \u00eenainte de a le lipi. Modifica\u021bi viteza de lipire \u0219i temperatura echipamentului pentru piesele cele mai sensibile. Dac\u0103 temperatura este prea ridicat\u0103, \u00eembin\u0103rile lipite pot deveni fragile sau placa se poate cr\u0103pa. Dac\u0103 temperatura este prea sc\u0103zut\u0103, lipitura poate s\u0103 nu curg\u0103 bine. Acest lucru poate duce la \u00eembin\u0103ri slabe. <a href=\"https:\/\/www.emerald.com\/insight\/content\/doi\/10.1108\/ssmt-11-2023-0064\/full\/html\" target=\"_blank\" rel=\"nofollow noopener\">Control bun al temperaturii<\/a> \u0219i o munc\u0103 atent\u0103 ajut\u0103 la prevenirea form\u0103rii de pun\u021bi de lipit \u0219i a altor probleme. Astfel, stresul termic este men\u021binut la un nivel c\u00e2t mai sc\u0103zut posibil.<\/p>\r\n\r\n\r\n\r\n<h2 class=\"wp-block-heading\">Minimizarea stresului termic<\/h2>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Pre\u00eenc\u0103lzire<\/h3>\r\n\r\n\r\n\r\n<p>Pute\u021bi reduce stresul termic \u00eenc\u0103lzind lent placa PCB. \u00cenc\u0103lzi\u021bi placa \u00eenainte ca aceasta s\u0103 intre \u00een contact cu valul de lipit. Acest lucru ajut\u0103 fluxul s\u0103 cur\u0103\u021be metalul \u0219i \u00eembun\u0103t\u0103\u021be\u0219te curgerea lipitului. Pre\u00eenc\u0103lzirea previne, de asemenea, \u0219ocul termic, care poate sparge piese sau deteriora \u00eembin\u0103rile lipite. Pentru rezultate optime, men\u021bine\u021bi temperatura de pre\u00eenc\u0103lzire \u00eentre 105 \u00b0C \u0219i 145 \u00b0C. Men\u021bine\u021bi placa la aceast\u0103 temperatur\u0103 suficient timp pentru ca fluxul s\u0103 ac\u021bioneze, dar nu at\u00e2t de mult \u00eenc\u00e2t s\u0103 se ard\u0103.<\/p>\r\n\r\n\r\n\r\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\r\n<p><strong>Sfat:<\/strong> Pre\u00eenc\u0103lzirea ajut\u0103 fluxul s\u0103 func\u021bioneze \u0219i \u00eenc\u0103lze\u0219te placa \u00een mod uniform. Acest lucru men\u021bine piesele sensibile mai sigure \u00een timpul lipirii.<\/p>\r\n<\/blockquote>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Controlul valului de lipire<\/h3>\r\n\r\n\r\n\r\n<p>Trebuie s\u0103 <a href=\"https:\/\/www.chuxin-smt.com\/ro\/improve-wave-soldering-quality-5-effective-methods\/\" target=\"_blank\" rel=\"noopener\">controla\u021bi valul de lipire<\/a> pentru a men\u021bine stresul termic la un nivel sc\u0103zut. Modifica\u021bi \u00een\u0103l\u021bimea valului, timpul de contact \u0219i temperatura de lipire pentru placa dvs. Utiliza\u021bi senzori \u0219i verifica\u021bi frecvent pentru a men\u021bine aceste set\u0103ri constante. Tabelul de mai jos prezint\u0103 <a href=\"https:\/\/www.ltpcba.com\/key-parameters-for-controlling-smt-wave-soldering-processes\/\" target=\"_blank\" rel=\"nofollow noopener\">cele mai bune intervale pentru fiecare setare<\/a>:<\/p>\r\n\r\n\r\n\r\n<figure class=\"wp-block-table\">\r\n<table class=\"has-fixed-layout\"><colgroup><col \/><col \/><col \/><\/colgroup>\r\n<tbody>\r\n<tr>\r\n<th colspan=\"1\" rowspan=\"1\">\r\n<p>Parametru<\/p>\r\n<\/th>\r\n<th colspan=\"1\" rowspan=\"1\">\r\n<p>Interval\/valoare recomandat\u0103<\/p>\r\n<\/th>\r\n<th colspan=\"1\" rowspan=\"1\">\r\n<p>Scopul\/Efectul asupra stresului termic \u0219i calit\u0103\u021bii lipirii<\/p>\r\n<\/th>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>\u00cen\u0103l\u021bimea valului<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>8\u201312 mm<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Asigura\u021bi-v\u0103 c\u0103 pl\u0103cu\u021bele ating lipitura, dar nu stropesc; o pozi\u021bie prea joas\u0103 \u00eenseamn\u0103 circuite deschise, iar una prea \u00eenalt\u0103 \u00eenseamn\u0103 stropire \u0219i punte.<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Timp de contact<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>2 secunde (componente mici), 4 secunde (componente mari cu orificiu traversant)<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Ofer\u0103 suficient timp pentru lipire f\u0103r\u0103 prea mult\u0103 c\u0103ldur\u0103, echilibr\u00e2nd umezirea \u0219i stresul termic.