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Wave Soldering Machine Operation Guide

Wave Soldering Machine Operation Guide

You use a wave soldering machine by following simple steps. These steps help keep you and your work safe. Always wear safety gear like gloves and eye protection. This stops injuries from hot solder, lead, and chemicals. First, clean the machine. Then turn it on. Set the right settings. Put on flux. Preheat the PCB. Watch out for dangers like solder balls or fire. After soldering, let the boards cool. Clean them. Check your work. Regular care keeps the wave soldering process safe and steady.

Key Takeaways

  • Always wear safety gear like gloves, eye protection, and masks. This keeps you safe from burns and fumes.

  • Clean and check the machine every day. This helps it work well and stops problems in your soldering.

  • Set the right temperature, conveyor speed, and wave height. Choose these based on your PCB and solder type. This makes strong and clean joints.

  • Use the right amount of flux and preheat the PCB the right way. This helps the solder flow well and stops damage.

  • Look at solder joints closely after soldering. Keep good records to keep quality high and find problems early.

Overview

What Is Wave Soldering

Wave soldering connects electronic parts to PCBs in large groups. The PCB moves over a pan filled with melted solder. The solder makes a wave shape. When the board touches the wave, the solder sticks to the board. Wave soldering is mostly for through-hole parts. It can also work for surface-mount parts glued to the PCB first.

Wave soldering is different from other ways to solder. Reflow soldering melts solder paste with hot air in an oven. Wave soldering is better for bigger parts and stronger connections. Factories use wave soldering a lot because it is fast and saves money. This process stops the PCB from bending and makes strong joints.

Tip: Always check the temperature and how the board is placed before you start. This helps you stop mistakes and makes sure the parts connect well.

Aspect

Wave Soldering

Reflow Soldering

Core Process

Uses a wave of molten solder to solder PCBs

Uses hot air in a multi-zone oven to reflow solder paste

Speed and Cost

Faster and more affordable for mass production

Slower and more expensive for large runs

Suitability

Best for through-hole and large components

Best for surface mount and high-density boards

Prevalence

Less common, mainly for through-hole soldering

Most common for SMT assembly

Applications

Wave soldering is used in many fields. Companies use it for electronics in homes, cars, phones, planes, and defense. It is also used in medical tools and machines in factories. LED lights are made with wave soldering. Car makers use it for car systems, engines, and radios.

Wave soldering is best for through-hole technology and DIP assemblies. It also helps with mixed PCBs that have both THT and SMT parts. Power electronics and car systems require strong joints, so wave soldering is chosen. Big factories use this process for fast and steady work.

  • Common uses:

    • Consumer electronics

    • Automotive systems

    • Telecommunications

    • Aerospace and defense

    • Medical devices

    • LED lighting panels

Safety & Prep

Before you begin, ensure you prioritize safety and preparation. This step keeps you safe and helps your work go smoothly.

PPE

Personal protective equipment (PPE) protects you from burns, fumes, and chemicals. Always wear safety glasses with side shields to guard your eyes. Heat-resistant gloves keep your hands safe from hot surfaces and molten solder. If you work with chemicals like flux, use a mask or respirator. Wear long sleeves and closed shoes to protect your skin. Keep a first aid kit nearby in case of burns or small injuries.

Tip: Wash your hands well after soldering. This removes any lead or chemical residue.

Workspace Setup

A clean and organized workspace helps you work faster and more safely. Follow these steps to set up your area:

  1. Clean your workbench and remove dust or debris.

  2. Place a heat-resistant mat on the table.

  3. Use an ESD-safe mat to prevent static damage to components.

  4. Arrange your tools and parts neatly. Use holders or vices to keep PCBs steady.

  5. Make sure all tools are clean and free from old solder or residue.

  6. Keep soldering irons on their stands when not in use.

  7. Turn off and unplug equipment when you finish.

You should also control the amount of flux you use. Too much flux can leave residue, while too little can cause poor joints. Choose the right method for applying flux, such as spraying or using foam.

Machine Inspection

Check your wave soldering machine before you power it on. Look for any loose wires or damaged parts. Clean the heater and reflector plates to remove old solder or dirt. This step helps the machine heat evenly and prevents defects. Make sure the solder pot is clean and filled to the correct level. Inspect the conveyor and wave nozzles for blockages. Confirm that all safety guards are in place. Only start the machine when everything looks ready.

Note: Regular checks and cleaning keep your machine running well and help you avoid costly repairs.

