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Application of S&M SMT equipment in the semiconductor field
1) The trend of combining semiconductor packaging with SMT
2) The role of SMT equipment in the production of advanced packaging and test substrates
3) Extremely high demands on precision and temperature control
4) Our equipment solutions: temperature-controlled reflow oven, intelligent transmission equipment
5) Industry certification and typical cooperation cases
The trend of combining semiconductor packaging with SMT
With the rapid development of AI, high-performance computing, and the Internet of Things (IoT), semiconductor packaging is evolving from traditional single-chip packaging to system-in-package (SiP), multi-chip stacking, and high-density interconnect substrates.
Global semiconductor giants such as NVIDIA and Intel require high-precision, high-efficiency SMT process support in advanced packaging and substrate production to achieve high-reliability placement of complex chip modules.
S&M, with years of experience in the SMT equipment field, provides semiconductor manufacturers with full-process support from soldering to intelligent transmission, helping them maintain global leadership in next-generation packaging technologies.
The role of SMT equipment in the production of advanced packaging and test substrates
In the semiconductor manufacturing process, SMT equipment is not only used to produce package substrates, but also to test substrates and assemble functional modules.
These practices have proven that S&M equipment plays a core role in advanced packaging and substrate production, providing customers with efficient and stable electronics manufacturing capabilities.
Extremely high demands on precision and temperature control
Semiconductor packaging places extremely high demands on placement accuracy and soldering temperature control. Fine-pitch BGA, CSP, and QFN packages require placement within ±0.02mm accuracy, while reflow temperatures must be precisely controlled within the process profile to ensure solder joint reliability.
In high-end chip module projects for Intel and NVIDIA, S&M equipment utilizes precision servo control and PID closed-loop temperature control to ensure consistency and traceability for each substrate during multi-layer soldering processes, providing process assurance for mass production of high-performance chips.
Our equipment solutions: temperature-controlled reflow oven, intelligent transmission equipment
S&M provides professional complete-line solutions for the complex process requirements of the semiconductor industry:
Intelligent peripheral equipment: including loaders and unloaders, buffers, and docking stations, ensuring smooth production lines and a high degree of automation.
Industry certification and typical cooperation cases
S&M equipment is widely used in global semiconductor manufacturing and complies with numerous international quality and industry standards (such as ISO 9001, CE certification, and ESD protection requirements), ensuring that customer production lines meet high-end manufacturing standards.
NVIDIA’s high-performance computing module production utilizes S&M’s high-precision SMT production lines, enabling stable production of large-scale GPU modules.
Leveraging its deep partnerships with the semiconductor industry and its reliable equipment performance, S&M continues to help customers meet the challenges of the advanced packaging and high-performance computing markets and will support even more high-end semiconductor manufacturing needs in the future.
Application Value
Application value: By improving production line automation, reducing defect rates, and supporting flexible production expansion, S&M helps customers maintain a competitive advantage in the global smart hardware market.