{"id":3933,"date":"2026-01-15T15:16:25","date_gmt":"2026-01-15T07:16:25","guid":{"rendered":"https:\/\/www.chuxin-smt.com\/top-causes-smt-soldering-defects-and-prevention-tips\/"},"modified":"2026-01-15T15:16:25","modified_gmt":"2026-01-15T07:16:25","slug":"top-causes-smt-soldering-defects-and-prevention-tips","status":"publish","type":"post","link":"https:\/\/www.chuxin-smt.com\/ro\/top-causes-smt-soldering-defects-and-prevention-tips\/","title":{"rendered":"Cauzele principale ale defectelor de lipire SMT \u0219i cum s\u0103 le preveni\u021bi"},"content":{"rendered":"<figure class=\"wp-block-image aligncenter size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1408\" height=\"768\" src=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461381-967d0203361c428bbb213c3689e8fa55.jpg\" alt=\"Top Causes of SMT Soldering Defects and How to Prevent Them\" class=\"wp-image-3929\" srcset=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461381-967d0203361c428bbb213c3689e8fa55.jpg 1408w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461381-967d0203361c428bbb213c3689e8fa55-300x164.jpg 300w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461381-967d0203361c428bbb213c3689e8fa55-1024x559.jpg 1024w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461381-967d0203361c428bbb213c3689e8fa55-768x419.jpg 768w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461381-967d0203361c428bbb213c3689e8fa55-18x10.jpg 18w\" sizes=\"(max-width: 1408px) 100vw, 1408px\" title=\"Top Causes of SMT Soldering Defects and How to Prevent Them - S&amp;M Co.Ltd\" \/><\/figure>\n\n\n\n<p>Pute\u021bi g\u0103si adesea aceste defecte de lipire SMT \u00een produc\u021bie:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><p><a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/www.pcbelec.com\/blog\/pcba-insights\/pcb_assembly_defects.html\">\u00cembin\u0103ri de lipire deschise<\/a><\/p><\/li><li><p>Lipire scurt\u0103<\/p><\/li><li><p>Nealinierea componentelor<\/p><\/li><li><p>Punte de lipire<\/p><\/li>\n<\/ul>\n\n\n\n<p>Aceste probleme pot face ansamblurile SMT mai pu\u021bin bune \u0219i mai pu\u021bin fiabile. <a target=\"_blank\" href=\"https:\/\/www.chuxin-smt.com\/ro\/\">S&amp;M<\/a> ofer\u0103 solu\u021bii SMT avansate care v\u0103 ajut\u0103 s\u0103 opri\u021bi problemele de lipire \u0219i s\u0103 men\u021bine\u021bi standarde ridicate \u00een fabrica dumneavoastr\u0103.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" >Principalele concluzii<\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li><p>G\u0103si\u021bi <a target=\"_blank\" href=\"https:\/\/www.chuxin-smt.com\/ro\/reflow-oven-temperature-profiling-soldering-defect-solutions\/\">probleme comune de lipire SMT<\/a> cum ar fi lipire insuficient\u0103, pun\u021bi de lipire, \u0219i tombstoning. Acest lucru ajut\u0103 la o mai bun\u0103 func\u021bionare a produselor.<\/p><\/li><li><p>Utiliza\u021bi o past\u0103 de lipit bun\u0103 \u0219i men\u021bine\u021bi suprafe\u021bele curate. Acest lucru stopeaz\u0103 probleme precum m\u0103rgele de lipire \u0219i goluri.<\/p><\/li><li><p>Urm\u0103ri\u021bi procesul \u0219i instrui\u021bi bine lucr\u0103torii. Acest lucru face ca lipirea s\u0103 fie mai bun\u0103 \u0219i reduce problemele \u00een fabricarea produselor.<\/p><\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\" >Defecte comune de lipire SMT<\/h2>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large\"><img decoding=\"async\" width=\"1200\" height=\"675\" src=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461382-006d3a885ec741389653f72fa9701cb5.webp\" alt=\"Common SMT Soldering Defects\" class=\"wp-image-3930\" srcset=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461382-006d3a885ec741389653f72fa9701cb5.webp 1200w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461382-006d3a885ec741389653f72fa9701cb5-300x169.webp 300w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461382-006d3a885ec741389653f72fa9701cb5-1024x576.webp 1024w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461382-006d3a885ec741389653f72fa9701cb5-768x432.webp 768w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461382-006d3a885ec741389653f72fa9701cb5-18x10.webp 18w\" sizes=\"(max-width: 1200px) 100vw, 1200px\" title=\"Top Causes of SMT Soldering Defects and How to Prevent Them1 - S&amp;M Co.Ltd\" \/><figcaption class=\"wp-element-caption\">Sursa imaginii: <a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/pexels.com\">Pexels<\/a><\/figcaption><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\" >Lipire insuficient\u0103<\/h3>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p><a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/www.pcbasic.com\/blog\/types_of_soldering_defects.html\">Nu este suficient\u0103 lipire<\/a> este o problem\u0103 frecvent\u0103. Dac\u0103 exist\u0103 prea pu\u021bin\u0103 lipire, se pot forma goluri la \u00eembin\u0103ri. Conexiunea poate s\u0103 nu fie puternic\u0103. Acest lucru poate face \u00eembinarea slab\u0103. De asemenea, poate afecta c\u00e2t de bine circul\u0103 electricitatea.