{"id":3061,"date":"2025-09-12T10:50:27","date_gmt":"2025-09-12T02:50:27","guid":{"rendered":"https:\/\/www.chuxin-smt.com\/preheating-systems-cooling-smt-curing-ovens-pcb-reliability\/"},"modified":"2026-02-11T07:00:18","modified_gmt":"2026-02-10T23:00:18","slug":"preheating-systems-cooling-smt-curing-ovens-pcb-reliability","status":"publish","type":"post","link":"https:\/\/www.chuxin-smt.com\/tr\/preheating-systems-cooling-smt-curing-ovens-pcb-reliability\/","title":{"rendered":"SMT K\u00fcrleme F\u0131r\u0131nlar\u0131nda \u00d6n Is\u0131tma ve So\u011futma Sistemlerinin \u00d6nemi"},"content":{"rendered":"<p><figure class=\"wp-block-image alignnone\"><img decoding=\"async\" src=\"https:\/\/www.chuxin-smt.com\/wp-content\/uploads\/2025\/09\/1757646097-\u6599\u6846\u5f0f\u5782\u76f4\u56fa\u5316\u7089.webp\" alt=\"Importance of Preheating and Cooling Systems in SMT Curing Ovens - S&#038;M Co.Ltd\" ><\/figure>\n<\/p>\n<p>SMT k\u00fcrleme f\u0131r\u0131nlar\u0131nda g\u00fc\u00e7l\u00fc lehim ba\u011flant\u0131lar\u0131 yapmak i\u00e7in tam \u0131s\u0131 kontrol\u00fcne ihtiyac\u0131n\u0131z vard\u0131r. \u00d6n \u0131s\u0131tma sistemleri par\u00e7alar\u0131n\u0131z\u0131 yava\u015f\u00e7a \u0131s\u0131t\u0131r. Bu, gerilimi ve hasar\u0131 durdurmaya yard\u0131mc\u0131 olur. So\u011futma sistemleri de \u00f6nemlidir. Lehim ba\u011flant\u0131lar\u0131n\u0131n sertle\u015fmesine ve PCB'lerin daha iyi \u00e7al\u0131\u015fmas\u0131na yard\u0131mc\u0131 olurlar. A\u015fa\u011f\u0131daki tablo so\u011futma h\u0131z\u0131n\u0131n \u00fcr\u00fcn kalitesini nas\u0131l de\u011fi\u015ftirdi\u011fini g\u00f6stermektedir:<\/p>\n<p>| <a href=\"https:\/\/www.chuxin-smt.com\/tr\/reflow-soldering-cooling-system-importance-optimization\/\">So\u011futma H\u0131z\u0131 (\u00b0C\/s)<\/a> | Impact on Solder Joint Quality   | Impact on PCB Reliability |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;- | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8211; | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;- |<br \/>\n| 1.5 \u2013 10                                                                                                   | Strong, reliable solder joints   | Fewer defects             |<br \/>\n| Too slow                                                                                                   | Weak, rough microstructures      | Higher chance of failure  |<br \/>\n| Too fast                                                                                                   | Cracks inside, layers peel apart | Weaker strength           |<\/p>\n<p>K\u00f6t\u00fc \u0131s\u0131 kontrol\u00fc lehim ba\u011flant\u0131lar\u0131n\u0131n bozulmas\u0131na neden olabilir. Ayr\u0131ca PCB'yi de zorlayabilir. Bu da sorunlara neden olabilir ve \u00fcretimi yava\u015flatabilir.<\/p>\n<h2 id=\"keytakeaways\">\u00d6nemli \u00c7\u0131kar\u0131mlar<\/h2>\n<ul>\n<li>\u00d6n \u0131s\u0131tma sistemleri par\u00e7alar\u0131 yava\u015f\u00e7a \u0131s\u0131t\u0131r. Bu, gerilimi ve hasar\u0131 durdurur. Lehim ba\u011flant\u0131lar\u0131n\u0131 daha g\u00fc\u00e7l\u00fc hale getirir. Ayr\u0131ca PCB'lerin daha uzun s\u00fcre dayanmas\u0131na yard\u0131mc\u0131 olur.<\/li>\n<li><a href=\"https:\/\/www.chuxin-smt.com\/tr\/reflow-soldering-cooling-system-importance-optimization\/\">Kontroll\u00fc so\u011futma \u00e7ok \u00f6nemlidir<\/a>. \u00c7atlaklar\u0131n olu\u015fmas\u0131n\u0131 engeller. Lehim ba\u011flant\u0131lar\u0131n\u0131n do\u011fru \u015fekilde sertle\u015fmesine yard\u0131mc\u0131 olur. Bu da \u00fcr\u00fcnlerin daha uzun \u00f6m\u00fcrl\u00fc olmas\u0131n\u0131 sa\u011flar.<\/li>\n<li><a href=\"https:\/\/www.chuxin-smt.com\/tr\/reflow-soldering-cooling-system-importance-optimization\/\">S\u0131cakl\u0131k profillerinizi kontrol edin ve ayarlay\u0131n<\/a> s\u0131k s\u0131k. Bu, sorunlar\u0131 durdurmaya yard\u0131mc\u0131 olur. \u00dcretimin iyi \u00e7al\u0131\u015fmas\u0131n\u0131 sa\u011flar.