<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Rata de r\u0103cire<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>3\u20136 \u00b0C\/s<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>R\u0103cirea rapid\u0103, dar constant\u0103, opre\u0219te stresul termic \u0219i fisurile; o r\u0103cire prea rapid\u0103 provoac\u0103 stres, iar una prea lent\u0103 sl\u0103be\u0219te \u00eembin\u0103rile.<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Temperatura de pre\u00eenc\u0103lzire<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>105\u2013145 \u00b0C<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Activeaz\u0103 fluxul \u0219i opre\u0219te \u0219ocul termic; o valoare prea mic\u0103 \u00eenseamn\u0103 c\u0103 fluxul nu func\u021bioneaz\u0103, o valoare prea mare arde fluxul \u0219i provoac\u0103 oxidarea.<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Temperatura de lipire<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>F\u0103r\u0103 plumb: 250\u2013270 \u00b0C; Cu plumb: 230\u2013250 \u00b0C<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Se potrive\u0219te cu punctul de topire al lipiturii, astfel \u00eenc\u00e2t piesele s\u0103 nu se deterioreze.<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Viteza conveiorului<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>0,8\u20131,5 m\/min (variaz\u0103 \u00een func\u021bie de complexitatea PCB-ului)<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Controleaz\u0103 durata de expunere a pl\u0103cii la valul de lipit; o expunere prea rapid\u0103 duce la \u00eembin\u0103ri reci, iar una prea lent\u0103 duce la supra\u00eenc\u0103lzire \u0219i schimbarea culorii.<\/p>\r\n<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/figure>\r\n\r\n\r\n\r\n<figure class=\"wp-block-image aligncenter size-large\"><img decoding=\"async\" width=\"1024\" height=\"768\" class=\"wp-image-2663\" src=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738952-chart_1755738286754734924.webp\" alt=\"Bar chart comparing recommended ranges for solder wave process parameters\" srcset=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738952-chart_1755738286754734924.webp 1024w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738952-chart_1755738286754734924-300x225.webp 300w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738952-chart_1755738286754734924-768x576.webp 768w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" title=\"Minimizing Thermal Stress in Selective Wave Soldering2 - S&amp;M Co.Ltd\" \/><\/figure>\r\n\r\n\r\n\r\n<ul class=\"wp-block-list\">\r\n<li>\r\n<p>Utiliza\u021bi lipit cu un coeficient de dilatare termic\u0103 apropiat de cel al pl\u0103cii.<\/p>\r\n<\/li>\r\n<li>\r\n<p><a href=\"https:\/\/www.numberanalytics.com\/blog\/ultimate-soldering-guide-advanced-processing\" target=\"_blank\" rel=\"nofollow noopener\">Seta\u021bi temperatura \u0219i timpul de lipire pentru a opri supra\u00eenc\u0103lzirea<\/a>.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Alege\u021bi o vitez\u0103 de r\u0103cire lent\u0103 \u0219i constant\u0103 pentru a preveni apari\u021bia fisurilor.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Modifica\u021bi toate set\u0103rile pentru placa \u0219i echipamentul dvs.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Utiliza\u021bi azot pentru a opri oxidarea \u0219i a \u00eembun\u0103t\u0103\u021bi lipirea.<\/p>\r\n<\/li>\r\n<\/ul>\r\n\r\n\r\n\r\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\r\n<p><strong>Not\u0103:<\/strong> Pentru pl\u0103cile multistrat, utiliza\u021bi reliefuri termice rotative \u0219i men\u021bine\u021bi-le la cel pu\u021bin 0,4 mm. Acest lucru ajut\u0103 la reducerea tensiunii pe axa Z \u0219i \u00eempiedic\u0103 \u00eendoirea pl\u0103cii.