<\/p><\/blockquote>\n\n\n\n<p>Pute\u021bi observa acest lucru atunci c\u00e2nd conexiunile par slabe sau neterminate. Aceste puncte slabe pot face ca dispozitivul dvs. s\u0103 se rup\u0103 sau s\u0103 nu mai func\u021bioneze mai t\u00e2rziu. Folosi\u021bi \u00eentotdeauna cantitatea potrivit\u0103 de lipit pentru fiecare \u00eembinare pentru a \u00eempiedica acest lucru s\u0103 se \u00eent\u00e2mple.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" >Talon de lipit<\/h3>\n\n\n\n<p><a target=\"_blank\" href=\"https:\/\/www.chuxin-smt.com\/ro\/slug-understanding-solder-balling-causes-and-prevention-methods\/\">Talon de lipire<\/a> se \u00eent\u00e2mpl\u0103 atunci c\u00e2nd mici bile de lipit apar l\u00e2ng\u0103 piese dup\u0103 \u00eenc\u0103lzire. Deseori vede\u021bi aceste bile sub piesele cipurilor. Ele pot provoca scurtcircuite sau pot agrava alte probleme.<\/p>\n\n\n\n<p>Principalele motive pentru formarea m\u0103rgelelor de lipire sunt:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><p>Prea mult\u0103 pudr\u0103 de metal \u00een pasta de lipit poate face m\u0103rgele atunci c\u00e2nd lichidul se usuc\u0103.<\/p><\/li><li><p>Pasta de lipit care este prea lichid\u0103 se poate \u00eempr\u0103\u0219tia \u0219i face m\u0103rgele.<\/p><\/li><li><p>Capetele \u0219i pl\u0103cu\u021bele de lipit murdare sau ruginite pot \u00eempiedica lipirea \u0219i pot face m\u0103rgele.<\/p><\/li><li><p>M\u0103\u0219tile de lipire proaste pot l\u0103sa ap\u0103 sau murd\u0103rie pe pl\u0103cu\u021be \u0219i pot cauza m\u0103rgele.<\/p><\/li><li><p>Cre\u0219terea rapid\u0103 a apei \u00een timpul \u00eenc\u0103lzirii poate produce gaze \u0219i forma perle.<\/p><\/li>\n<\/ul>\n\n\n\n<p>Pute\u021bi opri formarea m\u0103rgelelor de lipit folosind o past\u0103 de lipit bun\u0103, men\u021bin\u00e2nd pl\u0103cile curate \u0219i uscate \u0219i urm\u0103rind procesul de \u00eenc\u0103lzire.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" >Pr\u0103bu\u0219ire la rece<\/h3>\n\n\n\n<p><a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/www.blackfox.com\/4-more-smt-assembly-defects-to-avoid\/\">\u00cenclinarea la rece \u00eenseamn\u0103 c\u0103 pasta de lipit se \u00eentinde<\/a> prea mult dup\u0103 ce a\u021bi pus-o. Pasta trebuie s\u0103 r\u0103m\u00e2n\u0103 \u00eentr-un singur loc p\u00e2n\u0103 c\u00e2nd ad\u0103uga\u021bi piesa. Dac\u0103 se \u00eempr\u0103\u0219tie, s-ar putea s\u0103 apar\u0103 scurtcircuite sau \u00eembin\u0103ri slabe.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><p>Cold slump este atunci c\u00e2nd pasta de lipit se \u00eentinde dup\u0103 ce a\u021bi pus-o, ceea ce poate cauza probleme cum ar fi formarea de pun\u021bi \u0219i \u00een\u0103l\u021bimea redus\u0103 a \u00eembin\u0103rii.<\/p><\/li><li><p>C\u00e2t de mult se pr\u0103bu\u0219e\u0219te la rece depinde de grosimea pastei, temperatur\u0103, \u00een\u0103l\u021bime \u0219i viteza de uscare.<\/p><\/li><li><p>Mormanele de past\u0103 mai \u00eenalte \u0219i mai pu\u021bin metal \u00een past\u0103 pot agrava alunecarea la rece.<\/p><\/li>\n<\/ul>\n\n\n\n<p>Pute\u021bi reduce suspensia la rece prin alegerea unei paste cu mai mult metal sau a unei paste mai groase \u0219i prin modificarea set\u0103rilor de imprimare.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" >Pr\u0103bu\u0219ire la cald<\/h3>\n\n\n\n<p>Hot slump se \u00eent\u00e2mpl\u0103 atunci c\u00e2nd pasta de lipit \u00ee\u0219i pierde forma \u00een timpul \u00eenc\u0103lzirii. Pasta se tope\u0219te \u0219i se \u00eempr\u0103\u0219tie. Acest lucru poate cauza pun\u021bi de lipire sau conexiuni proaste. Trebuie s\u0103 controla\u021bi c\u0103ldura \u0219i s\u0103 folosi\u021bi pasta potrivit\u0103 pentru a opri alunecarea la cald.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" >Tombstoning<\/h3>\n\n\n\n<p>Tombstoning este atunci c\u00e2nd un cap\u0103t al unei piese cip se ridic\u0103 \u00een timp ce cel\u0103lalt r\u0103m\u00e2ne \u00een jos. Acest lucru se \u00eent\u00e2mpl\u0103 de obicei \u00een timpul \u00eenc\u0103lzirii. Partea se ridic\u0103 ca o piatr\u0103 de morm\u00e2nt. Acest lucru se \u00eent\u00e2mpl\u0103 deoarece for\u021bele de la fiecare cap\u0103t nu sunt egale. Acest lucru poate face ca circuitul s\u0103 fie slab sau s\u0103 nu func\u021bioneze bine.