<\/li>\n<li>F\u0131r\u0131n\u0131n\u0131z\u0131 s\u0131k s\u0131k temizleyin ve t\u0131kan\u0131kl\u0131k olup olmad\u0131\u011f\u0131na bak\u0131n. Temiz bir f\u0131r\u0131n e\u015fit \u015fekilde \u0131s\u0131t\u0131r. Ayr\u0131ca pahal\u0131 onar\u0131mlar\u0131 da \u00f6nler.<\/li>\n<li>Her PCB i\u00e7in \u00f6zel s\u0131cakl\u0131k profilleri kullan\u0131n. Her montaj\u0131n kendi \u0131s\u0131 ayarlar\u0131na ihtiyac\u0131 vard\u0131r. Bu en iyi sonu\u00e7lar\u0131 verir.<\/li>\n<\/ul>\n<h2 id=\"importance\">\u00d6nem<\/h2>\n<h3 id=\"solderjointquality\">Lehim Ba\u011flant\u0131 Kalitesi<\/h3>\n<p>Her bir lehim ba\u011flant\u0131s\u0131n\u0131n g\u00fc\u00e7l\u00fc olmas\u0131n\u0131 istersiniz. \u00d6n \u0131s\u0131tma sistemleri PCB'yi ve par\u00e7alar\u0131 yava\u015f\u00e7a \u0131s\u0131tarak yard\u0131mc\u0131 olur. Bu hafif \u0131s\u0131, lehim pastas\u0131n\u0131n d\u00f6k\u00fclmesini veya par\u00e7alanmas\u0131n\u0131 \u00f6nler. \u00c7ok h\u0131zl\u0131 \u0131s\u0131t\u0131rsan\u0131z, lehim toplar\u0131 veya k\u00f6t\u00fc \u0131slatma elde edebilirsiniz. <a href=\"https:\/\/www.chuxin-smt.com\/tr\/reflow-soldering-cooling-system-importance-optimization\/\">So\u011futma sistemleri de \u00f6nemlidir<\/a>. \u00c7ok h\u0131zl\u0131 so\u011futma lehimin i\u00e7inde \u00e7atlaklara neden olabilir. \u00c7ok yava\u015f so\u011futma ba\u011flant\u0131lar\u0131 zay\u0131flatabilir.<\/p>\n<blockquote>\n<p><strong>\u0130pucu:<\/strong> S\u0131cakl\u0131k profilinizi daima kontrol edin. Yava\u015f bir rampa ve sabit bir \u0131slatma, gazlar\u0131n d\u0131\u015far\u0131 \u00e7\u0131kmas\u0131n\u0131 sa\u011flar ve lehimdeki \u00e7atlaklar\u0131 veya delikleri durdurur.<\/p>\n<\/blockquote>\n<p>\u0130\u015fte a\u015fa\u011f\u0131dakileri g\u00f6steren bir tablo <a href=\"https:\/\/www.flason-smt.com\/new\/Which-Soldering-Defects-are-Related-to-the-Incorrect-Setup-of-the-Reflow-Profile.html\">K\u00f6t\u00fc \u00f6n \u0131s\u0131tma ve so\u011futmadan kaynaklanan yayg\u0131n sorunlar<\/a>:<\/p>\n<p>| Zone          | Defect Type           | Cause of Defect                            |<br \/>\n| &#8212;&#8212;&#8212;&#8212;- | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212; | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212; |<br \/>\n| Pre-heat zone | Solder paste collapse | Ramp up too fast, viscosity drops          |<br \/>\n| Pre-heat zone | Soldering ball        | Rapid solvent vaporization                 |<br \/>\n| Pre-heat zone | Solder splash         | Quick ramp up                              |<br \/>\n| Pre-heat zone | Poor wetting          | Oxidation from long pre-heat               |<br \/>\n| Cooling zone  | Components crack      | Rapid cooling causes thermal shock         |<br \/>\n| Cooling zone  | Increased fatigue     | Slow cooling creates excess intermetallics |<\/p>\n<h3 id=\"pcbreliability\">PCB G\u00fcvenilirli\u011fi<\/h3>\n<p>PCB'lerinizin uzun s\u00fcre dayanmas\u0131n\u0131 istersiniz. \u00d6n Is\u0131tma Sistemleri ve kontroll\u00fc so\u011futma, kartlar\u0131 \u015fok ve stresten korur. S\u0131cakl\u0131klar\u0131n \u00e7ok h\u0131zl\u0131 de\u011fi\u015fmesi PCB'yi b\u00fckebilir veya \u00e7atlatabilir. Bu da kart\u0131 zay\u0131flat\u0131r ve \u00f6mr\u00fcn\u00fc k\u0131salt\u0131r. Do\u011fru rampa ve \u0131slatma s\u00fcrelerinin kullan\u0131lmas\u0131 kart\u0131n stresle ba\u015fa \u00e7\u0131kmas\u0131na yard\u0131mc\u0131 olur.<\/p>\n<p>\u0130yi bir s\u00fcre\u00e7 \u015fu ad\u0131mlar\u0131 kullan\u0131r:<\/p>\n<ul>\n<li><a href=\"https:\/\/www.ltpcba.com\/rigid-flex-pcb-smt-assembly-critical-challenges-and-best-practices-for-success\/\">Saniyede 3\u00b0C'den fazla olmamak kayd\u0131yla 150-180\u00b0C'ye kadar y\u00fckselme<\/a>.<\/li>\n<li>\u00c7\u00f6z\u00fcc\u00fclerin ayr\u0131lmas\u0131 i\u00e7in 60-120 saniye bekleyin.<\/li>\n<li>\u015eoku durdurmak i\u00e7in saniyede en fazla 4\u00b0C so\u011futun.