<\/p>\r\n<\/blockquote>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Bariere termice<\/h3>\r\n\r\n\r\n\r\n<p><a href=\"https:\/\/www.linkedin.com\/pulse\/how-does-parameter-temperature-correction-work-smt-process-uqwyc\" target=\"_blank\" rel=\"nofollow noopener\">Barierele termice protejeaz\u0103 p\u0103r\u021bile sensibile de c\u0103ldura excesiv\u0103<\/a>. Pute\u021bi utiliza scuturi din aluminiu sau ceramic\u0103 pentru a bloca c\u0103ldura. Capacele sau capacele temporare re\u021bin c\u0103ldura p\u00e2n\u0103 c\u00e2nd placa este gata. Aceste metode ajut\u0103 toate piesele s\u0103 se \u00eenc\u0103lzeasc\u0103 la aceea\u0219i vitez\u0103, ceea ce reduce stresul termic.<\/p>\r\n\r\n\r\n\r\n<ul class=\"wp-block-list\">\r\n<li>\r\n<p>Scuturile \u0219i barierele protejeaz\u0103 p\u0103r\u021bile delicate \u00eempotriva c\u0103ldurii.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Acestea ajut\u0103 placa s\u0103 se \u00eenc\u0103lzeasc\u0103 mai uniform.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Evita\u021bi \u00eenc\u0103lzirea rapid\u0103 sau inegal\u0103, care poate provoca fisuri sau \u00eembin\u0103ri slabe.<\/p>\r\n<\/li>\r\n<\/ul>\r\n\r\n\r\n\r\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\r\n<p><strong>Alerta:<\/strong> Verifica\u021bi \u00eentotdeauna dac\u0103 barierele termice se potrivesc bine \u0219i nu blocheaz\u0103 valul de lipit s\u0103 ajung\u0103 la pl\u0103cu\u021be.<\/p>\r\n<\/blockquote>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Selectarea fluxului<\/h3>\r\n\r\n\r\n\r\n<p>Alegerea fluxului potrivit este important\u0103 pentru reducerea stresului termic. Alege\u021bi un flux cu nivelul de activitate potrivit pentru temperatura dvs. Verifica\u021bi con\u021binutul de solide, deoarece acesta afecteaz\u0103 modul \u00een care fluxul func\u021bioneaz\u0103 la c\u0103ldur\u0103. Asigura\u021bi-v\u0103 c\u0103 fluxul este compatibil cu placa \u0219i componentele dvs. pentru a preveni deteriorarea.<\/p>\r\n\r\n\r\n\r\n<ol class=\"wp-block-list\">\r\n<li>\r\n<p>Alege\u021bi fluxul \u00een func\u021bie de nivelul de activitate pentru o activare bun\u0103.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Verifica\u021bi con\u021binutul de solide pentru o bun\u0103 performan\u021b\u0103 la c\u0103ldur\u0103.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Asigura\u021bi-v\u0103 c\u0103 fluxul este compatibil cu placa \u0219i componentele dvs.<\/p>\r\n<\/li>\r\n<\/ol>\r\n\r\n\r\n\r\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\r\n<p><strong>Sfat:<\/strong> <a href=\"https:\/\/www.linkedin.com\/pulse\/selective-soldering-pcb-technical-details-hpoac\" target=\"_blank\" rel=\"nofollow noopener\">Pre\u00eenc\u0103lzirea ajut\u0103 fluxul s\u0103 func\u021bioneze mai bine<\/a>, reduce \u0219ocul termic \u0219i ajut\u0103 la lipirea lipiturii. Acest pas asigur\u0103 \u00eembin\u0103ri puternice \u0219i fiabile.<\/p>\r\n<\/blockquote>\r\n\r\n\r\n\r\n<h2 class=\"wp-block-heading\">Controlul proceselor<\/h2>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Monitorizare<\/h3>\r\n\r\n\r\n\r\n<p>Este important s\u0103 urm\u0103ri\u021bi procesul de lipire selectiv\u0103 cu und\u0103 \u00een timp ce acesta se desf\u0103\u0219oar\u0103. Ma\u0219inile moderne utilizeaz\u0103 instrumente speciale pentru a verifica temperatura, \u00een\u0103l\u021bimea undei \u0219i fluxul de azot. Aceste instrumente v\u0103 ajut\u0103 s\u0103 identifica\u021bi problemele \u00eenainte ca acestea s\u0103 afecteze pl\u0103cile. C\u00e2nd primi\u021bi feedback imediat, pute\u021bi modifica rapid set\u0103rile. Astfel, procesul r\u0103m\u00e2ne stabil \u0219i u\u0219or de repetat.