<\/p>\n\n\n\n<p>Deseori vede\u021bi tombstoning cu rezisten\u021be sau condensatoare cu cipuri mici. Aceast\u0103 problem\u0103 poate face ca circuitul dvs. s\u0103 nu func\u021bioneze sau s\u0103 se rup\u0103.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" >Crearea de pun\u021bi<\/h3>\n\n\n\n<p>Bridging \u00eenseamn\u0103 c\u0103 lipirea une\u0219te pl\u0103cu\u021be care nu ar trebui s\u0103 fie conectate. Acest lucru creeaz\u0103 un scurtcircuit \u0219i v\u0103 poate afecta dispozitivul.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><p><a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/www.allpcb.com\/blog\/pcb-assembly\/troubleshooting-reflow-soldering-defects-a-practical-guide-for-engineers.html\">Prea mult\u0103 past\u0103 de lipit<\/a>: Folosirea unei cantit\u0103\u021bi prea mari de past\u0103 poate face ca aceasta s\u0103 se \u00eempr\u0103\u0219tie \u0219i s\u0103 uneasc\u0103 tampoanele.<\/p><\/li><li><p>Design gre\u0219it al \u0219ablonului: \u0218abloanele care sunt prea mari sau care nu sunt aliniate pot pune pasta \u00een locul gre\u0219it.<\/p><\/li><li><p>\u00cenc\u0103lzire gre\u0219it\u0103: \u00cenc\u0103lzirea prea rapid\u0103 sau neuniform\u0103 poate face ca lipirea s\u0103 curg\u0103 peste tot.<\/p><\/li><li><p>Piesele nu sunt aliniate: Dac\u0103 piesele nu sunt a\u0219ezate corect, tampoanele se pot apropia prea mult \u0219i se pot suprapune.<\/p><\/li>\n<\/ul>\n\n\n\n<p>Pute\u021bi opri formarea de pun\u021bi folosind \u0219ablonul potrivit, pun\u00e2nd cantitatea potrivit\u0103 de past\u0103 \u0219i plas\u00e2nd piesele cu aten\u021bie.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" >Goluri<\/h3>\n\n\n\n<p>Golurile sunt puncte goale sau bule \u00een interiorul \u00eembin\u0103rii de lipire. Aceste spa\u021bii pot sl\u0103bi \u00eembinarea \u0219i pot afecta func\u021bionarea pl\u0103cii.<\/p>\n\n\n\n<figure class=\"wp-block-table\">\n<table class=\"has-fixed-layout\">\n<colgroup><col style=\"min-width: 25px;\"\/><col style=\"min-width: 25px;\"\/><\/colgroup><tbody><tr><th colspan=\"1\" rowspan=\"1\"><p>Cauza golurilor<\/p><\/th><th colspan=\"1\" rowspan=\"1\"><p>Impactul asupra fiabilit\u0103\u021bii<\/p><\/th><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Fluxuri volatile captive<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Face ca bilele de lipit s\u0103 fie slabe, reduc\u00e2nd eficien\u021ba lor<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Aer care se extinde din vias \u00eenfundate<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Face ca c\u0103ldura \u0219i electricitatea s\u0103 se mi\u0219te mai r\u0103u<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Goluri mari<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Afecteaz\u0103 fiabilitatea mai mult dec\u00e2t cele mici<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Fuzionarea golurilor mici<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Poate crea goluri mai mari \u00een timpul \u00eenc\u0103lzirii, afect\u00e2nd fiabilitatea<\/p><\/td><\/tr><\/tbody>\n<\/table>\n<\/figure>\n\n\n\n<figure class=\"wp-block-table\">\n<table class=\"has-fixed-layout\">\n<colgroup><col style=\"min-width: 25px;\"\/><col style=\"min-width: 25px;\"\/><\/colgroup><tbody><tr><th colspan=\"1\" rowspan=\"1\"><p>Dimensiunea golurilor<\/p><\/th><th colspan=\"1\" rowspan=\"1\"><p>Efectul asupra fiabilit\u0103\u021bii<\/p><\/th><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Mai mare de 50% de suprafa\u021b\u0103 a \u00eembin\u0103rii prin lipire<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Face articula\u021bia mai pu\u021bin rezistent\u0103<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Goluri mici<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Poate afecta fiabilitatea \u00een func\u021bie de locul \u00een care se afl\u0103<\/p><\/td><\/tr><\/tbody>\n<\/table>\n<\/figure>\n\n\n\n<p>\u00cencerca\u021bi s\u0103 p\u0103stra\u021bi golurile mici pentru ca \u00eembin\u0103rile de lipire s\u0103 fie puternice \u0219i produsele dvs. s\u0103 func\u021bioneze bine.