<\/li>\n<\/ul>\n<p>| Parameter   | Description                                      |<br \/>\n| &#8212;&#8212;&#8212;&#8211; | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212; |<br \/>\n| Preheat     | Ramp \u22643\u00b0C\/s to 150\u2013180\u00b0C, hold 60\u2013120s           |<br \/>\n| Cooling     | Ramp down \u22644\u00b0C\/s                                 |<br \/>\n| Reliability | An optimized process can cut defect rates by 25% |<\/p>\n<p>Tekrar tekrar \u0131s\u0131tma ve so\u011futma da levhalar\u0131n ne kadar uzun s\u00fcre dayanaca\u011f\u0131n\u0131 etkiler. S\u0131cakl\u0131k de\u011fi\u015fimlerini kontrol ederseniz, \u00e7atlama ve b\u00fck\u00fclme riskini azalt\u0131rs\u0131n\u0131z. Bu, tahtalar\u0131n\u0131z\u0131n daha uzun s\u00fcre daha iyi \u00e7al\u0131\u015ft\u0131\u011f\u0131 anlam\u0131na gelir.<\/p>\n<h3 id=\"defectprevention\">Kusur \u00d6nleme<\/h3>\n<p>Is\u0131y\u0131 iyi y\u00f6neterek bir\u00e7ok SMT hatas\u0131n\u0131 durdurabilirsiniz. \u00d6n Is\u0131tma Sistemleri tombstoning, lehim k\u00f6pr\u00fcleme ve bo\u015fluklar\u0131 \u00f6nlemenize yard\u0131mc\u0131 olur. Tombstoning, lehimleme s\u0131ras\u0131nda bir par\u00e7an\u0131n bir ucu yukar\u0131 kalkt\u0131\u011f\u0131nda meydana gelir. Bu genellikle e\u015fit olmayan \u0131s\u0131nmadan kaynaklan\u0131r. Lehim k\u00f6pr\u00fcleme, \u00e7ok fazla lehim yanl\u0131\u015fl\u0131kla iki pedi birle\u015ftirdi\u011finde meydana gelir.<\/p>\n<p>| Defect          | What Happens                       | How to Prevent                     |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212; | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;- | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;- |<br \/>\n| Tombstoning     | The component stands up on one end | Use even heating and good profiles |<br \/>\n| Solder bridging | Solder joins two pads by accident  | Control solder paste and alignment |<\/p>\n<p><a href=\"https:\/\/www.smtfactory.com\/top-tips-to-prevent-voids-in-bga-soldering-with-a-reflow-oven.html\">Yava\u015f, sabit bir \u00f6n \u0131s\u0131tma ve \u0131slatma gazlar\u0131n d\u0131\u015far\u0131 \u00e7\u0131kmas\u0131n\u0131 sa\u011flar<\/a> ve lehim ba\u011flant\u0131lar\u0131n\u0131 g\u00fc\u00e7l\u00fc tutar. En y\u00fcksek s\u0131cakl\u0131\u011f\u0131 lehimin erime noktas\u0131n\u0131n en az 15\u00b0C \u00fczerinde tutmak iyi bir ba\u011flant\u0131 olu\u015fturmaya yard\u0131mc\u0131 olur. Acele ederseniz, \u00e7atlaklar, delikler ve zay\u0131f ba\u011flant\u0131lar riskiyle kar\u015f\u0131la\u015f\u0131rs\u0131n\u0131z.<\/p>\n<blockquote>\n<p><strong>Not:<\/strong> Gerilim-s\u00fcr\u00fcnme gerinim d\u00f6ng\u00fcs\u00fc i\u00e7indeki alan, daha b\u00fcy\u00fck s\u0131cakl\u0131k s\u0131\u00e7ramalar\u0131 ile b\u00fcy\u00fcr. Daha fazla \u0131s\u0131 de\u011fi\u015fimi, lehim ba\u011flant\u0131lar\u0131nda daha fazla hasar anlam\u0131na gelir.<\/p>\n<\/blockquote>\n<p>\u00d6n Is\u0131tma Sistemleri ve kontroll\u00fc so\u011futma kullanarak kusur olas\u0131l\u0131\u011f\u0131n\u0131 azalt\u0131r ve \u00fcr\u00fcnlerinizin daha uzun s\u00fcre dayanmas\u0131n\u0131 sa\u011flars\u0131n\u0131z.<\/p>\n<h2 id=\"preheatingsystems\">\u00d6n Is\u0131tma Sistemleri<\/h2>\n<h3 id=\"fluxactivation\">Ak\u0131 Aktivasyonu<\/h3>\n<p>Ak\u0131n\u0131n lehim pastas\u0131 i\u00e7inde \u00e7al\u0131\u015fmas\u0131n\u0131 sa\u011flaman\u0131z gerekir. <a href=\"https:\/\/www.chuxin-smt.com\/tr\/reflow-soldering-cooling-system-importance-optimization\/\">\u00d6n Is\u0131tma Sistemleri yard\u0131m\u0131<\/a> tahtay\u0131 yava\u015f\u00e7a \u0131s\u0131tarak. Bu ad\u0131m k\u00f6t\u00fc kimyasallardan kurtulmay\u0131 sa\u011flar. Ayr\u0131ca PCB'yi lehimleme i\u00e7in haz\u0131r hale getirir. E\u011fer \u00e7ok h\u0131zl\u0131 \u0131s\u0131t\u0131rsan\u0131z, flux i\u015fini yapamayabilir. Lehim iyi yap\u0131\u015fmayabilir.