<\/p>\r\n\r\n\r\n\r\n<p>Iat\u0103 un tabel cu unele dintre cele mai bune sisteme de monitorizare \u0219i func\u021biile acestora:<\/p>\r\n\r\n\r\n\r\n<figure class=\"wp-block-table\">\r\n<table class=\"has-fixed-layout\"><colgroup><col \/><col \/><col \/><\/colgroup>\r\n<tbody>\r\n<tr>\r\n<th colspan=\"1\" rowspan=\"1\">\r\n<p>Sistem de monitorizare a temperaturii<\/p>\r\n<\/th>\r\n<th colspan=\"1\" rowspan=\"1\">\r\n<p>Descriere<\/p>\r\n<\/th>\r\n<th colspan=\"1\" rowspan=\"1\">\r\n<p>Contribu\u021bie la fiabilitatea procesului<\/p>\r\n<\/th>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Pirometru optic<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>M\u0103soar\u0103 temperatura real\u0103 a PCB-ului \u0219i utilizeaz\u0103 controlul \u00een bucl\u0103 \u00eenchis\u0103<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Ofer\u0103 citiri exacte ale temperaturii \u0219i feedback pentru o calitate constant\u0103 a lipirii<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Monitorizarea digital\u0103 a fluxului de azot<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Verific\u0103 presiunea \u0219i debitul azotului pentru a men\u021bine nivelul \u0219i temperatura constant\u0103 a vasului de lipit.<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Men\u021bine condi\u021biile vasului de lipit stabile \u0219i repetabile, mai bine dec\u00e2t sondele vechi<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Calea azotului supra\u00eenc\u0103lzit<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>\u00cenc\u0103lze\u0219te azotul din interiorul vasului de lipit \u0219i de-a lungul traseului de lipit<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Opre\u0219te schimb\u0103rile de temperatur\u0103 \u00een valul de lipire, f\u0103c\u00e2nd procesul mai stabil<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Monitorizarea \u00een\u0103l\u021bimii valurilor<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Utilizeaz\u0103 verific\u0103ri rezistive \u0219i feedback \u00een bucl\u0103 \u00eenchis\u0103 pentru a men\u021bine <a href=\"https:\/\/www.us-tech.com\/RelId\/700102\/issearch\/seica\/pagenum\/34\/ISvars\/default\/Lead_free_Selective_Soldering_Equipment.htm\" target=\"_blank\" rel=\"nofollow noopener\">\u00een\u0103l\u021bimea valului \u00een limita \u00b10,005 inchi.<\/a><\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Necesar pentru lipirea pieselor mici, apropiate \u00eentre ele, cu precizie ridicat\u0103<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Controlul temperaturii PID<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Controleaz\u0103 temperatura crestei valului de lipire \u00eentre 0 \u0219i 400 \u00b0C cu tehnologie servomotor cu bucl\u0103 \u00eenchis\u0103<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Ofer\u0103 un control precis \u0219i repetabil al temperaturii \u0219i pozi\u021bionarea \u00een timpul lipirii<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Sistem de vizualizare pentru lipire<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Urm\u0103re\u0219te \u0219i \u00eenregistreaz\u0103 procesul de lipire \u00een timp real<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Ajut\u0103 la urm\u0103rirea procesului \u0219i la verificarea calit\u0103\u021bii imediat<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Pre\u00eenc\u0103lzire partea superioar\u0103<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Men\u021bine placa cald\u0103 \u00een timpul lipirii, potrivit pentru pl\u0103ci grele<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Asigur\u0103 o distribu\u021bie mai bun\u0103 a c\u0103ldurii \u0219i ajut\u0103 la lipirea lipiciului, oferind rezultate constante.<\/p>\r\n<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/figure>\r\n\r\n\r\n\r\n<p>Pute\u021bi utiliza, de asemenea, <a href=\"https:\/\/www.chuxin-smt.com\/ro\/wave-solder-vs-selective-wave-soldering-choosing-the-right-method-for-your-pcb\/\" target=\"_blank\" rel=\"noopener\">camere \u0219i alarme care func\u021bioneaz\u0103 \u00een timp real<\/a>. Aceste instrumente v\u0103 ajut\u0103 s\u0103 identifica\u021bi rapid problemele \u0219i s\u0103 men\u021bine\u021bi buna func\u021bionare a sistemului.