Power & Preheat

Main Power On

You must follow a safe procedure when you power on the machine. Start by inspecting every part for damage or loose connections. Check the power cords and make sure all components are tight. Confirm that the power supply works and that the tin bar and flux storage are ready. Clean the tin furnace and make sure it is filled to the correct level. Use this step-by-step process:

  1. Inspect all machine parts for damage or loose wires.

  2. Verify the power supply and check the tin bar and flux storage.

  3. Make sure all equipment parts are installed and tightened.

  4. Turn on the main power switch.

  5. Switch on the tin furnace heating and watch the temperature display.

  6. Fill the flux tank when the tin furnace reaches the set temperature.

  7. Adjust air pressure and flow rate for the spray tank.

  8. Set the conveyor speed and opening width for your board size.

  9. Start the process and monitor for strange sounds or smells.

  10. Keep checking and cleaning the machine during use.

Tip: Always shut down the machine if you notice abnormal temperature or sounds.

Preheat Duration

Preheating prepares the PCB and activates the flux. You need to set the right temperature and time based on the board thickness and flux type. Thin boards (less than 0.8mm) need about 30–60 seconds. Thick boards (more than 1.6mm) or high-density designs need 60–90 seconds. Keep the preheat temperature between 105°C and 145°C. This range helps activate the flux and prevents thermal shock. Use multi-zone heaters and control the ramp rate to avoid overheating sensitive parts.

  • Thin PCBs: 30–60 seconds

  • Thick PCBs or high-density: 60–90 seconds

  • Preheat temperature: 105–145°C

  • Ramp rate: 1–3°C per second

Note: Lead-free soldering needs slower conveyor speeds and longer contact times for better wetting.

Solder Pot Temp

You must set the solder pot temperature according to the solder type. Leaded solder works best between 250°C and 270°C. Lead-free solder needs a higher range, between 260°C and 290°C. Use the table below to check the optimal temperature for your process.

Solder Type

Optimal Solder Pot Temperature Range

Leaded (Tin-Lead)

250–270°C

Lead-Free

260–290°C

Monitor the temperature display often. If the temperature goes outside the range, stop the process and check the machine.

Always keep the solder pot clean to ensure good solder flow and joint quality.

Setup

Solder & Flux Loading

You must put solder and flux in the machine first. Check the solder pot to see if it is clean. Make sure there is enough solder inside. Use a thermometer to check the temperature. The temperature should match what the maker says. If you use lead-free solder, set the temperature higher. Get the flux ready next. Machines can help spread flux evenly. Look at the spray or foam fluxer settings before you start. Change the amount so every PCB gets covered. Too much flux leaves sticky stuff behind. Too little flux makes weak joins. Bake PCBs or parts if they are wet.

Tip: Watch the solder pot and flux levels while you work. This stops problems and keeps things running well.

Conveyor Alignment

Good conveyor alignment helps PCBs move smoothly. Find the tension adjustment part near the motor or pulley. Use a gauge to check how tight the belt is. Change the tension to match what the maker says. This helps the conveyor work properly. Set the guide rails to fit your PCB size. Run a test board through the conveyor. Watch how it moves and look for problems. If you see issues, fix the rails or tension again. Check and change tension often for different loads or room changes. Keep extra springs or screws nearby for quick repairs.

  1. Find the tension adjustment part.

  2. Check how tight the belt is.

  3. Change tension if needed.

  4. Set rails for PCB size.

  5. Test with a sample PCB.

Note: Good conveyor alignment stops mistakes and keeps boards moving at the right speed.

Control Panel Settings

Set up the control panel before you start. Check the nozzle-sprayfluxer setting to match the conveyor speed. This helps put flux on the board the right way. Change preheater settings so the PCB gets hot enough. Watch the top of the board to protect the parts. Use tools to check how long the board stays in each spot. Keep the heat difference between preheat and solder under 100°C. Use alarms and auto-stop features to catch problems. Set the solder wave height so it does not spill or miss spots. Use nitrogen if you have it to help solder flow. Keep the controls easy to use.

  • Check the fluxer and conveyor speed.

  • Change the preheater and solder wave height.

  • Watch the board for heat and time.

  • Use alarms to control the process.

  • Keep the board flat and clean.

Tip: Real-time checks make setup faster and help keep quality steady.