<\/p>\n<p><a href=\"https:\/\/www.smtneoden.com\/news\/how-to-optimize-smt-reflow-oven-process-parameters-to-improve-yield\/\">\u0130\u015fte iyi bir ak\u0131 aktivasyonu i\u00e7in \u00f6nemli ayarlar\u0131 i\u00e7eren bir tablo<\/a>:<\/p>\n<p>| Parameter         | Value Range                                         |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212;&#8211; | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212; |<br \/>\n| Temperature Range | Room Temperature \u2192 130\u2013190\u00b0C                        |<br \/>\n| Heating Rate      | 1\u20133\u00b0C\/s                                             |<br \/>\n| Function          | Remove solvents, preheat PCB, reduce thermal stress |<\/p>\n<p>D\u00fczenli bir \u00f6n \u0131s\u0131tma plan\u0131 flux i\u00e7indeki gazlardan kurtulmaya yard\u0131mc\u0131 olur. Bu, y\u00fczeyi temiz hale getirir ve lehimin daha iyi yap\u0131\u015fmas\u0131na yard\u0131mc\u0131 olur. Ayr\u0131ca levha boyunca e\u015fit \u0131s\u0131 elde edersiniz. Bu, her lehim ba\u011flant\u0131s\u0131n\u0131n do\u011fru \u015fekilde olu\u015fmas\u0131na yard\u0131mc\u0131 olur.<\/p>\n<h3 id=\"thermalshockreduction\">Termal \u015eok Azaltma<\/h3>\n<p>PCB'nizi ve par\u00e7alar\u0131n\u0131z\u0131 h\u0131zl\u0131 \u0131s\u0131 de\u011fi\u015fimlerinden korumak istersiniz. \u00d6n Is\u0131tma Sistemleri kart\u0131 ad\u0131m ad\u0131m \u0131s\u0131tman\u0131z\u0131 sa\u011flar. Bu yava\u015f \u0131s\u0131tma, kart\u0131n b\u00fck\u00fclmesini veya \u00e7atlamas\u0131n\u0131 \u00f6nler. \u00d6n \u0131s\u0131tmay\u0131 atlarsan\u0131z, karta veya par\u00e7alara zarar verebilirsiniz.<\/p>\n<ul>\n<li><a href=\"https:\/\/www.indium.com\/blog\/profiling-basics-reflow-phases\/\">\u00d6n \u0131s\u0131tma ak\u0131daki gazlardan kurtulmay\u0131 sa\u011flar<\/a>. \u0130yi bir lehimleme i\u00e7in bu gereklidir.<\/li>\n<li>PCB'ye gelen termal \u015foku azalt\u0131r. Bu, lehimleme s\u0131ras\u0131nda hasar\u0131 durdurur.<\/li>\n<li>Sabit bir \u00f6n \u0131s\u0131tma plan\u0131 e\u015fit \u0131s\u0131 sa\u011flar. Bu, g\u00fc\u00e7l\u00fc lehim ba\u011flant\u0131lar\u0131 i\u00e7in gereklidir.<\/li>\n<\/ul>\n<p>Is\u0131y\u0131 yava\u015f\u00e7a yakla\u015f\u0131k 175-180\u00b0C'ye y\u00fckseltmek en iyi sonucu verir. Saniyede 0,5-1\u00b0C'lik bir h\u0131zda ilerleyin. Bu \u015fekilde, b\u00fck\u00fclme veya so\u011fuk lehimleme gibi sorunlar\u0131n ortaya \u00e7\u0131kma olas\u0131l\u0131\u011f\u0131n\u0131 azalt\u0131rs\u0131n\u0131z.<\/p>\n<h3 id=\"solventevaporation\">Solvent Buharla\u015fmas\u0131<\/h3>\n<p>Lehim pastas\u0131 erimeden \u00f6nce i\u00e7indeki \u00e7\u00f6z\u00fcc\u00fclerden kurtulman\u0131z gerekir. \u00d6n Is\u0131tma Sistemleri \u015fu \u015fekilde yard\u0131mc\u0131 olur <a href=\"https:\/\/www.hvttec.com\/smt-solder-reflow-temperature-curve.html\">\u0131s\u0131y\u0131 150\u00b0C'ye yak\u0131n tutmak<\/a>. \u00c7ok h\u0131zl\u0131 \u0131s\u0131t\u0131rsan\u0131z, \u00e7\u00f6z\u00fcc\u00fcler i\u00e7eride kalabilir. Bu da kabarc\u0131klar veya zay\u0131f ba\u011flant\u0131lar olu\u015fturabilir. Saniyede 1,5\u00b0C ile 3\u00b0C aras\u0131nda \u0131s\u0131tma iyi sonu\u00e7 verir.<\/p>\n<p><a href=\"https:\/\/www.obsmt.com\/reflow-soldering-temperature-curve\/\">\u00d6n \u0131s\u0131tma b\u00f6lgesi oda s\u0131cakl\u0131\u011f\u0131nda ba\u015flar ve yakla\u015f\u0131k 150\u00b0C'ye kadar \u00e7\u0131kar<\/a>. Bu yava\u015f y\u00fckselme, su ve \u00e7\u00f6z\u00fcc\u00fclerin g\u00fcvenli bir \u015fekilde ayr\u0131lmas\u0131n\u0131 sa\u011flar. Par\u00e7alar\u0131n\u0131z, \u00e7ipler gibi, strese girmeden \u0131s\u0131ya al\u0131\u015fabilir. <a href=\"https:\/\/www.tecooems.com\/info\/temperature-for-smt-reflow-soldering-95617422.html\">Is\u0131tma h\u0131z\u0131n\u0131n saniyede 2\u00b0C'nin alt\u0131nda tutulmas\u0131<\/a> termal stresi durdurmaya yard\u0131mc\u0131 olur ve par\u00e7alar\u0131 g\u00fcvende tutar.<\/p>\n<blockquote>\n<p><strong>\u0130pucu:<\/strong> Her zaman yava\u015f\u00e7a \u0131s\u0131t\u0131n. Bu, par\u00e7alar\u0131n\u0131z\u0131 lehimlemeye haz\u0131r hale getirir ve PCB'nin b\u00fck\u00fclme olas\u0131l\u0131\u011f\u0131n\u0131 azalt\u0131r.