<\/p>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Validare<\/h3>\r\n\r\n\r\n\r\n<p>Trebuie s\u0103 <a href=\"https:\/\/www.chuxin-smt.com\/ro\/improve-wave-soldering-quality-5-effective-methods\/\" target=\"_blank\" rel=\"noopener\">verifica\u021bi procesul<\/a> pentru a respecta normele de calitate \u0219i a v\u0103 asigura c\u0103 \u00eembin\u0103rile sudate sunt rezistente. Validarea \u00eenseamn\u0103 verificarea fiec\u0103rei etape, de la materiale p\u00e2n\u0103 la set\u0103rile ma\u0219inii. \u00cencepe\u021bi prin a crea un diagram\u0103 a fluxului procesului \u0219i c\u0103uta\u021bi posibile defec\u021biuni. Testa\u021bi procesul at\u00e2t la set\u0103rile minime, c\u00e2t \u0219i la cele maxime pentru temperatur\u0103, flux \u0219i viteza transportorului. Astfel ve\u021bi vedea dac\u0103 procesul func\u021bioneaz\u0103 \u00een toate situa\u021biile.<\/p>\r\n\r\n\r\n\r\n<figure class=\"wp-block-table\">\r\n<table class=\"has-fixed-layout\"><colgroup><col \/><col \/><\/colgroup>\r\n<tbody>\r\n<tr>\r\n<th colspan=\"1\" rowspan=\"1\">\r\n<p><a href=\"https:\/\/elsmar.com\/elsmarqualityforum\/threads\/validation-of-wave-solder-process-pcba-for-medical-products.48274\/\" target=\"_blank\" rel=\"nofollow noopener\">Aspectul valid\u0103rii<\/a><\/p>\r\n<\/th>\r\n<th colspan=\"1\" rowspan=\"1\">\r\n<p>Procedura recomandat\u0103 \/ Considera\u021bii<\/p>\r\n<\/th>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Variabile de proces<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Urm\u0103ri\u021bi \u0219i nota\u021bi tipul de lipit, tipul \u0219i utilizarea fluxului, temperaturile b\u0103ii \u0219i zonei, \u00een\u0103l\u021bimea valului \u0219i viteza transportorului.<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Analiza fluxului de procese<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>\u00cencepe\u021bi cu un diagram\u0103 a fluxului procesului (PFD) \u0219i o analiz\u0103 a efectelor modului de defectare a procesului (pFMEA) pentru a identifica riscurile cheie.<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Studii de validare<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Testa\u021bi set\u0103rile procesului la limitele maxime (cum ar fi temperaturi sc\u0103zute\/ridicate, cantit\u0103\u021bi de flux, viteze ale lan\u021bului) pentru a verifica calitatea.<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Metode de inspec\u021bie<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Utiliza\u021bi verific\u0103ri vizuale \u0219i scan\u0103ri cu raze X pentru a verifica, dar nu doar pentru validare.<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Monitorizare continu\u0103<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>\u00cenregistra\u021bi \u00eentotdeauna set\u0103rile procesului \u0219i compara\u021bi-le cu cele bune pentru un control mai bun.<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Dimensiunea e\u0219antionului \u0219i criteriile<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Folosi\u021bi experien\u021ba sau metodele matematice; verifica\u021bi mai \u00eent\u00e2i probele cu ochiul liber \u0219i testa\u021bi func\u021bionalitatea tuturor.<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Calificarea operatorului<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Asigura\u021bi-v\u0103 c\u0103 operatorii sunt instrui\u021bi, certifica\u021bi \u0219i verifica\u021bi din punct de vedere al calit\u0103\u021bii, ca parte a procesului de validare.<\/p>\r\n<\/td>\r\n<\/tr>\r\n<tr>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Etapele de calificare<\/p>\r\n<\/td>\r\n<td colspan=\"1\" rowspan=\"1\">\r\n<p>Utiliza\u021bi calificarea instal\u0103rii (IQ), calificarea opera\u021bional\u0103 (OQ) \u0219i calificarea performan\u021bei (PQ).<\/p>\r\n<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/figure>\r\n\r\n\r\n\r\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\r\n<p><strong>Sfat:<\/strong> Urm\u0103rirea \u0219i verificarea continu\u0103 a procesului v\u0103 ajut\u0103 s\u0103 identifica\u021bi problemele din timp. Astfel, procesul r\u0103m\u00e2ne eficient, iar produsele sunt sigure.