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" >Cauze ale defectelor de lipire<\/h2>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large\"><img decoding=\"async\" width=\"1200\" height=\"675\" src=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461383-b01cb6de4e4f4afaa430808db9972dce.webp\" alt=\"Causes of Soldering Defects\" class=\"wp-image-3931\" srcset=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461383-b01cb6de4e4f4afaa430808db9972dce.webp 1200w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461383-b01cb6de4e4f4afaa430808db9972dce-300x169.webp 300w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461383-b01cb6de4e4f4afaa430808db9972dce-1024x576.webp 1024w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461383-b01cb6de4e4f4afaa430808db9972dce-768x432.webp 768w, https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2026\/01\/1768461383-b01cb6de4e4f4afaa430808db9972dce-18x10.webp 18w\" sizes=\"(max-width: 1200px) 100vw, 1200px\" title=\"Top Causes of SMT Soldering Defects and How to Prevent Them2 - S&amp;M Co.Ltd\" \/><figcaption class=\"wp-element-caption\">Sursa imaginii: <a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/pexels.com\">Pexels<\/a><\/figcaption><\/figure>\n\n\n\n<p>Dac\u0103 \u0219ti\u021bi de ce apar defectele, le pute\u021bi opri. Majoritatea problemelor de lipire SMT provin de la materiale, ma\u0219ini sau modul \u00een care controla\u021bi procesul. S\u0103 vedem care sunt cauzele acestor probleme \u0219i cum v\u0103 schimb\u0103 rezultatele.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" >Probleme legate de pasta de lipit<\/h3>\n\n\n\n<p>Pasta de lipit este foarte important\u0103 pentru o lipire bun\u0103. Dac\u0103 alege\u021bi o past\u0103 cu caracteristici gre\u0219ite, pute\u021bi avea multe probleme. Pasta care este prea lichid\u0103 sau groas\u0103 poate cauza formarea de pun\u021bi sau nu este suficient\u0103 lipire. Modul \u00een care depozita\u021bi pasta conteaz\u0103 \u0219i el. Trebuie s\u0103 p\u0103stra\u021bi pasta de lipit la rece, <a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/www.7pcb.com\/blog\/analysis-of-smt-solder-paste-printing-defects\">\u00eentre 0 \u0219i 5 grade Celsius<\/a>. \u00cenainte de a-l utiliza, l\u0103sa\u021bi-l s\u0103 stea timp de dou\u0103 p\u00e2n\u0103 la patru ore. Acest lucru ajut\u0103 la oprirea form\u0103rii pic\u0103turilor de ap\u0103, care pot cauza probleme de lipire.<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Sfat: Scrie\u021bi \u00eentotdeauna data la care a\u021bi cump\u0103rat pasta de lipit. <a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/www.poe-pcba.com\/blogs-detail\/pcb-knowledge-blog\/solder-material-and-equipments\">Verifica\u021bi lotul \u0219i temperatura de depozitare<\/a> la fiecare 12 ore pentru a-l men\u021bine \u00eentre 2 \u0219i 10 \u2103.<\/p><\/blockquote>\n\n\n\n<p>Pasta de lipit are aspecte precum grosimea, cantitatea de metal \u0219i puterea fluxului. Acestea schimb\u0103 c\u00e2t de bine se imprim\u0103 \u0219i se tope\u0219te. Dac\u0103 nu ave\u021bi grij\u0103 de aceste lucruri, s-ar putea s\u0103 vede\u021bi mai multe probleme, cum ar fi bile de lipit, pun\u021bi sau \u00eembin\u0103ri slabe.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" >Oxidare \u0219i contaminare<\/h3>\n\n\n\n<p>Piesele curate sunt necesare pentru o lipire bun\u0103. Oxidarea \u0219i murd\u0103ria pot \u00eempiedica lipirea pe pl\u0103cu\u021be \u0219i cabluri. <a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/circuitsassembly.com\/ca\/editorial\/menu-features\/38841-an-ai-method-for-early-detection-of-failures-caused-by-corrosion-on-components-during-assembly-correlated-to-field-failure-analysis-cases.html\">Oxigen, carbon \u0219i siliciu<\/a> sunt lucruri comune care fac lipirea dificil\u0103. Acestea provin de la aer, rugin\u0103 sau chiar de la fabricarea piesei. Atunci c\u00e2nd acestea se acumuleaz\u0103, lipirea nu se poate lipi bine, astfel \u00eenc\u00e2t \u00eembin\u0103rile devin slabe sau se rup.<\/p>\n\n\n\n<figure class=\"wp-block-table\">\n<table class=\"has-fixed-layout\">\n<colgroup><col style=\"min-width: 25px;\"\/><col style=\"min-width: 25px;\"\/><col style=\"min-width: 25px;\"\/><\/colgroup><tbody><tr><th colspan=\"1\" rowspan=\"1\"><p>Contaminant<\/p><\/th><th colspan=\"1\" rowspan=\"1\"><p>Sursa<\/p><\/th><th colspan=\"1\" rowspan=\"1\"><p>Efect asupra lipirii<\/p><\/th><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Oxigen<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Oxidare<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Face ca lipirea s\u0103 nu se lipeasc\u0103 bine<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Siliciu<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Mold<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Face leg\u0103turile mai pu\u021bin puternice<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Carbon<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Rugin\u0103<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Face ca lipirea s\u0103 nu se lipeasc\u0103 bine<\/p><\/td><\/tr><\/tbody>\n<\/table>\n<\/figure>\n\n\n\n<p>Trebuie s\u0103 p\u0103stra\u021bi \u00eentotdeauna pl\u0103cile \u0219i piesele curate. Ma\u0219inile SMT de la S&amp;M v\u0103 ajut\u0103 s\u0103 p\u0103stra\u021bi lucrurile curate prin utilizarea unor controale bune \u0219i a unei manipul\u0103ri curate.