Wave Soldering Parameters

Temperature

You need to set the right temperature for wave soldering. The temperature depends on the type of PCB and solder you use. If you use lead-based solder, keep the solder wave between 245°C and 255°C. Lead-free solder needs a higher range, from 260°C to 270°C. Preheat the PCB before it touches the solder wave. This step helps prevent thermal shock and improves how the solder sticks to the board. Some PCBs, like ceramic or metal core boards, can handle higher temperatures, but flexible PCBs need lower heat to avoid damage.

Here is a table that shows the recommended temperature settings for different PCB types:

PCB Type

Solder Type

Recommended Solder Wave Temperature

Preheat Temperature Range

Special Considerations

General (Through-hole)

Lead-Based

245°C–255°C

100°C–150°C

Flux applied before preheat; prevents thermal shock and improves wetting

General (Through-hole)

Lead-Free

260°C–270°C

100°C–150°C

Higher temperature due to the lead-free solder properties

FR-4 (Standard)

N/A

Up to 260°C (short duration)

N/A

Common PCB material; tolerates typical soldering temperatures

High-Tg FR-4

N/A

Suitable for lead-free soldering

N/A

Higher glass transition temperature (~170°C–180°C); stable under thermal stress

Ceramic (Alumina, AlN)

N/A

Can endure 300°C+

N/A

High thermal stability; requires precise soldering to avoid cracking

Metal Core (Al, Cu)

N/A

Up to 260°C (short duration)

N/A

High thermal conductivity; careful control needed to avoid mechanical stress due to expansion mismatch

Flexible PCBs (Polyimide, PET)

N/A

Typically <240°C–245°C

N/A

Heat sensitive; risk of warping, delamination; use lower peak temperatures, thermal barriers, gradual heating/cooling

Tip: Always check the temperature display before you start. If the temperature is too high or too low, adjust it to match your PCB and solder type.

Conveyor Speed

You control the conveyor speed to decide how long the PCB touches the solder wave. If you set the speed too fast, the board does not get enough solder. This can cause defects like bridging or weak joints. If you slow down the conveyor, the board stays in the wave longer. This helps the solder fill holes and stick better, but too much heat can damage parts.

You should keep the conveyor speed between 1.5 and 2.5 meters per minute. This range gives the board enough time in the solder wave without overheating. Most boards need about 2 to 4 seconds of contact with the solder wave. If you see defects like bridging or not enough solder, adjust the speed and check the temperature.

  • Speeds between 1.5–2.5 meters per minute work best for most PCBs.

  • Contact time with the solder wave should be 2–4 seconds.

  • Fast speeds can cause defects like bridging and poor solder joints.

  • Slow speeds can overheat components and create too much solder buildup.

  • Watch for defect rates. If you see more than 5% bridging, slow down the conveyor or check other settings.

Note: Adjust conveyor speed along with temperature and preheat settings. This helps you get strong solder joints and fewer defects.

Wave Height

You need to set the wave height so the solder touches all the pins and pads on the PCB. If the wave is too low, some parts will not get soldered. If the wave is too high, solder can spill over and cause shorts or bridges. Use the control panel to adjust the wave height. Run a test board through the machine and watch how the solder covers the parts. Make small changes until you see even coverage.

  • Set the wave height so the solder just reaches the bottom of the PCB.

  • Check for even coverage across the whole board.

  • Avoid setting the wave too high to prevent solder splashes and bridges.

  • Use the test board to check and adjust before starting full production.

Tip: Regularly check the wave height during your shift. Changes in solder level or machine settings can affect coverage.

Flux & Preheat

Flux Application

You need to apply flux to your PCB before Wave Soldering. Flux helps clean the metal surfaces and removes oxidation. This step makes sure the solder sticks well and forms strong joints. You can use several methods to apply flux:

  • Spray fluxing: Spray a fine mist of liquid flux onto the PCB. This method covers all areas evenly and avoids using too much.

  • Foam fluxing: Pass the PCB over a foam head soaked with flux. The foam gently coats the bottom of the board.

  • Selective fluxing: Use a precise applicator or drop jet to target only certain areas. This method works well for boards with sensitive parts.

  • Flux dispensing pens: Use these pens for small touch-ups or repairs. They give you control and reduce waste.

You should always use a controlled amount of flux. Too much can leave sticky residue, while too little can cause poor solder joints. Make sure the flux covers only the areas that need soldering. Proper application ensures the flux cleans the components and prepares them for the solder wave.

Tip: Always check your flux levels and application method before starting a new batch of boards.

PCB Preheating

Preheating your PCB is a key step in Wave Soldering. This process warms up the board and activates the flux. It also helps prevent thermal shock, which can damage parts or cause the board to warp.