<\/p>\n<\/blockquote>\n<h2 id=\"coolingsystems\">So\u011futma Sistemleri<\/h2>\n<h3 id=\"controlledcooling\">Kontroll\u00fc So\u011futma<\/h3>\n<p>Levhalar\u0131n\u0131z\u0131 do\u011fru h\u0131zda so\u011futmal\u0131s\u0131n\u0131z. Kontroll\u00fc so\u011futma \u00e7atlaklar\u0131 ve zay\u0131f ba\u011flant\u0131lar\u0131 \u00f6nler. \u00c7ok h\u0131zl\u0131 so\u011futma par\u00e7alar\u0131 \u00e7arpabilir ve k\u0131rabilir. \u00c7ok yava\u015f so\u011futma ise lehim ba\u011flant\u0131lar\u0131n\u0131n mat g\u00f6r\u00fcnmesine neden olabilir. So\u011futma h\u0131z\u0131 her lehim ala\u015f\u0131m\u0131 i\u00e7in \u00f6nemlidir. A\u015fa\u011f\u0131daki tablo en iyi so\u011futma h\u0131zlar\u0131n\u0131 g\u00f6stermektedir:<\/p>\n<p>| Cooling Rate (\u00b0C\/s) | Effect on Solder Joint                    |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;- | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8211; |<br \/>\n| 3\u20136                 | Stops big grains and dull joints          |<br \/>\n| 2\u20134                 | Cuts down stress cracks and IMC thickness |<br \/>\n| ~4                 | Best for fine-grain structure             |<\/p>\n<p>A steady cooling rate keeps solder joints strong and smooth. You should keep the cooling system clean and working well. This helps stop <a href=\"https:\/\/www.chuxin-smt.com\/tr\/why-the-cooling-zone-matters-in-reflow-ovens\/\">uneven cooling<\/a> and thermal shock.<\/p>\n<h3 id=\"solderjointsolidification\">Lehim Ba\u011flant\u0131s\u0131 Kat\u0131la\u015fmas\u0131<\/h3>\n<p>Lehim ba\u011flant\u0131lar\u0131n\u0131n do\u011fru \u015fekilde sertle\u015fmesini istersiniz. <a href=\"https:\/\/www.jarnistech.com\/pcb-soldering\">Kontroll\u00fc so\u011futma, lehimin ince taneli bir yap\u0131 olu\u015fturmas\u0131n\u0131 sa\u011flar.<\/a> Bu, ba\u011flant\u0131lar\u0131 daha g\u00fc\u00e7l\u00fc ve \u00e7atlama olas\u0131l\u0131\u011f\u0131n\u0131 daha d\u00fc\u015f\u00fck hale getirir. So\u011futma h\u0131z\u0131n\u0131 y\u00f6netmek k\u0131r\u0131lgan metaller aras\u0131 bile\u015fiklerin olu\u015fmas\u0131n\u0131 engeller. \u0130\u015fte kontroll\u00fc so\u011futman\u0131n lehim ba\u011flant\u0131lar\u0131 i\u00e7in ne yapt\u0131\u011f\u0131:<\/p>\n<ul>\n<li>Mikro yap\u0131y\u0131 daha iyi hale getirir, b\u00f6ylece daha az mikro \u00e7atlak olur.<\/li>\n<li>K\u0131r\u0131lgan metaller aras\u0131 bile\u015fikleri s\u0131n\u0131rlar, b\u00f6ylece \u00e7atlaklar yay\u0131lmaz.<\/li>\n<\/ul>\n<p>\u00c7ok h\u0131zl\u0131 so\u011futursan\u0131z \u00e7atlaklar veya zay\u0131f noktalar olu\u015fabilir. \u00c7ok yava\u015f so\u011futmak eklemleri \u00e7ok yumu\u015fak hale getirebilir.<\/p>\n<h3 id=\"reliabilityenhancement\">G\u00fcvenilirlik \u0130yile\u015ftirme<\/h3>\n<p>\u00dcr\u00fcnlerinizin daha uzun s\u00fcre dayanmas\u0131n\u0131 ve daha iyi \u00e7al\u0131\u015fmas\u0131n\u0131 istersiniz. <a href=\"https:\/\/www.chuxin-smt.com\/tr\/reflow-soldering-cooling-system-importance-optimization\/\">\u0130yi so\u011futma sistemi tasar\u0131m\u0131<\/a> bunu yapman\u0131za yard\u0131mc\u0131 olur. Bak\u0131ml\u0131 bir so\u011futma sistemi \u00e7atlaklar\u0131, delaminasyonu ve termal \u015foku \u00f6nler. D\u00fczenli kontroller ve ger\u00e7ek zamanl\u0131 izleme sistemin do\u011fru \u00e7al\u0131\u015fmas\u0131n\u0131 sa\u011flar. A\u015fa\u011f\u0131daki tabloda se\u00e7imlerinizin g\u00fcvenilirli\u011fi nas\u0131l etkiledi\u011fi g\u00f6sterilmektedir:<\/p>\n<p>| <a href=\"https:\/\/www.tortai-tech.com\/common-reflow-oven-failures-and-their-impact-on-electronics-manufacturing\/\">So\u011futma Sistemi Tasar\u0131m Se\u00e7imlerinin Etkisi<\/a> | Prevention Tips                                                                                                    | Consequences                        |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;- | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212; | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8211; |<br \/>\n| Stops thermal shock and uneven cooling                                                                                                            | <a href=\"https:\/\/www.chuxin-smt.com\/tr\/products\/automatic-cooling-buffer-stocker\/\">So\u011futma