Fours de refusion

We provide reflow oven for all types of PCBA assembly, from prototyping to high-volume. Accurate, high quality full convection reflow oven for PCBA electronics assembly

The reflow oven is a critical piece of equipment in the modern electronics manufacturing (SMT) process.

Its core function is to create reliable electrical interconnections. Through a precisely controlled heating process, it melts the solder paste previously applied to the PCB pads, securely welding the pins or terminals of the surface-mounted components to the PCB.A standard reflow process is typically divided into four key stages: the Preheat Zone, Soak Zone (or Heating Zone), Reflow Zone (or Welding Zone), and Cooling Zone. S&M Chuxin’s VS Series reflow ovens are engineered to ensure every solder joint is perfect and reliable through superior thermal uniformity, efficient heat compensation, and intelligent temperature control

Understanding the Heart of SMT

A reflow oven is a key machine in the Surface Mount Technology (SMT) line. Its primary job is to use a precise heating and cooling sequence, known as a “thermal profile,” to melt solder paste. This process creates strong, reliable electrical bonds between electronic components and the Printed Circuit Board (PCB).

The Four Critical Stages of the Reflow Soldering Profile

This thermal profile is divided into four distinct zones, each with a specific function.

1. Preheat Zone

Purpose: Gradually raises the assembly’s temperature.
Key Actions:
- Prevents thermal shock (cracking) to sensitive components.
- Safely evaporates volatile solvents from the solder paste.

2. Soak (Thermal Stabilization) Zone

Purpose: Equalizes the temperature across the entire board.
Key Actions:
- Ensures large and small components reach a uniform temperature.
- Activates the flux, which cleans the surfaces for soldering.

Learn More: Guide détaillé du profil de reflux

3. Reflow (Time Above Liquidus) Zone

Purpose: The peak temperature stage where soldering happens.
Key Actions:
- The oven temperature rises above the solder’s melting point.
- Molten solder “wets” the component leads and PCB pads, forming the permanent joint.

Learn More: Comment définir le profil de température d'un four de refusion pour une meilleure soudure

4. Cooling Zone

Purpose: Rapidly and in a controlled manner, cools the assembly to solidify the solder.
Key Actions:
- A fast cooling rate (e.g., 3-6°C per second) is critical for a strong, fine-grain joint structure.
- S&M ovens use high-efficiency top and bottom convection for optimal cooling.

Learn More:  Guide complet de la zone de refroidissement du four de refusion

Soudure par refusion sous vide

Four de refusion à air chaud à azote sans plomb de la série VS

Four de refusion à air chaud sans plomb de la série VS/DS

S&M Reflow Soldering Solutions (VS Series)

Aspect technique

Spécification du produit 100%

Paramètres techniques 100%

Vidéo dynamique 100%

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