Start by ramping up the temperature slowly. A gradual increase, about 4–5°C per second, helps avoid sudden changes that can crack or lift components. Keep the preheat temperature between 120°C and 150°C for lead-free soldering. Use thermocouples or infrared sensors to monitor the temperature. These tools help you keep the heat steady, usually within ±5°C of your target.

You should also use a soak zone. Hold the board at a steady temperature to activate the flux and improve solder flow. After preheating, make sure the board reaches a peak temperature above the solder’s melting point for 30–60 seconds. This step ensures the solder melts and flows well.

Note: Cooling the board slowly after soldering helps prevent defects and keeps your joints strong.

Wave Soldering Process

Wave Soldering Process

Automatic Mode

You can use the automatic mode to make your work easier and more consistent. In this mode, the machine controls the main steps for you. You set the parameters, such as temperature, conveyor speed, and wave height, before you start. The machine then follows these settings for each board. This helps you keep the process steady and reduces mistakes.

Automatic mode also lets you handle large batches of PCBs. You load the boards onto the conveyor, and the machine moves them through each stage. Sensors check the position of each board. If something goes wrong, alarms or lights warn you right away. You can stop the process quickly if you see a problem.

Tip: Always double-check your settings before you start automatic mode. This step helps you avoid defects and wasted boards.

PCB Movement

The movement of the PCB through the machine is very important. The conveyor carries each board at a steady speed. You must make sure the board stays flat and does not shift. If the board tilts or moves too fast, the solder may not cover all the parts.

Here is how the PCB moves through the main stages:

  1. Fluxing: The board passes over the fluxer, which applies a thin layer of flux.

  2. Preheating: The board enters the preheat zone. The heat activates the flux and prepares the board for soldering.

  3. Soldering: The board moves over the solder wave. The molten solder touches the bottom of the board and connects the parts.

  4. Cooling: The board leaves the solder wave and cools down. This step helps the solder joints become strong.

You should watch the conveyor and make sure the boards do not get stuck or jammed. If you see a board move out of place, stop the machine and fix the problem. Good PCB movement helps you get even solder joints and fewer defects.

Soldering Quality

You want every board to have strong and clean solder joints. Good soldering quality depends on your settings and how well you prepare the boards. If you see problems, you need to find the cause and fix it.

Some common soldering defects include:

  • Incomplete solder: This happens when the temperature is too low, the flux is not enough, or the board is dirty.

  • Voids (porosity): These are small holes in the solder caused by oxides, grease, or trapped gas.

  • Excess solder: Too much solder can happen if the lead is too long, the flux is not enough, or the wave height is too high.

  • Solder flag: This is an odd shape on the joint, often caused by low temperature or dirty solder.

You may also see other defects, such as:

Defect

Description

Root Causes

Effect

Solder Bridging

Solder connects two joints by mistake

Too much solder, poor spacing, and bad solder mask

Short circuits

Solder Balling

Small balls of solder on the board

Too much solder, wrong temperature, poor cleaning

Risk of shorts

Cold Solder Joint

Dull, rough solder that does not stick well

Not enough heat, dirty board, bad flux

Weak connection

Lifted Pads/Traces

Pads or traces come off the board

Too much heat, bad materials

Loss of connection

Component Misalignment

Parts not in the right place

Placement errors, board moves during soldering

Bad function or shorts

You can prevent most defects by keeping your machine clean, setting the right temperature, and using enough flux. Watch for signs of trouble, such as solder bridges or cold joints. If you see a problem, check your settings and clean the machine.

Note: Regular checks and good habits help you keep high soldering quality and avoid costly repairs.

Post-Solder Steps

Cooling

You need to cool the PCB after soldering. This keeps the parts and solder joints safe. Cooling slowly helps stop damage from heat changes. If you cool the board too fast, some parts can crack. Ceramic capacitors are easy to break if cooled quickly. The cooling rate should be less than 2°C each second. Let the board cool in the room air. Do not put the PCB in cold cleaning liquid right away. Fast cooling makes the solder joints harden quickly. This stops problems like rough solder or lifted edges. If you cool too slowly, the solder joints can get weak from too much heat. Watch the board as it cools. Change the cooling speed if you see any issues.

Note: Some parts need gentle cooling so they do not crack or break.