sistemini temiz tutun<\/a> and working | More damage and failures            |<br \/>\n| Cuts down cracks and delamination                                                                                                                 | Check for water blockages often                                                                                    | Costly rework and product rejection |<br \/>\n| Make sure solder joints harden properly                                                                                                           | Watch furnace temperature in real time                                                                             |                                     |<\/p>\n<blockquote>\n<p><strong>\u0130pucu:<\/strong> So\u011futma sisteminizde t\u0131kan\u0131kl\u0131k veya kir olup olmad\u0131\u011f\u0131n\u0131 her zaman kontrol edin. Temiz sistemler, maliyetli onar\u0131mlardan ka\u00e7\u0131nman\u0131za ve panolar\u0131n\u0131z\u0131 g\u00fc\u00e7l\u00fc tutman\u0131za yard\u0131mc\u0131 olur.<\/p>\n<\/blockquote>\n<h2 id=\"bestpractices\">En \u0130yi Uygulamalar<\/h2>\n<h3 id=\"temperatureprofiling\">S\u0131cakl\u0131k Profili Olu\u015fturma<\/h3>\n<p>G\u00fc\u00e7l\u00fc lehim ba\u011flant\u0131lar\u0131 i\u00e7in iyi bir s\u0131cakl\u0131k profiline ihtiyac\u0131n\u0131z vard\u0131r. Bu ayn\u0131 zamanda g\u00fcvenilir PCB'ler yapman\u0131za da yard\u0131mc\u0131 olur. \u00d6ncelikle f\u0131r\u0131n\u0131n\u0131z\u0131n s\u0131cakl\u0131\u011f\u0131n\u0131 kulland\u0131\u011f\u0131n\u0131z yap\u0131\u015ft\u0131r\u0131c\u0131 veya kaplama ile e\u015fle\u015ftirin. Konvey\u00f6r h\u0131z\u0131n\u0131 de\u011fi\u015ftirin, b\u00f6ylece her montaj yeterli \u0131s\u0131 al\u0131r. Kullanmay\u0131 deneyin <a href=\"https:\/\/kicthermal.com\/article-paper\/best-practices-reflow-profiling-for-lead-free-smt-assembly\/\">ramp-soak-spike (RSS) veya ramp-to-spike (RTS)<\/a> profiller. Bu y\u00f6ntemler \u0131s\u0131n\u0131n levhalar\u0131n\u0131za e\u015fit olarak yay\u0131lmas\u0131na yard\u0131mc\u0131 olur. Ayr\u0131ca yast\u0131k ba\u015f\u0131 veya bo\u015fluklar gibi sorunlar\u0131n ortaya \u00e7\u0131kma olas\u0131l\u0131\u011f\u0131n\u0131 da azalt\u0131rlar.<\/p>\n<p>| Best Practice                                                                                                          | Description                                                    |<br \/>\n| &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;- | &#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8212;&#8211; |<br \/>\n| <a href=\"https:\/\/www.smtfactory.com\/Exploring-The-Benefits-of-SMT-Curing-Ovens-id66425007.html\">Optimum S\u0131cakl\u0131k Profili Olu\u015fturma<\/a> | Make profiles for each adhesive or coating to get good curing. |<br \/>\n| Conveyor Speed Optimization                                                                                            | Change speed for different assemblies to keep quality even.    |<br \/>\n| Regular Maintenance Protocols                                                                                          | Check heating parts and sensors often for best results.        |<\/p>\n<blockquote>\n<p><strong>\u0130pucu:<\/strong> F\u0131r\u0131n\u0131n\u0131z\u0131n s\u0131cakl\u0131\u011f\u0131n\u0131 farkl\u0131 yerlerde kontrol etmek i\u00e7in bir termal profilleyici kullan\u0131n. Bu, sorun yaratmadan \u00f6nce s\u0131cak veya so\u011fuk noktalar\u0131 bulman\u0131za yard\u0131mc\u0131 olur.<\/p>\n<\/blockquote>\n<h3 id=\"calibration\">Kalibrasyon<\/h3>\n<p>S\u0131cakl\u0131\u011f\u0131 do\u011fru tutmak i\u00e7in f\u0131r\u0131n\u0131n\u0131z\u0131 kalibre etmelisiniz. \u00d6nemli noktalara test PCB'si \u00fczerine termokupllar yerle\u015ftirin. Kart f\u0131r\u0131ndan ge\u00e7erken s\u0131cakl\u0131\u011f\u0131 kaydetmek i\u00e7in bir profilleyici ba\u011flay\u0131n. Hedef termal profilinizi ayarlay\u0131n ve f\u0131r\u0131n\u0131 \u00e7al\u0131\u015ft\u0131r\u0131n. Okumalar\u0131 izleyin. S\u0131cak veya so\u011fuk noktalar g\u00f6r\u00fcrseniz, hava ak\u0131\u015f fanlar\u0131n\u0131 veya konvey\u00f6r h\u0131z\u0131n\u0131 de\u011fi\u015ftirin. Is\u0131 her yerde e\u015fit olana kadar testi tekrar yap\u0131n. \u0130yi g\u00f6r\u00fcnd\u00fcklerinden emin olmak i\u00e7in lehim ba\u011flant\u0131lar\u0131n\u0131 kontrol edin.