30 July, 2026

Solder paste deposition causes 60 to 90 percent of all SMT reflow defects, making the right inspection tool critical for quality-conscious manufacturers. This guide breaks down the main SPI equipment categories, evaluation criteria, and how to match the right system to your production reality—whether you’re running high-volume automotive lines or engineering NPI work. The key? No vendor spec sheet replaces hands-on testing with your actual boards.

Even years after lead-free solder became mandatory, confusion still runs high in production facilities. This guide cuts through the myths to explain what “lead-free” actually means under RoHS regulations, why SAC305 demands tighter process control than traditional tin-lead, and which defects to watch for. Whether you’re running consumer electronics or aerospace assemblies, the practical setup and equipment insights here help you run a stable lead-free wave soldering process in 2026.