Cleaning

Cleaning takes off the flux left on the board. This helps your boards work well. Pick the cleaning method based on the flux type and how many boards you have. If you have a few boards, clean them by hand. Use soft brushes, lint-free wipes, and isopropyl alcohol for no-clean or water-soluble flux. For boards with lots of parts close together, use ultrasonic cleaning. Big groups of boards are best cleaned by machines. Machines give the same results every time.

Cleaning Method

Suitable Flux Type

Cleaning Agents / Tools

Key Notes

Manual Cleaning

No-clean, Water-soluble

Brushes, wipes, IPA, commercial removers, DI water

Good for small jobs; dry boards well after cleaning.

Ultrasonic Cleaning

High-density PCBs

Aqueous cleaners, semi-aqueous solvents

Works for tight spots; use low power to avoid harm.

Automated Cleaning

High-volume production

Spray-in-air, immersion systems

Best for many boards; gives steady cleaning.

Always unplug the power and use ESD safety when cleaning. Aerosol flux removers help shake off dirt and keep the board wet. Use long tubes to spray in small places. Brushes or wipes with cleaner help remove tough spots. Rinse the board and dry it all the way.

Inspection

Inspection checks if the solder joints are good. This makes sure your boards meet the rules. Use a magnifier between 10x and 20x to look at the solder joints. Look for smooth and full solder on the leads and ends. Try to get at least 95% covered. If you see pads, 80% covered is okay. Do not use boards with more than 5% bad spots like holes or missing solder. If the surface is rough or has dross, test it more. Use tests like Dip & Look or Wave Solder Test to check your work.

  1. Check solder joints with a magnifier.

  2. Look for 95% or more coverage on leads and ends.

  3. Pads should have at least 80% coverage.

  4. Do not use boards with over 5% defects.

  5. Use standard tests to make sure the board is good.

Tip: Careful checking helps you find problems early and keep your boards high quality.

Maintenance

Maintenance

Routine Checks

You need to check your machine often. This helps it work well and last longer. Every day, clean the solder pot to get rid of dross. Check and clean the flux system. Put oil on the conveyor parts. Look at the spray nozzles and make sure the flux is at the right level. Each week, check sensors and controls. Look at moving parts for damage. Wipe down the outside of the machine. Once a month, clean the whole machine deeply. Check wires and parts for rust. Look at the logs to see how the machine is working. Make a plan for regular care and write down what you do. Use good solder and flux to keep the machine clean. Always work in a clean space with steady temperature and humidity.

Tip: Write everything in a logbook. This helps you find problems and follow the rules.

Sample Routine Maintenance Table:

Frequency

Tasks

Daily

Clean solder pot, check flux, lubricate conveyor, inspect nozzles

Weekly

Calibrate sensors, inspect parts, and clean the exterior

Monthly

Deep clean, check electricals, review logs

Dross Removal

Dross happens when hot solder touches air. You can stop this by using nitrogen over the solder pot. Keep the right amount of solder in the pot. Leave a thin layer of dross on top to protect the solder. Take off dross slowly and gently. Do not remove too much at once, or you will make more dross. Do not use oils or powders because they hurt solder quality. Some special chemicals help separate dross, but you still need to take it out by hand. Keep the pot as cool as you can. Turn off the wave when you are not using it. Use good solder bars with phosphor to slow down dross.

  • Use nitrogen to make less dross.

  • Leave a thin layer of dross on top.

  • Take off dross slowly and do not over-clean.

  • Do not use oils or powders.

  • Watch the pot temperature and use good solder.

Nozzle Cleaning

You need to clean the solder nozzles often. Dirty nozzles make the solder flow badly and cause problems on your boards. Check the nozzles every day or week. If you see dirt or blockages, clean or change the nozzles right away. Always turn off the power before cleaning. Use the right tools and cleaners so you do not break the nozzles. Cleaning often stops solder from getting dirty and keeps your work fast.

Note: Cleaning the nozzles often helps your machine work better and makes strong solder joints.

Quality Assurance

Visual Inspection

After soldering, you must check each PCB closely. Visual inspection helps you find problems early. Use magnifying glasses or microscopes to see small details. At least 3x magnification lets you spot tiny solder issues. Good lighting is important for seeing defects. Adjustable lights help you see better and cut down on glare. Train yourself and your team to notice and sort defects. Mix manual checks with automated systems like AOI to work faster and better. Endoscopic tools help you look at hidden or tight solder joints. Make clear rules for inspection and do visual checks often.

  • Use magnifying tools to look closely.

  • Use good lights to see better.