<\/p>\n<ol>\n<li>Termokupllar\u0131 bir test PCB'sine yerle\u015ftirin.<\/li>\n<li>Profilleyiciyi ba\u011flay\u0131n ve verileri kaydedin.<\/li>\n<li>Hedef profilinizi belirleyin.<\/li>\n<li>F\u0131r\u0131n\u0131 \u00e7al\u0131\u015ft\u0131r\u0131n ve de\u011ferleri izleyin.<\/li>\n<li>Gerekirse hava ak\u0131\u015f\u0131n\u0131 veya konvey\u00f6r h\u0131z\u0131n\u0131 de\u011fi\u015ftirin.<\/li>\n<li>Is\u0131 e\u015fitlenene kadar tekrarlay\u0131n.<\/li>\n<li>Lehim ba\u011flant\u0131lar\u0131n\u0131 kalite a\u00e7\u0131s\u0131ndan kontrol edin.<\/li>\n<\/ol>\n<p>Yapmal\u0131s\u0131n <a href=\"https:\/\/www.smtfactory.com\/reflow-oven-calibration-how-often-and-how-to-do-it-right.html\">f\u0131r\u0131n\u0131n\u0131z\u0131 ayda en az bir kez kalibre edin<\/a>. Bu, s\u0131cakl\u0131k kaymas\u0131n\u0131n sorunlara neden olmas\u0131n\u0131 \u00f6nler.<\/p>\n<h3 id=\"maintenance\">Bak\u0131m<\/h3>\n<p>Yapman\u0131z gereken <a href=\"https:\/\/www.chuxin-smt.com\/tr\/maintain-selective-wave-soldering-nozzles-cleaning-inspection\/\">f\u0131r\u0131n\u0131n\u0131z\u0131 temiz tutun<\/a> ve iyi \u00e7al\u0131\u015f\u0131yor. Lehim ve flux art\u0131klar\u0131n\u0131 s\u0131k s\u0131k temizleyin. Sens\u00f6rleri ve kontrol \u00fcnitelerini d\u00fczenli olarak kalibre edin. Is\u0131tma par\u00e7alar\u0131nda ve sens\u00f6rlerde hasar olup olmad\u0131\u011f\u0131na bak\u0131n. A\u015f\u0131nm\u0131\u015f g\u00f6r\u00fcnen par\u00e7alar\u0131 de\u011fi\u015ftirin.<\/p>\n<ul>\n<li><a href=\"https:\/\/roadmap.inemi.org\/ir\/smt-reflow\">Kal\u0131nt\u0131 birikmesini \u00f6nlemek i\u00e7in f\u0131r\u0131n\u0131 temizleyin<\/a>.<\/li>\n<li>Sens\u00f6rleri ve kontrol\u00f6rleri s\u0131k s\u0131k kalibre edin.<\/li>\n<li>A\u015f\u0131nm\u0131\u015f \u0131s\u0131tma par\u00e7alar\u0131n\u0131 ve sens\u00f6rleri kontrol edin ve de\u011fi\u015ftirin.<\/li>\n<\/ul>\n<blockquote>\n<p><strong>Not:<\/strong> E\u015fit olmayan \u0131s\u0131tma veya so\u011futma g\u00f6r\u00fcrseniz, hava ak\u0131\u015f sisteminde t\u0131kan\u0131kl\u0131k veya kir olup olmad\u0131\u011f\u0131na bak\u0131n. Bu sorunlar\u0131 erkenden gidermek daha b\u00fcy\u00fck sorunlar\u0131 \u00f6nleyebilir ve \u00fcretiminizin iyi \u00e7al\u0131\u015fmas\u0131n\u0131 sa\u011flayabilir.<\/p>\n<\/blockquote>\n<p>Kulland\u0131\u011f\u0131n\u0131zda daha g\u00fc\u00e7l\u00fc lehim ba\u011flant\u0131lar\u0131 ve daha uzun \u00f6m\u00fcrl\u00fc PCB'ler elde edersiniz <a href=\"https:\/\/www.chuxin-smt.com\/tr\/reflow-soldering-cooling-system-importance-optimization\/\">iyi \u00f6n \u0131s\u0131tma ve so\u011futma sistemleri<\/a>. Bu sistemler yayg\u0131n sorunlar\u0131 durdurmaya ve i\u015finizi daha h\u0131zl\u0131 yapmaya yard\u0131mc\u0131 olur. Her \u015feyin iyi \u00e7al\u0131\u015fmas\u0131n\u0131 sa\u011flamak i\u00e7in a\u015fa\u011f\u0131daki ad\u0131mlar\u0131 uygulay\u0131n: S\u0131cakl\u0131k profillerinizi s\u0131k s\u0131k kontrol edin. F\u0131r\u0131n\u0131n\u0131z\u0131 temizleyin ve d\u00fczenli olarak kalibre edin. D\u00fczensiz \u0131s\u0131tma veya so\u011futma belirtileri olup olmad\u0131\u011f\u0131na bak\u0131n.<\/p>\n<blockquote>\n<p>Unutmay\u0131n: \u0130yi bir termal y\u00f6netim, \u00fcr\u00fcnlerinizin g\u00fcvenilir kalmas\u0131na yard\u0131mc\u0131 olur ve hatt\u0131n\u0131z\u0131n sorunsuz \u00e7al\u0131\u015fmas\u0131n\u0131 sa\u011flar. Sisteminizdeki de\u011fi\u015fikliklere her zaman dikkat edin.<\/p>\n<\/blockquote>\n<h2 id=\"faq\">SSS<\/h2>\n<h3 id=\"whathappensifyouskippreheatinginansmtcuringoven\">Bir SMT k\u00fcrleme f\u0131r\u0131n\u0131nda \u00f6n \u0131s\u0131tmay\u0131 atlarsan\u0131z ne olur?