<\/p>\r\n<\/blockquote>\r\n\r\n\r\n\r\n<h2 class=\"wp-block-heading\">Proiectare PCB<\/h2>\r\n\r\n\r\n\r\n<figure class=\"wp-block-image aligncenter size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1200\" height=\"675\" class=\"wp-image-2664\" src=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738952-78d85fe84746451e933299a889d54d04.webp\" alt=\"PCB Design\" srcset=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738952-78d85fe84746451e933299a889d54d04.webp 1200w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738952-78d85fe84746451e933299a889d54d04-300x169.webp 300w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738952-78d85fe84746451e933299a889d54d04-1024x576.webp 1024w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/08\/1755738952-78d85fe84746451e933299a889d54d04-768x432.webp 768w\" sizes=\"(max-width: 1200px) 100vw, 1200px\" title=\"Minimizing Thermal Stress in Selective Wave Soldering3 - S&amp;M Co.Ltd\" \/><\/figure>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Sfaturi pentru aspect<\/h3>\r\n\r\n\r\n\r\n<p>Pute\u021bi \u00eembun\u0103t\u0103\u021bi rezisten\u021ba PCB-ului la c\u0103ldur\u0103 prin crearea de zone termice. Aceste zone ajut\u0103 placa s\u0103 se \u00eenc\u0103lzeasc\u0103 lent \u0219i uniform. Utiliza\u021bi <a href=\"https:\/\/unitcircuits.com\/lead-free-pcb-assembly-thermal-management\/\" target=\"_blank\" rel=\"nofollow noopener\">canale de r\u0103cire termic\u0103 \u00een planurile de alimentare<\/a> pentru a \u00eendep\u0103rta c\u0103ldura din punctele fierbin\u021bi. Acest lucru \u00eempiedic\u0103 placa s\u0103 se \u00eenc\u0103lzeasc\u0103 prea mult. A\u0219eza\u021bi piesele cu necesit\u0103\u021bi termice diferite \u00een zone separate. Acest lucru protejeaz\u0103 piesele sensibile de c\u0103ldura excesiv\u0103. Rula\u021bi <a href=\"https:\/\/www.ltpcba.com\/reflow-soldering-temperature-zones-and-pcb-quality\/\" target=\"_blank\" rel=\"nofollow noopener\">modelarea stresului termic<\/a> \u00eenc\u0103 din faza incipient\u0103 a proiect\u0103rii. Acest lucru v\u0103 ajut\u0103 s\u0103 identifica\u021bi \u0219i s\u0103 remedia\u021bi punctele critice \u00eenainte de a construi placa.<\/p>\r\n\r\n\r\n\r\n<p>Iat\u0103 c\u00e2teva strategii de amenajare care v\u0103 pot ajuta s\u0103 gestiona\u021bi c\u0103ldura:<\/p>\r\n\r\n\r\n\r\n<ul class=\"wp-block-list\">\r\n<li>\r\n<p><a href=\"https:\/\/www.mclpcb.com\/pcb-guide\/\" target=\"_blank\" rel=\"nofollow noopener\">Ad\u0103uga\u021bi releefuri termice pentru a conecta pl\u0103cu\u021bele la plane<\/a> pentru un flux termic mai bun.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Echilibreaz\u0103 cuprul pe plac\u0103 pentru a opri deformarea \u0219i r\u0103sucirea.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Folosi\u021bi turn\u0103ri de cupru \u0219i furturi pentru a distribui c\u0103ldura uniform.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Verifica\u021bi proiectul cu ajutorul instrumentelor de simulare pentru a identifica eventualele probleme termice.<\/p>\r\n<\/li>\r\n<\/ul>\r\n\r\n\r\n\r\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\r\n<p><strong>Sfat:<\/strong> Utilizare <a href=\"https:\/\/www.wevolver.com\/article\/demystifying-soldering-techniques-a-comparison-of-wave-soldering-and-reflow-soldering\" target=\"_blank\" rel=\"nofollow noopener\">palete sau dispozitive de fixare \u00een timpul lipirii<\/a> pentru a sus\u021bine placa \u0219i a opri deformarea.