  • Mix manual and automated checks.

  • Teach people to spot defects.

  • Use endoscopic tools for hidden spots.

  • Set clear rules for inspection.

Tip: Checking boards often helps you find problems before they get worse.

Defect Testing

Some defects are hard to see, so you need special tests. These tests help you find problems inside the PCB. X-ray inspection lets you look inside and find things like voids or cold solder joints. Acoustic microscopy finds layers that have come apart. Thermal imaging shows heat patterns that can reveal hidden faults. AOI works well for surface problems, but cannot find inside issues. Using more than one test gives you better results.

Testing Method

What It Finds

Notes on Hidden Defect Detection

Automated Optical Inspection (AOI)

Finds surface solder problems like not enough solder, misplaced parts, and solder bridges

Good for surface problems; not good for hidden ones

X-ray Inspection

Finds inside problems like voids, cold solder joints, and hidden solder bridges

The best way to find hidden problems, especially in complex boards

Functional Testing

Checks if the PCB works correctly

Can show problems, but not exactly where they are inside

Acoustic Microscopy

Finds layers that have come apart and inside structure problems

Good for inside problems like delamination

Thermal Imaging (Infrared Thermography)

Shows heat patterns that point to problems

Helps find hidden problems by looking at heat patterns

Note: Use more than one test to find all the problems.

Documentation

You need to keep good records to track quality and care. Write down every inspection and test result. Record things like solder pot temperature, preheat temperature, and flux density every two hours. Check ten random boards each hour and write down how their solder joints look. Store finished boards in a separate place so they do not get damaged. Follow these steps to keep strong records:

  1. Watch how the equipment works and check solder joints.

  2. Stop the machine and check if you see something wrong.

  3. Write down what you see and the solder joint quality right away.

  4. Log process details every two hours.

  5. Check ten random boards each hour and record results.

  6. Store finished PCBs in a safe area.

  7. Keep logs for daily, weekly, and monthly care.

  8. Write down training and quality control work.

Keeping good records helps you see patterns, fix problems, and follow industry rules.

Tips

Best Practices

You can improve your results by following some best practices. Always check your machine before you start. Clean the solder pot and nozzles every day. Use the right amount of flux for each board. Keep your workspace neat and free from clutter. Store your solder and flux in a dry place. Set the conveyor speed and temperature for each type of board. Watch the boards as they move through the machine. Write down your settings and any changes you make.

  • Wear safety gear every time you work.

  • Use a test board to check your setup before full production.

  • Keep a logbook for maintenance and problems.

  • Train new team members on safety and machine use.

  • Replace worn parts as soon as you notice them.

Tip: Small changes in temperature or speed can make a big difference in solder quality.

Troubleshooting

You may face problems during soldering. Use this table to help you find and fix common issues:

Problem

Possible Cause

Solution

Solder bridges

Wave too high

Lower the wave height

Cold joints

Low temperature

Raise the solder temperature

Poor wetting

Dirty board

Clean the PCB

Solder balls

Too much flux

Reduce the flux amount

Component shift

Conveyor too fast

Slow down the conveyor

If you see a defect, stop the machine and check your settings. Clean the machine if you notice buildup. Adjust the conveyor or temperature if you see repeated problems. Always test a board after making changes.

Note: Careful observation and quick action help you keep your process running smoothly.

You can use a wave soldering machine safely if you follow each step. Always put on safety gear before you start. Check your machine to make sure it is ready. Clean and look at your equipment often. Write down your settings and what happens each time. Doing regular checks helps you stop problems before they start. Try new ideas to make your work better and save time. Always pay attention and follow safety rules when using Wave Soldering.

FAQ

How often should you clean the solder pot?

You should clean the solder pot every day. This keeps the solder pure and helps you avoid defects. If you see dross building up, remove it right away. Clean tools work best and help your boards stay strong.

What safety gear do you need for wave soldering?

You need safety glasses, heat-resistant gloves, and long sleeves. Closed shoes protect your feet. Use a mask if you work with strong flux fumes. Always keep a first aid kit nearby for burns or small injuries.

Can you use wave soldering for surface-mount components?

You can use wave soldering for some surface-mount parts. Glue the parts to the board first. This method works best for simple or mixed-technology boards. For high-density SMT, reflow soldering gives better results.

Why does solder bridging happen?

Solder bridging happens when too much solder connects two pins. High wave height, slow conveyor speed, or poor board design can cause this. You can fix it by lowering the wave or adjusting the speed.

 

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