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" >Probleme legate de procesul de refulare<\/h3>\n\n\n\n<p>Procesul de reflow tope\u0219te lipirea \u0219i realizeaz\u0103 \u00eembin\u0103rile finale. Dac\u0103 nu controla\u021bi c\u0103ldura, pute\u021bi avea multe probleme. C\u0103ldura neuniform\u0103 poate cauza \"tombstoning\", c\u00e2nd un cap\u0103t al unei piese se ridic\u0103. Schimb\u0103rile mari de c\u0103ldur\u0103 pot bloca gazul, cre\u00e2nd goluri. Dac\u0103 lipirea nu se tope\u0219te p\u00e2n\u0103 la cap\u0103t, se ob\u021bin \u00eembin\u0103ri reci, care sunt slabe.<\/p>\n\n\n\n<figure class=\"wp-block-table\">\n<table class=\"has-fixed-layout\">\n<colgroup><col style=\"min-width: 25px;\"\/><col style=\"min-width: 25px;\"\/><\/colgroup><tbody><tr><th colspan=\"1\" rowspan=\"1\"><p><a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/www.linkedin.com\/pulse\/what-leads-soldering-defects-smt-reflow-how-address-gkxqc\">Tipul defectului<\/a><\/p><\/th><th colspan=\"1\" rowspan=\"1\"><p>Descriere<\/p><\/th><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Tombstoning<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Un cap\u0103t al unei piese se ridic\u0103 din cauza c\u0103ldurii neuniforme.<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Anularea<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Bulele de gaz se blocheaz\u0103 din cauza schimb\u0103rilor de c\u0103ldur\u0103.<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Cap \u00een pern\u0103<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Lipirea nu acoper\u0103 plumbul, adesea din cauza c\u0103ldurii slabe.<\/p><\/td><\/tr><\/tbody>\n<\/table>\n<\/figure>\n\n\n\n<p>Trebuie s\u0103 seta\u021bi c\u0103ldura potrivit\u0103 pentru placa \u0219i piesele dvs. Cuptoarele S&amp;M utilizeaz\u0103 un control bun al c\u0103ldurii pentru a v\u0103 ajuta s\u0103 opri\u021bi aceste probleme \u0219i s\u0103 men\u021bine\u021bi lucrurile stabile.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" >Erorile de plasare a componentelor<\/h3>\n\n\n\n<p>Plasarea pieselor \u00een locul potrivit este foarte important\u0103 \u00een SMT. Dac\u0103 pune\u021bi piesele descentrate sau la un unghi gre\u0219it, pute\u021bi avea probleme cum ar fi formarea de pun\u021bi, de morminte sau lipire insuficient\u0103. Studiile arat\u0103 c\u0103 <a target=\"_blank\" href=\"https:\/\/iconnect007.com\/index.php\/article\/52216\/process-control\/52219\">cele mai multe probleme provin din plasarea gre\u0219it\u0103<\/a>, \u00een special cu piese mici precum 0402.<\/p>\n\n\n\n<figure class=\"wp-block-table\">\n<table class=\"has-fixed-layout\">\n<colgroup><col style=\"min-width: 25px;\"\/><col style=\"min-width: 25px;\"\/><\/colgroup><tbody><tr><th colspan=\"1\" rowspan=\"1\"><p>Tipul defectului<\/p><\/th><th colspan=\"1\" rowspan=\"1\"><p>Descriere<\/p><\/th><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p><a target=\"_blank\" href=\"https:\/\/www.chuxin-smt.com\/ro\/reduce-solder-bridging-wave-soldering-best-practices\/\">Punte de lipire<\/a><\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Plasarea gre\u0219it\u0103 face ca pl\u0103cu\u021bele s\u0103 fie prea apropiate, provoc\u00e2nd scurtcircuite.<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Tombstoning<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Plasarea gre\u0219it\u0103 poate ridica o parte a unei piese.<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Lipire insuficient\u0103<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Plasarea proast\u0103 \u00eenseamn\u0103 c\u0103 nu este suficient\u0103 lipire pe \u00eembinare.<\/p><\/td><\/tr><\/tbody>\n<\/table>\n<\/figure>\n\n\n\n<p>Pute\u021bi reduce aceste gre\u0219eli folosind ma\u0219ini care plaseaz\u0103 piesele foarte bine. Ma\u0219inile S&amp;M utilizeaz\u0103 camere inteligente \u0219i piese puternice pentru a se asigura c\u0103 piesele sunt plasate \u00een locul potrivit.<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Not\u0103: O bun\u0103 proiectare a PCB ajut\u0103 \u0219i la stoparea problemelor. Asigura\u021bi-v\u0103 c\u0103 pl\u0103cu\u021bele \u0219i formele se potrivesc cu piesele \u0219i pasta de lipit.<\/p><\/blockquote>\n\n\n\n<p>Dac\u0103 cunoa\u0219te\u021bi aceste cauze \u0219i folosi\u021bi instrumentele \u0219i controalele potrivite, pute\u021bi reduce problemele de lipire \u0219i v\u0103 pute\u021bi face produsele s\u0103 func\u021bioneze mai bine.