<\/p>\r\n<\/blockquote>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Alegerea componentelor<\/h3>\r\n\r\n\r\n\r\n<p>Alege\u021bi piese care pot suporta c\u0103ldura <a href=\"https:\/\/www.chuxin-smt.com\/ro\/wave-solder-vs-selective-wave-soldering-choosing-the-right-method-for-your-pcb\/\" target=\"_blank\" rel=\"noopener\">lipire selectiv\u0103 cu und\u0103<\/a>. Majoritatea pieselor f\u0103r\u0103 plumb trebuie s\u0103 ia <a href=\"https:\/\/www.allpcb.com\/blog\/pcb-assembly\/optimizing-wave-soldering-temperature-a-key-factor-for-reliable-pcb-joints.html\" target=\"_blank\" rel=\"nofollow noopener\">250 \u00b0C p\u00e2n\u0103 la 260 \u00b0C<\/a>. Verifica\u021bi \u00eentotdeauna temperatura maxim\u0103 pe care o poate suporta fiecare component\u0103, \u00een special \u00een cazul condensatoarelor electrolitice \u0219i microcontrolerelor. Utiliza\u021bi <a href=\"https:\/\/hillmancurtis.com\/attention-to-in-pcb-soldering\/\" target=\"_blank\" rel=\"nofollow noopener\">profilare termic\u0103<\/a> instrumente pentru a seta temperatura potrivit\u0103 pentru piesele cele mai sensibile. Alege\u021bi grosimea pl\u0103cii \u0219i greutatea cuprului \u00een func\u021bie de necesit\u0103\u021bile dvs. de \u00eenc\u0103lzire. Pl\u0103cile mai groase pot necesita temperaturi de pre\u00eenc\u0103lzire mai ridicate pentru o \u00eenc\u0103lzire uniform\u0103.<\/p>\r\n\r\n\r\n\r\n<ul class=\"wp-block-list\">\r\n<li>\r\n<p>Alege\u021bi piese cu toleran\u021b\u0103 ridicat\u0103 la c\u0103ldur\u0103.<\/p>\r\n<\/li>\r\n<li>\r\n<p>A\u0219eza\u021bi piesele sensibile departe de zonele cele mai fierbin\u021bi.<\/p>\r\n<\/li>\r\n<li>\r\n<p><a href=\"https:\/\/www.allpcb.com\/blog\/pcb-knowledge\/wave-soldering-vs-reflow-for-double-sided-boards-choosing-the-right-process.html\" target=\"_blank\" rel=\"nofollow noopener\">Programarea mi\u0219c\u0103rii duzei de lipit<\/a> pentru a limita c\u0103ldura pe p\u0103r\u021bile delicate.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Utiliza\u021bi fluxul \u0219i pre\u00eenc\u0103lzirea \u00een func\u021bie de necesit\u0103\u021bile fiec\u0103rei piese.<\/p>\r\n<\/li>\r\n<\/ul>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Gre\u0219eli frecvente<\/h3>\r\n\r\n\r\n\r\n<p>Mul\u021bi proiectan\u021bi fac gre\u0219eli care pot deteriora placa \u00een timpul lipirii. Evita\u021bi aceste erori frecvente:<\/p>\r\n\r\n\r\n\r\n<ol class=\"wp-block-list\">\r\n<li>\r\n<p>Nu se realizeaz\u0103 profilarea termic\u0103, ceea ce duce la \u00eenc\u0103lzire \u0219i r\u0103cire inegale.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Alegerea materialelor PCB cu propriet\u0103\u021bi termice slabe sau rate de expansiune nepotrivite.<\/p>\r\n<\/li>\r\n<li>\r\n<p>A\u0219ezarea pieselor prea aproape una de alta, ceea ce duce la acumularea c\u0103ldurii \u0219i la apari\u021bia punctelor fierbin\u021bi.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Utilizarea unor dimensiuni incorecte ale orificiilor pentru piesele cu orificii traversante, ceea ce duce la \u00eembin\u0103ri slabe prin lipire.<\/p>\r\n<\/li>\r\n<li>\r\n<p>Setare <a href=\"https:\/\/www.7pcb.com\/blog\/why-are-components-soldered-poorly-on-pcbs\" target=\"_blank\" rel=\"nofollow noopener\">temperaturi sau durate de lipire prea ridicate sau prea sc\u0103zute<\/a>, ceea ce provoac\u0103 deteriorarea pl\u0103cu\u021belor sau \u00eembin\u0103ri reci.<\/p>\r\n<\/li>\r\n<\/ol>\r\n\r\n\r\n\r\n<p>Pute\u021bi preveni aceste probleme prin efectuarea de simul\u0103ri termice, utilizarea profilurilor de \u00eenc\u0103lzire adecvate \u0219i men\u021binerea echipamentelor \u00een stare bun\u0103.<\/p>\r\n\r\n\r\n\r\n<p>Pute\u021bi ob\u021bine o lipire selectiv\u0103 bun\u0103 cu und\u0103 urm\u0103rind \u00eendeaproape procesul \u0219i proiect\u00e2nd bine PCB-ul. Utiliza\u021bi monitorizarea \u00een timp real pentru a identifica rapid problemele. P\u0103stra\u021bi <a href=\"https:\/\/www.omron.com\/global\/en\/technology\/omrontechnics\/vol51\/019.html\" target=\"_blank\" rel=\"nofollow noopener\">\u00een\u0103l\u021bimea valurilor, fluxul \u0219i temperatura<\/a> \u00een intervalul corect. Acest lucru ajut\u0103 la evitarea gre\u0219elilor \u0219i face ca \u00eembin\u0103rile sudate s\u0103 fie rezistente. <a href=\"https:\/\/www.linkedin.com\/pulse\/selective-soldering-pcb-technical-details-what-how-glcbc\" target=\"_blank\" rel=\"nofollow noopener\">Pre\u00eenc\u0103lzirea pl\u0103cii<\/a> ajut\u0103 la protejarea pieselor. Utilizarea azotului \u0219i setarea corect\u0103 a vitezei transportorului contribuie, de asemenea, la o mai bun\u0103 lipire a lipiturii. Urm\u0103ri\u021bi valorile importante \u0219i modifica\u021bi rapid set\u0103rile dac\u0103 observa\u021bi o problem\u0103.