<\/h3>\n<p>PCB'nize ve par\u00e7alar\u0131n\u0131za zarar verme riskiniz vard\u0131r. \u00d6n \u0131s\u0131tman\u0131n atlanmas\u0131 termal \u015foka neden olabilir. Bu da \u00e7atlaklara, lehim kusurlar\u0131na veya zay\u0131f ba\u011flant\u0131lara yol a\u00e7abilir. Kartlar\u0131n\u0131z\u0131 korumak i\u00e7in her zaman \u00f6n \u0131s\u0131tmay\u0131 kullan\u0131n.<\/p>\n<h3 id=\"howoftenshouldyoucalibrateyoursmtcuringoven\">SMT k\u00fcrleme f\u0131r\u0131n\u0131n\u0131z\u0131 ne s\u0131kl\u0131kla kalibre etmelisiniz?<\/h3>\n<p>F\u0131r\u0131n\u0131n\u0131z\u0131 ayda en az bir kez kalibre etmelisiniz. D\u00fczenli kalibrasyon, s\u0131cakl\u0131k profillerinizin do\u011fru olmas\u0131n\u0131 sa\u011flar. Bu, hatalar\u0131 \u00f6nlemenize yard\u0131mc\u0131 olur ve \u00fcretim hatt\u0131n\u0131z\u0131n sorunsuz \u00e7al\u0131\u015fmas\u0131n\u0131 sa\u011flar.<\/p>\n<h3 id=\"whydoescoolingspeedmatterforsolderjoints\">So\u011futma h\u0131z\u0131 lehim ba\u011flant\u0131lar\u0131 i\u00e7in neden \u00f6nemlidir?<\/h3>\n<p>So\u011futma h\u0131z\u0131 lehim ba\u011flant\u0131lar\u0131n\u0131n nas\u0131l olu\u015ftu\u011funu kontrol eder. E\u011fer \u00e7ok h\u0131zl\u0131 so\u011futursan\u0131z, \u00e7atlaklar veya zay\u0131f noktalar olu\u015fabilir. \u00c7ok yava\u015f so\u011futursan\u0131z, ba\u011flant\u0131lar matla\u015fabilir veya zay\u0131flayabilir. En iyi sonu\u00e7lar i\u00e7in sabit bir so\u011futma h\u0131z\u0131n\u0131 hedefleyin.<\/p>\n<h3 id=\"canyouusethesametemperatureprofileforallpcbs\">T\u00fcm PCB'ler i\u00e7in ayn\u0131 s\u0131cakl\u0131k profilini kullanabilir misiniz?<\/h3>\n<p>Hay\u0131r, her kart i\u00e7in ayn\u0131 profili kullanmamal\u0131s\u0131n\u0131z. Farkl\u0131 PCB'ler ve bile\u015fenler farkl\u0131 \u0131s\u0131 ayarlar\u0131na ihtiya\u00e7 duyar. Her montaj i\u00e7in daima \u00f6zel bir s\u0131cakl\u0131k profili olu\u015fturun.<\/p>\n<h3 id=\"whatsignsshowyourcoolingsystemneedsmaintenance\">So\u011futma sisteminizin bak\u0131ma ihtiyac\u0131 oldu\u011funu g\u00f6steren i\u015faretler nelerdir?<\/h3>\n<blockquote>\n<p>D\u00fczensiz so\u011futma, kir birikmesi veya t\u0131kal\u0131 hava ak\u0131\u015f\u0131 olup olmad\u0131\u011f\u0131na bak\u0131n. Daha fazla kusur veya zay\u0131f lehim ba\u011flant\u0131lar\u0131 g\u00f6r\u00fcrseniz, so\u011futma sisteminizi kontrol edin. Kartlar\u0131n\u0131z\u0131 g\u00fc\u00e7l\u00fc tutmak i\u00e7in temizleyin ve bak\u0131m\u0131n\u0131 yap\u0131n.<\/p>\n<\/blockquote>","protected":false},"excerpt":{"rendered":"<p>SMT k\u00fcrleme f\u0131r\u0131nlar\u0131ndaki \u00f6n \u0131s\u0131tma sistemleri termal \u015foku azalt\u0131r, lehim ba\u011flant\u0131 kalitesini iyile\u015ftirir ve kontroll\u00fc \u0131s\u0131tma ve so\u011futma ile PCB g\u00fcvenilirli\u011fini art\u0131r\u0131r.<\/p>","protected":false},"author":1,"featured_media":3067,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"categories":[1,52],"tags":[90,66,61],"class_list":["post-3061","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-company-news","category-product-information","tag-smt-curing-ovens","tag-smt-equipment","tag-smt-solution"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.chuxin-smt.com\/tr\/wp-json\/wp\/v2\/posts\/3061","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.chuxin-smt.com\/tr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.chuxin-smt.com\/tr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/tr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/tr\/wp-json\/wp\/v2\/comments?post=3061"}],"version-history":[{"count":0,"href":"https:\/\/www.chuxin-smt.com\/tr\/wp-json\/wp\/v2\/posts\/3061\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/tr\/wp-json\/wp\/v2\/media\/3067"}],"wp:attachment":[{"href":"https:\/\/www.chuxin-smt.com\/tr\/wp-json\/wp\/v2\/media?parent=3061"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/tr\/wp-json\/wp\/v2\/categories?post=3061"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.chuxin-smt.com\/tr\/wp-json\/wp\/v2\/tags?post=3061"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}