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" >Prevenirea defectelor de lipire SMT cu ajutorul solu\u021biilor S&amp;M<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\" >Controlul calit\u0103\u021bii \u00een imprimarea pastei de lipit<\/h3>\n\n\n\n<p>Pute\u021bi opri multe probleme prin verificarea calit\u0103\u021bii \u00een timpul imprim\u0103rii pastei de lipit. <a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/www.pcbcart.com\/article\/content\/solder-paste-inspection.html\">Inspec\u021bia pastei de lipit<\/a>, sau SPI, v\u0103 ajut\u0103 s\u0103 descoperi\u021bi gre\u0219elile la timp. Acest lucru \u00eenseamn\u0103 c\u0103 le pute\u021bi remedia \u00eenainte ca acestea s\u0103 se agraveze. SPI se uit\u0103 la cantitatea de lipire de pe fiecare pl\u0103cu\u021b\u0103 \u0219i la forma acesteia. Tabelul de mai jos arat\u0103 cum v\u0103 ajut\u0103 SPI:<\/p>\n\n\n\n<figure class=\"wp-block-table\">\n<table class=\"has-fixed-layout\">\n<colgroup><col style=\"min-width: 25px;\"\/><col style=\"min-width: 25px;\"\/><\/colgroup><tbody><tr><th colspan=\"1\" rowspan=\"1\"><p>M\u0103sura de control al calit\u0103\u021bii<\/p><\/th><th colspan=\"1\" rowspan=\"1\"><p>Descriere<\/p><\/th><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Inspec\u021bia pastei de lipit (SPI)<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Descoper\u0103 defectele la \u00eenceputul procesului.<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Reducerea defectelor<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Stopeaz\u0103 p\u00e2n\u0103 la 64% de defecte SMT de la imprimarea defectuoas\u0103 a pastei de lipit.<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Eficien\u021b\u0103 ridicat\u0103<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>V\u0103 permite s\u0103 rezolva\u021bi problemele imediat \u0219i s\u0103 economisi\u021bi timp.<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Cost redus<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Reducerea costurilor prin evitarea reprelucr\u0103rii \u00een ultima etap\u0103.<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Fiabilitate ridicat\u0103<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Face ca produsele dvs. finale s\u0103 fie mai fiabile.<\/p><\/td><\/tr><\/tbody>\n<\/table>\n<\/figure>\n\n\n\n<p>S&amp;M are <a target=\"_blank\" href=\"https:\/\/www.chuxin-smt.com\/he\/5-traps-to-avoid-when-choosing-a-full-smt-solution\/\">sisteme SPI avansate<\/a> pentru linia dvs. SMT. Aceste sisteme v\u0103 ajut\u0103 s\u0103 v\u0103 men\u021bine\u021bi procesul func\u021bion\u00e2nd bine.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" >Optimizarea lipirii prin reflux<\/h3>\n\n\n\n<p>Pute\u021bi avea mai pu\u021bine probleme de lipire prin setarea <a target=\"_blank\" href=\"https:\/\/www.chuxin-smt.com\/ro\/reflow-oven-temperature-profiling-soldering-defect-solutions\/\">temperatura corect\u0103 a cuptorului<\/a> \u0219i viteza. Un control bun v\u0103 ajut\u0103 s\u0103 realiza\u021bi \u00eembin\u0103ri de lipit puternice. Utilizarea curbei de c\u0103ldur\u0103 potrivite v\u0103 poate oferi <a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/www.smtneoden.com\/news\/how-to-optimize-smt-reflow-oven-process-parameters-to-improve-yield\/\">peste 99% pl\u0103ci bune<\/a>. Cuptoarele S&amp;M v\u0103 permit s\u0103 controla\u021bi foarte bine c\u0103ldura \u0219i viteza. Acest lucru v\u0103 ajut\u0103 s\u0103 opri\u021bi lipiturile reci \u0219i golurile.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" >Selectarea \u0219i \u00eentre\u021binerea echipamentelor<\/h3>\n\n\n\n<p>Trebuie s\u0103 alege\u021bi ma\u0219ini bune \u0219i s\u0103 ave\u021bi grij\u0103 de ele. Verificarea \u0219i repararea ma\u0219inilor dvs. stopeaz\u0103 adesea multe probleme. <a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/www.allpcb.com\/allelectrohub\/the-ultimate-guide-to-iso-9001-certified-smt-assembly-processes-and-best-practices\">ISO 9001<\/a> spune c\u0103 trebuie s\u0103 verifica\u021bi \u0219i s\u0103 regla\u021bi ma\u0219inile foarte des. Ma\u0219inile S&amp;M sunt u\u0219or de \u00eentre\u021binut \u0219i vin cu ajutor pentru a v\u0103 men\u021bine linia \u00een func\u021biune.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" >Rolul S&amp;M \u00een prevenirea defectelor<\/h3>\n\n\n\n<p>S&amp;M este un lider \u00een solu\u021biile de lipire smt. Ob\u021bine\u021bi stocare inteligent\u0103 pentru lipire, verific\u0103ri \u00een timp real \u0219i controale bune ale procesului. Aceste lucruri v\u0103 ajut\u0103 s\u0103 evita\u021bi timpii mor\u021bi \u0219i s\u0103 p\u0103stra\u021bi materialele \u00een stare bun\u0103. Multe companii au \u00eencredere \u00een S&amp;M pentru a reduce defectele \u0219i a face produsele mai bune. S&amp;M v\u0103 ajut\u0103 cu idei noi, calitate \u0219i servicii excelente pentru clien\u021bi.