<\/p>\r\n\r\n\r\n\r\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\r\n<p>Dac\u0103 urma\u021bi aceste sfaturi, ve\u021bi face mai pu\u021bine gre\u0219eli., <a href=\"https:\/\/www.linkedin.com\/pulse\/wave-soldering-advantages-disadvantages-qnezc\" target=\"_blank\" rel=\"nofollow noopener\">economisi energie<\/a>, iar pl\u0103cile dvs. vor dura mai mult.<\/p>\r\n<\/blockquote>\r\n\r\n\r\n\r\n<h2 class=\"wp-block-heading\">\u00ceNTREB\u0102RI FRECVENTE<\/h2>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Care este cea mai bun\u0103 metod\u0103 de prevenire a \u0219ocului termic \u00een timpul lipirii selective cu und\u0103?<\/h3>\r\n\r\n\r\n\r\n<p>Ar trebui s\u0103 pre\u00eenc\u0103lzi\u021bi PCB-ul \u00eencet. Acest lucru ajut\u0103 placa \u0219i componentele s\u0103 se \u00eenc\u0103lzeasc\u0103 \u00eempreun\u0103. Pre\u00eenc\u0103lzirea previne apari\u021bia fisurilor sau ridicarea padurilor din cauza schimb\u0103rilor rapide de temperatur\u0103.<\/p>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Cum alege\u021bi fluxul potrivit pentru lipirea selectiv\u0103 cu und\u0103?<\/h3>\r\n\r\n\r\n\r\n<p>Alege\u021bi un flux compatibil cu temperatura de lipire \u0219i placa dvs. Verifica\u021bi nivelul de activitate \u0219i con\u021binutul de solide. Fluxul potrivit faciliteaz\u0103 curgerea lipirii \u0219i reduce stresul termic asupra pieselor sensibile.<\/p>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">De ce este important timpul de sta\u021bionare \u00een lipirea selectiv\u0103 cu und\u0103?<\/h3>\r\n\r\n\r\n\r\n<p>Timpul de sta\u021bionare \u00eenseamn\u0103 c\u00e2t timp placa dvs. atinge valul de lipit. Un timp prea lung genereaz\u0103 prea mult\u0103 c\u0103ldur\u0103 \u0219i poate deteriora componentele. Un timp prea scurt duce la \u00eembin\u0103ri slabe. Trebuie s\u0103 g\u0103si\u021bi timpul optim pentru placa dvs.<\/p>\r\n\r\n\r\n\r\n<h3 class=\"wp-block-heading\">Se poate utiliza lipirea selectiv\u0103 cu und\u0103 pentru toate tipurile de PCB?<\/h3>\r\n\r\n\r\n\r\n<p>Pute\u021bi utiliza <a href=\"https:\/\/www.chuxin-smt.com\/ro\/faq\/\" target=\"_blank\" rel=\"noopener\">lipire selectiv\u0103 cu und\u0103<\/a> pentru majoritatea pl\u0103cilor cu orificii \u0219i mixte. Pl\u0103cile foarte compacte sau sensibile la c\u0103ldur\u0103 necesit\u0103 o aten\u021bie special\u0103. Verifica\u021bi \u00eentotdeauna specifica\u021biile pieselor \u0219i efectua\u021bi mai \u00eent\u00e2i profilarea termic\u0103.<\/p>\r\n\r\n<p>&nbsp;<\/p>","protected":false},"excerpt":{"rendered":"<p>Minimiza\u021bi stresul termic \u00een lipirea selectiv\u0103 \u00een val prin optimizarea pre\u00eenc\u0103lzirii, a controlului temperaturii \u0219i a timpului de a\u0219teptare pentru asamblarea fiabil\u0103 a PCB.<\/p>","protected":false},"author":1,"featured_media":2665,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"categories":[1,52],"tags":[87,84,64,68,83],"class_list":["post-2666","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-company-news","category-product-information","tag-selective-wave-soldering","tag-solder-equipment","tag-soldering-process","tag-wave-solder-machine","tag-welding-equipment"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/posts\/2666","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/comments?post=2666"}],"version-history":[{"count":0,"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/posts\/2666\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/media\/2665"}],"wp:attachment":[{"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/media?parent=2666"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/categories?post=2666"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/tags?post=2666"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}