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" >Cele mai bune practici pentru o lipire fiabil\u0103<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\" >Monitorizarea proceselor<\/h3>\n\n\n\n<p>Pute\u021bi ob\u021bine o lipire smt mai bun\u0103 dac\u0103 v\u0103 urm\u0103ri\u021bi procesul tot timpul. Utiliza\u021bi un software special pentru a vedea problemele chiar \u00een momentul \u00een care apar. Verifica\u021bi numere precum <a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/eureka.patsnap.com\/article\/process-control-in-smt-assembly-key-metrics-and-optimization-tips\">Randamentul la prima trecere<\/a>, Defect per Million Opportunities \u0219i acurate\u021bea plas\u0103rii. Aceste cifre v\u0103 spun c\u00e2t de bine func\u021bioneaz\u0103 linia dumneavoastr\u0103. De asemenea, ele v\u0103 ajut\u0103 s\u0103 g\u0103si\u021bi ce trebuie reparat. Ave\u021bi grij\u0103 de ma\u0219inile dvs. des, astfel \u00eenc\u00e2t acestea s\u0103 func\u021bioneze bine. \u00cembun\u0103t\u0103\u021bi\u021bi imprimarea pastei de lipit analiz\u00e2nd proiectarea \u0219ablonului \u0219i set\u0103rile imprimantei. Atunci c\u00e2nd face\u021bi aceste lucruri, ve\u021bi ob\u021bine mai pu\u021bine defecte \u0219i produsele dvs. vor func\u021biona mai bine.<\/p>\n\n\n\n<figure class=\"wp-block-table\">\n<table class=\"has-fixed-layout\">\n<colgroup><col style=\"min-width: 25px;\"\/><col style=\"min-width: 25px;\"\/><\/colgroup><tbody><tr><th colspan=\"1\" rowspan=\"1\"><p>Cele mai bune practici<\/p><\/th><th colspan=\"1\" rowspan=\"1\"><p>Descriere<\/p><\/th><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Designul pl\u0103cu\u021bei de lipit<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Utiliza\u021bi tampoane NSMD pentru un control \u0219i o aliniere mai bune.<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Selectarea pastei de lipit<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Alege\u021bi dimensiunea corect\u0103 a particulelor \u0219i aliajul.<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Profilarea termic\u0103<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Urma\u021bi rampele de temperatur\u0103 recomandate.<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Optimizarea \u0219ablonului<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Regla\u021bi raporturile de grosime \u0219i diafragm\u0103.<\/p><\/td><\/tr><\/tbody>\n<\/table>\n<\/figure>\n\n\n\n<h3 class=\"wp-block-heading\" >Formarea personalului<\/h3>\n\n\n\n<p>Echipa dvs. ajut\u0103 la stoparea problemelor de lipire. \u00cenv\u0103\u021ba\u021bi-v\u0103 des personalul metode \u0219i reguli noi. Muncitorii buni pot vedea problemele din timp \u0219i le pot rezolva rapid. Cere\u021bi echipei dvs. s\u0103 \u00eenve\u021be despre noile ma\u0219ini \u0219i instrumente de inspec\u021bie. Atunci c\u00e2nd personalul dumneavoastr\u0103 cunoa\u0219te procesul, ob\u021bine\u021bi o calitate mai bun\u0103 \u0219i mai pu\u021bine defecte.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" >\u00cembun\u0103t\u0103\u021birea continu\u0103<\/h3>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Dac\u0103 utiliza\u021bi <a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/jlcpcb.com\/blog\/how-to-prevent-solder-defects-during-reflow-soldering\">controale puternice ale proceselor<\/a> \u0219i \u00eencerca\u021bi \u00eentotdeauna s\u0103 v\u0103 \u00eembun\u0103t\u0103\u021bi\u021bi, pute\u021bi avea mai pu\u021bine goluri de lipire \u0219i v\u0103 pute\u021bi face ansamblurile smt mai puternice.<\/p><\/blockquote>\n\n\n\n<p>C\u0103uta\u021bi \u00eentotdeauna modalit\u0103\u021bi de \u00eembun\u0103t\u0103\u021bire. Verifica\u021bi datele de produc\u021bie \u0219i feedback-ul pentru a g\u0103si problemele \u0219i a le rezolva. Utiliza\u021bi verific\u0103ri ale calit\u0103\u021bii precum <a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/www.pcbcart.com\/article\/content\/how-to-solve-solder-joint-problems.html\">Inspec\u021bie optic\u0103 automatizat\u0103<\/a> \u0219i controale cu raze X. \u00cembun\u0103t\u0103\u021bi\u021bi profilurile de reflow \u0219i alegerea pastei de lipit. Atunci c\u00e2nd utiliza\u021bi cele mai bune practici \u0219i continua\u021bi s\u0103 v\u0103 \u00eembun\u0103t\u0103\u021bi\u021bi, produsele dvs. devin mai puternice \u0219i lipirea smt func\u021bioneaz\u0103 bine.<\/p>\n\n\n\n<p>Pute\u021bi avea mai pu\u021bine defecte de lipire smt cu un control bun al procesului \u0219i un echipament excelent. S&amp;M ofer\u0103 instrumente inteligente pentru a v\u0103 ajuta s\u0103 face\u021bi lucrurile s\u0103 func\u021bioneze mai bine. \u00cenv\u0103\u021barea de lucruri noi \u0219i \u00eembun\u0103t\u0103\u021birea procesului v\u0103 ajut\u0103 s\u0103 ob\u021bine\u021bi rezultate mai bune. Aceste idei v\u0103 pot ajuta:<\/p>\n\n\n\n<figure class=\"wp-block-table\">\n<table class=\"has-fixed-layout\">\n<colgroup><col style=\"min-width: 25px;\"\/><col style=\"min-width: 25px;\"\/><\/colgroup><tbody><tr><th colspan=\"1\" rowspan=\"1\"><p>Strategie<\/p><\/th><th colspan=\"1\" rowspan=\"1\"><p>Impactul asupra calit\u0103\u021bii<\/p><\/th><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p><a target=\"_blank\" rel=\"nofollow\" href=\"https:\/\/www.linkedin.com\/pulse\/smt-oee-optimization-complete-guide-electronics-manufacturing-h40wc\">Formare continu\u0103<\/a><\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Ajut\u0103 lucr\u0103torii s\u0103 verifice mai bine \u0219i opre\u0219te problemele ma\u0219inii<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Controlul proceselor<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Stopeaz\u0103 gre\u0219elile \u0219i creeaz\u0103 mai multe produse bune<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Inspec\u021bie \u00een bucl\u0103 \u00eenchis\u0103<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Descoper\u0103 \u0219i rezolv\u0103 problemele din timp<\/p><\/td><\/tr><\/tbody>\n<\/table>\n<\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" >\u00ceNTREB\u0102RI FRECVENTE<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\" >Care este cel mai frecvent defect de lipire SMT?<\/h3>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Pun\u021bile de lipire se produc foarte des. Aceast\u0103 problem\u0103 une\u0219te pl\u0103cu\u021be care nu ar trebui s\u0103 se ating\u0103. O pute\u021bi opri prin alegerea stencilului potrivit. A\u0219eza\u021bi piesele cu aten\u021bie pentru a preveni acest lucru.<\/p><\/blockquote>\n\n\n\n<h3 class=\"wp-block-heading\" >Cum pute\u021bi reduce tombstoning-ul \u00een asamblarea SMT?<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><p>Pune\u021bi piesele \u00een locul potrivit.<\/p><\/li><li><p>Urm\u0103ri\u021bi \u00eendeaproape c\u0103ldura de refulare.<\/p><\/li><li><p>Alege\u021bi pasta de lipit sugerat\u0103 de exper\u021bi.<\/p><\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\" >De ce ar trebui s\u0103 alege\u021bi echipamentele S&amp;M pentru produc\u021bia SMT?<\/h3>\n\n\n\n<figure class=\"wp-block-table\">\n<table class=\"has-fixed-layout\">\n<colgroup><col style=\"min-width: 25px;\"\/><col style=\"min-width: 25px;\"\/><\/colgroup><tbody><tr><th colspan=\"1\" rowspan=\"1\"><p>Beneficii<\/p><\/th><th colspan=\"1\" rowspan=\"1\"><p>Descriere<\/p><\/th><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Fiabilitate<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Ma\u0219inile func\u021bioneaz\u0103 bine \u0219i dureaz\u0103 mult.<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Inova\u021bie<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Prime\u0219ti tehnologie nou\u0103 \u0219i inteligent\u0103.<\/p><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><p>Sprijin<\/p><\/td><td colspan=\"1\" rowspan=\"1\"><p>Ve\u021bi ob\u021bine <a target=\"_blank\" href=\"https:\/\/www.chuxin-smt.com\/pl\/resources\/support-service\/\">ajutor din partea unor persoane calificate<\/a>.<\/p><\/td><\/tr><\/tbody>\n<\/table>\n<\/figure>","protected":false},"excerpt":{"rendered":"<p>SMT soldering defects like bridging and tombstoning stem from paste, placement, and reflow issues. Prevent them with process control and quality equipment.<\/p>","protected":false},"author":3,"featured_media":3932,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"categories":[1,52],"tags":[60,84,64],"class_list":["post-3933","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-company-news","category-product-information","tag-smt","tag-solder-equipment","tag-soldering-process"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/posts\/3933","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/comments?post=3933"}],"version-history":[{"count":0,"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/posts\/3933\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/media\/3932"}],"wp:attachment":[{"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/media?parent=3933"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/categories?post=3933"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/ro\/wp-json\/wp\/v2\/tags?post=3933"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}